INTEGRATED CIRCUITS DATA SHEET TDA7052 1 W BTL mono audio amplifier Product specification File under Integrated Circuits, IC01 July 1994 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 GENERAL DESCRIPTION The TDA7052 is a mono output amplifier in a 8-lead dual-in-line (DIL) plastic package. The device is designed for battery-fed portable audio applications. Features: • No external components • No switch-on or switch-off clicks • Good overall stability • Low power consumption • No external heatsink required • Short-circuit proof QUICK REFERENCE DATA SYMBOL PARAMETER VP Supply voltage range Itot Total quiescent current Gv Voltage gain Po THD CONDITIONS TYP. MAX. UNIT 3 6 18 V RL = ∞ − 4 8 mA 38 39 40 dB Output power THD = 10%; 8 Ω − 1,2 − W Total harmonic distortion Po = 0,1 W − 0,2 1,0 % PACKAGE OUTLINE 8-lead DIL; plastic (SOT97); SOT97-1; 1996 August 21. July 1994 MIN. 2 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 Fig.1 Block diagram. PINNING 1 VP supply voltage 5 OUT1 output1 2 IN input 6 GND2 ground (substrate) 3 GND1 ground (signal) 7 n.c. not connected 4 n.c. not connected 8 OUT2 output2 July 1994 3 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 FUNCTIONAL DESCRIPTION The TDA7052 is a mono output amplifier designed for battery-fed portable audio applications, such as tape recorders and radios. The gain is fixed internally at 40 dB. A large number of tape recorders and radios are still designed for mono sound, plus a space-saving trend by reduction of the number of battery cells. This means a decrease in supply voltage which results in an reduction of output power. To compensate for this reduction, the TDA7052 uses the Bridge-Tied-Load principle (BTL) which can deliver an output power of 1,2 W (THD = 10%) into an 8 Ω load with a power supply of 6 V. The load can be short-circuited at each signal excursion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER MIN. MAX. UNIT VP Supply voltage − 18 V IOSM Non-repetitive peak output current − 1,5 A Ptot Total power dissipation Tc Crystal temperature − 150 °C Tstg Storage temperature range −55 +150 °C see Fig. 2 Fig.2 Power derating curve. POWER DISSIPATION Assume VP = 6 V; RL = 8 Ω; Tamb = 50 °C maximum. The maximum sinewave dissipation is 0,9 W. 150 – 50 R th j-a = ---------------------- ≈ 110 K/W. 0, 9 Where Rth j-a of the package is 110 K/W, so no external heatsink is required. July 1994 4 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 CHARACTERISTICS VP = 6 V; RL = 8 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Supply voltage range Itot Total quiscent current 3 6 18 V − 4 8 mA Gv Voltage gain 38 39 40 dB THD = 10% − 1,2 − W Vno(rms) note 1 − 150 300 µV Vno(rms) note 2 − 60 − µV − 20 Hz to − Hz 50 − dB Po Output power RL = ∞ Noise output voltage (RMS value) fr Frequency response SVRR Supply voltage ripple rejection 20 kHz note 3 40 DC output offset voltage ∆V5-8 RS = 5 k Ω − − 100 mV PO = 0,1 W − 0,2 1,0 % Input impedance − 100 − kΩ Input bias current − 100 300 nA pin 5 to 8 THD Total harmonic distortion ZI Ibias Notes to the characteristics 1. The unweighted RMS noise output voltage is measured at a bandwidth of 60 Hz to 15 kHz with a source impedance (RS) of 5 kΩ. 2. The RMS noise output voltage is measured at a bandwidth of 5 kHz with a source impedance of 0 Ω and a frequency of 500 kHz. With a practical load (R = 8 Ω; L = 200 µH) the noise output current is only 100 nA. 3. Ripple rejection is measured at the output with a source impedance of 0 Ω and a frequency between 100 Hz and 10 kHz. The ripple voltage = 200 mV (RMS value) is applied to the positive supply rail. July 1994 5 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 Fig.3 Application diagram. July 1994 6 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN July 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 7 Philips Semiconductors Product specification 1 W BTL mono audio amplifier TDA7052 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 8