BSI Very Low Power/Voltage CMOS SRAM 1M X 16 bit (Dual CE Pins) BS616LV1611 FEATURES • Wide Vcc operation voltage : 2.4~5.5V • Very low power consumption : Vcc = 3.0V C-grade: 45mA (@55ns) operating current I -grade: 46mA (@55ns) operating current C-grade: 36mA (@70ns) operating current I -grade: 37mA (@70ns) operating current 3.0uA (Typ.) CMOS standby current Vcc = 5.0V C-grade: 113mA (@55ns) operating current I -grade: 115mA (@55ns) operating current C-grade: 90mA (@70ns) operating current I -grade: 92mA (@70ns) operating current 15uA (Typ.) CMOS standby current • High speed access time : -55 55ns -70 70ns • Automatic power down when chip is deselected • Three state outputs and TTL compatible • Fully static operation • Data retention supply voltage as low as 1.5V • Easy expansion with CE2,CE1 and OE options • I/O Configuration x8/x16 selectable by LB and UB pin DESCRIPTION The BS616LV1611 is a high performance, very low power CMOS Static Random Access Memory organized as 1,048,576 words by 16 bits and operates from a wide range of 2.4V to 5.5V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 3.0uA at 3V/25oC and maximum access time of 55ns at 3.0V/85oC. Easy memory expansion is provided by an active LOW chip enable(CE1) , active HIGH chip enable (CE2), active LOW output enable(OE) and three-state output drivers. The BS616LV1611 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS616LV1611 is available in 48-pin BGA package. PRODUCT FAMILY OPERATING TEMPERATURE PRODUCT FAMILY Vcc RANGE POWER DISSIPATION STANDBY Operating SPEED (ns) 55ns : 3.0~5.5V 70ns : 2.7~5.5V (ICCSB1, Max) Vcc=3V PKG TYPE (ICC, Max) Vcc=5V Vcc=3V Vcc=5V 70ns 70ns BS616LV1611FC +0 O C to +70 O C 2.4V ~ 5.5V 55 / 70 10uA 110uA 36mA 90mA BGA-48-0912 BS616LV1611FI -40 O C to +85 O C 2.4V ~ 5.5V 55 / 70 20uA 220uA 37mA 92mA BGA-48-0912 PIN CONFIGURATIONS A BLOCK DIAGRAM 1 2 3 4 5 6 LB OE A0 A1 A2 CE2 B D8 UB A3 A4 CE1 D0 C D9 D10 A5 A6 D1 D2 D E VSS VCC D11 A17 NC D12 A7 A16 D3 D4 A4 A3 A2 A1 Address A0 A17 A16 A15 A14 A13 A12 Input Buffer D14 D13 A14 A15 D5 D0 VCC . . . . VSS D6 G D15 A19 . A12 A13 WE D7 H A 18 A8 A9 A10 A11 NC 2048 Row Memory Array Decoder 2048 x 8192 8192 16 . . . . Data Input Buffer 16 Column I/O Write Driver Sense Amp 16 Data Output Buffer D15 F 22 512 16 Column Decoder CE2 CE1 18 WE OE UB LB Control Address Input Buffer A11 A10 A9 A8 A7 A6 A5 A18 A19 Vcc Vss 48-Ball CSP top View Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice. R0201-BS616LV1611 1 Revision 2.1 Jan. 2004 BSI BS616LV1611 PIN DESCRIPTIONS Name Function A0-A19 Address Input These 20 address inputs select one of the 1,048,576 x 16-bit words in the RAM. CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. LB and UB Data Byte Control Input Lower byte and upper byte data input/output control pins. D0 - D15 Data Input/Output Ports These 16 bi-directional ports are used to read data from or write data into the RAM. Vcc Power Supply Vss Ground TRUTH TABLE MODE Not selected (Power Down) Output Disabled Read CE1 H CE2 WE OE LB UB D0~D7 D8~D15 X X X X X High Z High Z ICCSB , I CCSB1 X L X X X X High Z High Z ICCSB , I CCSB1 L H H H X X High Z High Z ICC L L Dout Dout ICC H L High Z Dout ICC L H Dout High Z ICC L L Din Din ICC L Write H L ABSOLUTE MAXIMUM SYMBOL H H L L X H L X Din ICC L H Din X ICC OPERATING RANGE RATINGS(1) PARAMETER with RATING -0.5 to Vcc+0.5 Vcc CURRENT UNITS VTERM Terminal Voltage Respect to GND TBIAS Temperature Under Bias -40 to +85 O TSTG Storage Temperature -60 to +150 O PT Power Dissipation 1.0 W IOUT DC Output Current 20 mA V C RANGE AMBIENT TEMPERATURE Vcc Commercial 0 O C to +70O C 2.4V ~ 5.5V Industrial C O O -40 C to +85 C 2.4V ~ 5.5V CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz) SYMBOL PARAMETER CONDITIONS MAX. UNIT Input CIN VIN=0V 10 pF 1. Stresses greater than those listed under ABSOLUTE MAXIMUM Capacitance RATINGS may cause permanent damage to the device. This is a Input/Output CDQ VI/O=0V 12 pF stress rating only and functional operation of the device at these Capacitance or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute 1. This parameter is guaranteed and not 100% tested. maximum rating conditions for extended periods may affect reliability. R0201-BS616LV1611 2 Revision 2.1 Jan. 2004 BSI BS616LV1611 DC ELECTRICAL CHARACTERISTICS ( TA = -40 to + 85oC ) PARAMETER NAME PARAMETER VIL Guaranteed Input Low Voltage(3) VIH Guaranteed Input High Voltage(3) IIL Input Leakage Current ILO VOL VOH TEST CONDITIONS ICC ICCSB (5) ICCSB1 -0.5 -0.5 (1) MAX. -- UNITS 2.0 2.2 ---- 0.8 0.8 Vcc+0.3 Vcc+0.3 Vcc = Max, VIN = 0V to Vcc -- -- 1 uA Output Leakage Current Vcc = Max, CE1 = VIH , or CE2 = V iL , or OE = VIH, VI/O = 0V to Vcc -- -- 1 uA Output Low Voltage Vcc = Max, IOL= 2mA Vcc=3V Vcc=5V Vcc = Min, IOH= -1mA Vcc=3V Vcc=5V --2.4 2.4 ----- 0.4 0.4 --- 70ns Vcc=3V -- -- 37 70ns Vcc=5V -- -- 92 Vcc=3V Vcc=5V Vcc=3V Vcc=5V Output High Voltage (4) MIN. TYP. Operating Power Supply Current CE1 = VIL and CE2 = VIH , IDQ = 0mA, F = Fmax(2) Standby Current-TTL CE1 = VIH or CE2 = VIL , IDQ = 0mA Vcc=3V -- -- 1.3 Vcc=5V -- -- 2.5 CE1≧ Vcc-0.2V or CE2≦ 0.2V ;VIN≧ Vcc - 0.2V or VIN≦ 0.2V Vcc=3V -- 3 20 Standby Current-CMOS Vcc=5V -- 15 220 V V V V mA mA uA 1. Typical characteristics are at TA = 25oC. 2. Fmax = 1/tRC . 3. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 4. Icc_Max. is 46mA(@3.0V) / 115mA(@5.0V) under 55ns operation. 5.IccsB1 is 10uA/110uA at Vcc=3.0V/5.0V and TA=70oC. DATA RETENTION CHARACTERISTICS ( TA = -40 to + 85oC ) SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. (1) MAX. UNITS Vcc for Data Retention CE1 ≧ Vcc - 0.2V or CE2≦0.2V, VIN ≧ Vcc - 0.2V or VIN ≦ 0.2V 1.5 -- -- V ICCDR Data Retention Current CE1 ≧ Vcc - 0.2V or CE2≦0.2V, VIN ≧ Vcc - 0.2V or VIN ≦ 0.2V -- 1.5 5.0 uA tCDR Chip Deselect to Data Retention Time -- -- ns -- -- ns VDR (3) tR See Retention Waveform Operation Recovery Time 0 TRC (2) 1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time 3. IccDR(Max.) is 2.5uA at TA=70OC. LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled ) Data Retention Mode Vcc VDR ≥ 1.5V Vcc CE1 Vcc tR t CDR CE1≥ Vcc - 0.2V VIH VIH LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled ) Data Retention Mode Vcc VDR ≧ 1.5V Vcc CE2 R0201-BS616LV1611 VIL Vcc tR t CDR CE2 ≦ 0.2V 3 VIL Revision 2.1 Jan. 2004 BSI BS616LV1611 KEY TO SWITCHING WAVEFORMS AC TEST CONDITIONS (Test Load and Input/Output Reference) Input Pulse Levels Vcc / 0V Input Rise and Fall Times WAVEFORM INPUTS OUTPUTS 1V/ns MUST BE STEADY MUST BE STEADY Input and Output Timing Reference Level 0.5Vcc MAY CHANGE FROM H TO L WILL BE CHANGE FROM H TO L Output Load CL = 30pF+1TTL CL = 100pF+1TTL MAY CHANGE FROM L TO H WILL BE CHANGE FROM L TO H , DON T CARE: ANY CHANGE PERMITTED CHANGE : STATE UNKNOWN DOES NOT APPLY CENTER LINE IS HIGH IMPEDANCE ”OFF ”STATE AC ELECTRICAL CHARACTERISTICS ( TA = -40 to + 85oC ) READ CYCLE JEDEC PARAMETER PARAMETER NAME NAME CYCLE TIME : 70ns CYCLE TIME : 55ns DESCRIPTION Vcc = 2.7~5.5V Vcc = 3.0~5.5V MIN. TYP. MAX. MIN. TYP. MAX. UNIT tAVAX tAVQV tELQV tRC tAA t ACS1 Read Cycle Time 70 -- -- 55 -- -- ns Address Access Time -- -- 70 -- -- 55 ns Chip Select Access Time (CE1) -- -- 70 -- -- 55 ns tELQV tBA t ACS2 tBA (1) Chip Select Access Time (CE2) -- -- 70 -- -- 55 ns (LB,UB) -- -- 35 -- -- 30 ns tGLQV tELQX tBE tGLQX tOE tCLZ tBE tOLZ Output Enable to Output Valid -- -- 35 -- -- 30 ns (CE2,CE1) 10 -- -- 10 -- -- ns 5 -- -- 5 -- -- ns Output Enable to Output in Low Z 5 -- -- 5 -- -- ns tEHQZ tBDO tCHZ tBDO Chip Deselect to Output in High Z (CE2,CE1) -- -- 35 -- -- 30 ns Data Byte Control to Output High Z (LB,UB) -- -- 35 -- -- 30 ns tGHQZ tOHZ Output Disable to Output in High Z -- -- 30 -- -- 25 ns tAXOX tOH Data Hold from Address Change 10 -- -- 10 -- -- ns Data Byte Control Access Time Chip Select to Output Low Z Data Byte Control to Output Low Z (LB,UB) NOTE : 1. tBA is 35ns/30ns (@speed=70ns/55ns) with address toggle . tBA is 70ns/55ns (@speed=70ns/55ns) without address toggle . R0201-BS616LV1611 4 Revision 2.1 Jan. 2004 BSI BS616LV1611 SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t RC ADDRESS t t AA t ACS2 t ACS1 t OH OH D OUT READ CYCLE2 (1,3,4) CE2 CE1 t t CHZ(5) (5) CLZ D OUT READ CYCLE3 (1,4) t RC ADDRESS t AA OE t CE2 t t CE1 t t t OE OH ACS2 OLZ t ACS1 (5) CLZ OHZ (5) (1,5) t CHZ t BDO LB,UB t BE t BA D OUT NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE1 transition low. 4. OE = VIL . 5. The parameter is guaranteed but not 100% tested. R0201-BS616LV1611 5 Revision 2.1 Jan. 2004 BSI BS616LV1611 AC ELECTRICAL CHARACTERISTICS ( TA = -40 to + WRITE CYCLE JEDEC PARAMETER PARAMETER NAME NAME t AVAX t E1LWH t AVWL t AVWH t WLWH t WHAX t BW t WLQZ t DVWH t WHDX t GHQZ t WC t CW t AS t AW t WP t WR t BW (1) t WHZ t DW t DH t OHZ t WHOX t OW 85oC ) CYCLE TIME : 70ns CYCLE TIME : 55ns DESCRIPTION Vcc = 3.0~5.5V Vcc = 2.7~5.5V MIN. TYP. MAX. MIN. TYP. MAX. UNIT Write Cycle Time 70 -- -- 55 -- -- ns Chip Select to End of Write 55 -- -- ns 70 -- -- Address Setup Time 0 -- -- 0 -- -- ns Address Valid to End of Write 70 -- -- 55 -- -- ns Write Pulse Width 35 -- -- 30 -- -- ns 0 -- -- 0 -- -- ns Date Byte Control to End of Write (LB,UB) (CE2,CE1,WE) 30 -- -- 25 -- -- ns Write to Output in High Z -- -- 30 -- -- 25 ns Data to Write Time Overlap 30 -- -- 25 -- -- ns Data Hold from Write Time 0 -- -- 0 -- -- ns Output Disable to Output in High Z -- -- 30 -- -- 25 ns End of Write to Output Active 5 -- -- 5 -- -- ns Write recovery Time NOTE : 1. tBW is 30ns/25ns (@speed=70ns/55ns) with address toggle. ; tBW is 70ns/55ns (@speed=70ns/55ns) without address toggle. SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t WC ADDRESS (3) t WR OE CE2 (5) (11) t CW (5) CE1 t BW (5) LB,UB t AW WE (3) t WP t AS (2) (4,10) t OHZ D OUT t DH t DW D IN R0201-BS616LV1611 6 Revision 2.1 Jan. 2004 BSI BS616LV1611 WRITE CYCLE2 (1,6) t WC ADDRESS CE2 (11) t (5) CE1 t BW (5) LB,UB t WE CW AW t WR t WP (3) (2) t AS (4,10) t WHZ D OUT t OW t DH (7) (8) t DW (8,9) D IN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE2 going low, or CE1 or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE2 high transition or CE1 low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE2 is high or CE1 is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE2 going high or CE1 going low to the end of write. R0201-BS616LV1611 7 Revision 2.1 Jan. 2004 BSI BS616LV1611 ORDERING INFORMATION BS616LV1611 X X Z YY SPEED 55: 55ns 70: 70ns PKG MATERIAL -: Normal G: Green P: Pb free GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE F :BGA-48-0912 Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. 1.4 Max. 0.25± 0.05 PACKAGE DIMENSIONS NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. SIDE VIEW D 0.1 3.375 D1 N D E D1 E1 e 48 12.0 9.0 5.25 3.75 0.75 E1 2.625 E ± 0.1 e SOLDER BALL 0.35±0.05 VIEW A 48 mini-BGA (9mm x 12mm) R0201-BS616LV1611 8 Revision 2.1 Jan. 2004