SURFACE MOUNT CHIP LED LAMPS Model No. LEM-51321T FEATURES: ※Ultra compact (3.2×1.6×1.1) ※Compatible with automatic placement equipment ※Compatible with reflow solder process APPLICATION: ※ Indicators on printed circuit boards ※ LCD Back-lights ※ Illuminations ※ Automotive-Telecommunication Emitted Color Material Wavelength (nm) Lens Color Yellow Green GaP 570 Water Clear ABSOLUTE MAXIMUM RATINGS (Ta = 25℃) CHARACTERISTIC Power dissipation Forward direct current Peak forward current Reverse voltage Operating temperature Storage temperature SYMBOL Pm IFm IFp VRm Topr Tstg RATING 68 30 100 5 -30 to +80 -40 to +85 UNIT mW mA mA V ℃ ℃ ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25℃) CHARACTERISTIC Luminous intensity Forward voltage Reverse current Peak emission wavelength Dominant wavelength Viewing angle SYMBOL Iv VF IR λP λD 2θ1/2 CONDITION IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA Min. 6.0 Typ. 15 2.3 568 570 140 Max. 2.7 10 UNIT mcd V µA nm nm deg. PACKAGE DIMENSIONS OF DEVICE Recommended Soldering Pattern for Reflow Soldering Note: 1. All dimensions are in millimeters. 2. Tolerance is ±0.25mm unless otherwise specified. Letex Technology Corp.