MAXIM MAX4649EKA

MAX4649EKA
Rev. A
RELIABILITY REPORT
FOR
MAX4649EKA
PLASTIC ENCAPSULATED DEVICES
August 20, 2002
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX4649 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX4649 is a dual-supply, single-pole/double-throw (SPDT) analog switch. On-resistance is 45 max and flat (7
max) over the specified signal range. The MAX4649 can handle Rail-to-Rail® analog signals, and conducts analog or
digital signals equally well in either direction. This switch operates from a single +9V to +36V supply, or from ±4.5V
to ±20V dual supplies. The primary application areas are in the switching and routing of signals in
telecommunications and test equipment.
The MAX4649 features a switch transition time of 130ns max at +25°C, and a guaranteed break-before-make
switching time of 5ns. Off-leakage current is only 2nA max at +25°C.
The MAX4649 is available in a tiny 8-pin SOT23 package.
B. Absolute Maximum Ratings
Item
V+
VV+ to VAll Other Pins (Note 1)
Continuous Current into any Terminal
Continuous Current (COM, NO, NC)
Peak Current (COM, NO, NC) (pulsed at 1ms, 10% duty cycle)
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
8-Pin SOT23
Derates above +70°C
8-Pin SOT23
Rating
-0.3V to +44.0V
-44.0V to +0.3V
-0.3V to +44.0V
(V- - 0.3V) to (V+ + 0.3V)
±10mA
±30mA
±60mA
-40°C to +85°C
-65°C to +150°C
+150°C
+300°C
714mW
8.9mW/°C
Note 1: Signals on NO, NC, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward-diode
current to maximum current rating.
II. Manufacturing Information
A. Description/Function:
Octal 8-Bit Serial DAC with Output Buffer
B. Process:
SG5 (Standard 5 micron silicon gate CMOS)
C. Number of Device Transistors:
33
D. Fabrication Location:
Oregon, USA
E. Assembly Location:
Malaysia
F. Date of Initial Production:
January, 2001
III. Packaging Information
A. Package Type:
8-Pin SOT23
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-1201-0218
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
57 x 43 mils
B. Passivation:
SiN/SiO (nitride/oxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
5 microns (as drawn)
F. Minimum Metal Spacing:
5 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: : Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 100 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate
(λ) is calculated as follows:
λ=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 80 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 13.57 x 10-9
λ = 13.57 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5703) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1I).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The AH58 die type has been found to have all pins able to withstand a transient pulse of ± 400V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±100mA and/or ±20V.
Table 1
Reliability Evaluation Test Results
MAX4649EKA
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
PACKAGE
DC Parameters
& functionality
SAMPLE
SIZE
NUMBER OF
FAILURES
80
0
77
0
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 96hrs.
DC Parameters
& functionality
SOT
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
DC Parameters
77
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic Package/Process data
0
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
Table 1
Reliability Evaluation Test Results
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
Mil Std 883D
Method 3015.7
Notice 8
TERMINAL D
R = 1.5kΩ
Ω
C = 100pf
CURRENT
PROBE
(NOTE 6)
ONCE PER SOCKET
ONCE PER BOARD
100 OHMS
300 uA
+ 15 VOLTS
2 mA
- 10 VOLTS
2 mA
1
COM
NO
8
100 OHMS
VSS
7
G
IN
6
V
N/C 5
2
NC
3
4
+ 10 VOLTS
300 uA
- 15 VOLTS
10K OHMS
8 PIN
SOT
DEVICES : MAX 4649
MAX. EXPECTED CURRENT= (+/- 15V) 300 uA; (+/- 10V) 2 mA
DOCUMENT I.D. 06-5703
REVISION A
MAXIM
TITLE: BI
DRAWN BY: CHRIS JAMBARO
NOTES:
Circuit (MAX 4649)
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