DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D186 BSR62 PNP Darlington transistor Product data sheet Supersedes data of 1999 Apr 26 2004 Nov 11 NXP Semiconductors Product data sheet PNP Darlington transistor BSR62 FEATURES PINNING • High current (max. 1 A) PIN • Low voltage (max. 80 V) 1 base • Integrated diode and resistor. 2 collector 3 emitter DESCRIPTION APPLICATIONS • Industrial applications such as: handbook, halfpage – Print hammer – Solenoid 1 – Relay and lamp driving. 2 2 1 3 DESCRIPTION 3 MAM306 PNP Darlington transistor in a TO-92; SOT54 plastic package. NPN complement: BSR52. Fig.1 Simplified outline (TO-92; SOT54) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BSR62 SC-43A DESCRIPTION VERSION plastic single-ended leaded (through hole) package; 3 leads SOT54 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − −90 V VCES collector-emitter voltage VBE = 0 V − −80 V VEBO emitter-base voltage open collector − −5 V IC collector current (DC) − −1 A ICM peak collector current − −2 A IB base current (DC) − −0.2 A Ptot total power dissipation − 830 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb ambient temperature −65 +150 °C Tamb ≤ 25 °C; note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. 2004 Nov 11 2 NXP Semiconductors Product data sheet PNP Darlington transistor BSR62 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient note 1 VALUE UNIT 150 K/W Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT − − −50 nA − − −50 nA IC = −150 mA 1 000 − − IC = −500 mA 2 000 − − IC = −0.5 A; IB = −0.5 mA − − −1.4 V IC = −1 A; IB = −4 mA − − −1.8 V − − −2 V IC = −1 A; IB = −4 mA − − −2.4 V VCE = −5 V; IC = −500 mA; f = 100 MHz − 200 − MHz − − 0.5 μs − − 0.7 μs ICES collector-emitter cut-off current VBE = 0 V; VCE = −80 V IEBO emitter-base cut-off current VEB = −4 V; IC = 0 A hFE DC current gain VCE = −10 V; see Fig.2 VCEsat collector-emitter saturation voltage VBEsat base-emitter saturation voltage IC = −0.5 A; IB = −0.5 mA fT transition frequency MIN. Switching times (between 10% and 90% levels); see Fig.3 ton turn-on time toff turn-off time 2004 Nov 11 ICon = −500 mA; IBon = −0.5 mA; IBoff = 0.5 mA 3 NXP Semiconductors Product data sheet PNP Darlington transistor BSR62 MGD839 6000 handbook, full pagewidth hFE 5000 4000 3000 2000 1000 0 −10−1 −1 −10 −102 VCE = −10 V. Fig.2 DC current gain; typical values. VBB handbook, full pagewidth RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω R2 Vi DUT R1 MGD624 Vi = −10 V; T = 200 μs; tp = 6 μs; tr = tf ≤ 3 ns. R1 = 56 Ω; R2 = 10 kΩ; RB = 10 kΩ; RC = 18 Ω. VBB = 1.8 V; VCC = −10.7 V. Oscilloscope: input impedance Zi = 50 Ω. Fig.3 Test circuit for switching times. 2004 Nov 11 4 oscilloscope IC (mA) −103 NXP Semiconductors Product data sheet PNP Darlington transistor BSR62 PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.38 4.8 4.4 1.7 1.4 4.2 3.6 e 2.54 e1 L L1(1) 1.27 14.5 12.7 2.5 max. Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 2004 Nov 11 REFERENCES IEC JEDEC JEITA TO-92 SC-43A 5 EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16 NXP Semiconductors Product data sheet PNP Darlington transistor BSR62 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. 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Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to 2004 Nov 11 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/05/pp7 Date of release: 2004 Nov 11 Document order number: 9397 750 13602