P/N 1111841-X 0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adapter FEATURES •A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. •Available on 0.300 [7.62] centers. GENERAL SPECIFICATIONS •BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides •PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290 •OPERATING TEMPERATURE: 221ºF [105ºC] MOUNTING CONSIDERATIONS CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ORDERING INFORMATION 1111841-8 = 8-Pin 1111841-8-P = Panelized Version CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18067 Rev. AA