MAX1287EKA Rev. A RELIABILITY REPORT FOR MAX1287EKA PLASTIC ENCAPSULATED DEVICES February 1, 2004 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX1287 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information V. ........Quality Assurance Information VI. .......Reliability Evaluation IV. .......Die Information .....Attachments I. Device Description A. General The MAX1287 is a low-cost, micropower, serial output 12-bit analog-to-digital converter (ADC) available in a tiny 8-pin SOT23. The MAX1287 operates with a single +3V supply. The devices feature a successive-approximation ADC, automatic shutdown, fast wakeup (1.4µs), and a high-speed 3-wire interface. Power consumption is only 0.5mW (V DD = +2.7V) at the maximum sampling rate of 150ksps. AutoShutdown™ (0.2µA) between conversions results in reduced power consumption at slower throughput rates. The MAX1287 provides 2-channel, single-ended operations and accept input signals from 0 to VREF. Data is accessed using an external clock through the 3-wire SPI™/QSPI™/MICROWIRE™-compatible serial interface. Excellent dynamic performance, low power, ease of use, and small package size make these converters ideal for portable battery-powered data-acquisition applications, and for other applications that demand low power consumption and minimal space. B. Absolute Maximum Ratings Item Rating VDD to GND CNVST, SCLK, DOUT to GND REF, AIN1 (AIN+), AIN2 (AIN-) to GND Maximum Current into Any Pin -0.3V to +6V -0.3V to (VDD + 0.3V) -0.3V to (VDD + 0.3V) 50mA Operating Temperature Range Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70°C) 8-Pin SOT Derates above +70°C 8-Pin SOT -40°C to +85°C -60°C to +150°C +300°C 696mW 9.7mW/°C II. Manufacturing Information A. Description/Function: 150ksps, 12-Bit, 2-Channel Single-Ended ADCs in SOT23 B. Process: S6 (Standard 0.6 micron silicon gate CMOS) C. Number of Device Transistors: 6922 D. Fabrication Location: California, USA E. Assembly Location: Malaysia F. Date of Initial Production: October, 2001 III. Packaging Information A. Package Type: 8-Pin SOT B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: N/A E. Bondwire: 6 mil dia. ball F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-2101-0032 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-112: Level 1 IV. Die Information A. Dimensions: 90 x 45 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 0.6 microns (as drawn) F. Minimum Metal Spacing: 0.6 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: B. Outgoing Inspection Level: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Executive Director) Kenneth Huening (Vice President) 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 320 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV λ = 3.39 x 10-9 λ = 3.39 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5676) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85°C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The AC13 die type has been found to have all pins able to withstand a transient pulse of ±1000V per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±200mA. Table 1 Reliability Evaluation Test Results MAX1287EKA TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION PACKAGE DC Parameters & functionality SAMPLE SIZE NUMBER OF FAILURES 320 0 77 0 0 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality SOT 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 DC Parameters 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data 0 Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B TERMINAL D Mil Std 883D Method 3015.7 Notice 8 R = 1.5kΩ C = 100pf CURRENT PROBE (NOTE 6) ONCE PER SOCKET ONCE PER BOARD 10 OHMS 10K 0.1uF 1 2 DEVICES : MAX 1086-89 MAX 1286-89 MAX. EXPECTED CURRENT DOCUMENT I.D. 06-5676 8 8-SOT 3 6 4 5 DRAWN BY: HAK TAN NOTES: = 1mA REVISION A +5V 1mA 7 MAXIM TITLE: 883 BI Circuit (MAX 1086-89/1286-89) PAGE 2 OF 3