Product Bulletin Open Mode Surface Mount Ceramic Chip Capacitors – X7R Dielectric Outline Drawing L W TIN PLATE T B NICKEL PLATE S ELECTRODES CONDUCTIVE METALLIZATION Dimensions – Millimeters (Inches) EIA Size Code Metric Size Code L Length W Width B Bandwidth S Separation 0805 2012 2.0 (.079) ± 0.2 (.008) 1.25 (.049) ± 0.2 (.008) 0.05 (.02) ± 0.25 (.010) 0.75 (.030) 1206 3216 3.2 (.126) ± 0.2 (.008) 1.6 (.063) ± 0.2 (.008) 0.05 (.02) ± 0.25 (.010) N/A 1210 3225 3.2 (.126) ± 0.2 (.008) 2.5 (.098) ± 0.2 (.008) 0.05 (.02) ± 0.25 (.010) N/A See below for thickness dimension. Capacitance Value Capacitance Values (µF) .047 .068 0.22 0.33 1.0 KEMET Part Number C0805F473_1RAC C0805F683_1RAC C1206F224_1RAC C1206F334_1RAC C1210F105_1RAC Voltage *Capacitance Tolerance Thickness mm Qty 7” Reel Qty 13” Reel 100 100 100 100 100 K, M K, M K, M K, M K, M 1.0 (.039) ± 0.10 (.004) 2,500 2,500 2,500 2,000 1,500 10,000 10,000 10,000 8,000 8,000 1.25 (.049) ± 0.15 (.006) 1.0 (.039) ± 0.10 (.004) 1.6 (.063) ± 0.15 (.006) 2.5 (.098) ± 0.20 (.008) F9121C 9/06 Ordering Information C 0805 F 473 K 1 R A C Style C - Ceramic Size Code 0805, 1206, 1210 Specification F - Open-Mode Capacitance Code, pF First two digits represent significant figures. Third digit specifies number of zeros. 100 pF = 101. (Use “9” for 1.0 through 9.9 pF) (Use “8” for 0.1 through .99 pF) End Metallization C = Standard Failure Rate Level A = Not Applicable Temperature Characteristic Designated by Capacitance Change over Temperature Range R – X7R (±15%) (-55°C +125°C) Capacitance Tolerance K = ±10%; M = ±20% Voltage 1 = 100 Volts Open Mode Design The open-mode dimension (OM) exceeds the termination bandwidth dimensions: OM >BW Electrical Parameters As detailed in the KEMET Surface Mount Catalog F3102 for X7R, with following specific requirements based on room temperature (25°C) parameters: • Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 15% over that range. • Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 500 megohm microfarads or 50 gigaohm, whichever is less. • Capacitance and Dissipation Factor (DF) measured at 1kHz and 1 Vrms. DF Limit is 2.5%. Qualifications/ Certifications • AEC-Q200 Rev. C • RoHS Compliant Soldering Process These components are suitable for reflow and wave soldering. All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resistance to leaching. Marking These chips will be supplied unmarked. If required, they can be laser-marked as an extra option. Details on the marking format are included in KEMET Surface Mount catalog F3102. In general, the information in the KEMET Surface Mount catalog F3102 applies to these capacitors. The information in this bulletin supplements that in the catalog. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com