Product Bulletin Surface Mount Ceramic Chip Capacitors – Open Mode - X7R - Capacitance Extensions Outline Drawing L W TIN PLATE T B NICKEL PLATE S ELECTRODES CONDUCTIVE METALLIZATION Dimensions – Millimeters (Inches) EIA Size Metric Size Code Code L Length W Width B Bandwidth S Seperation 0805 2012 2.0 (.079) ± 0.02 (.008) 1.25 (.049) ± 0.2 (.008) 0.5 (.020) ± 0.25 (.010) 0.75 (.030) 1206 3216 3.2 (1.26) ± 0.2(.008) 1.6 (.063) ± 0.2 (.008) 0.5 (.020) ± 0.25 (.010) - 1210 3225 3.2 (.126) ± 0.2 (.008) 2.5 (.098) ± 0.2 (.008) 0.5 (.020) ± 0.25 (.010) - See Capacitance Value Table below for thickness dimension. Capacitor Ordering Information C 0805 F 684 K 4 R A C End Metallization C = Standard (Tin-plate nickel barrier) Style C - Ceramic Size Code See dimension table Failure Rate Level A = Not Applicable Specification F - Open Mode Capacitance Code, pF First two digits represent significant figures. Third digit specifies number of zeros. 100 pF = 101. (Use “9” for 1.0 through 9.9 pF) (Use “8” for 0.1 through .99 pF) Temperature Characteristic Designated by Capacitance Change Over Temperature Range R = X7R (±15%) (-55°C +125°C) 4 = 16V Capacitance Tolerance K = ± 10% M = ±20% The open-mode dimension (OM) exceeds the termination bandwidth dimensions: OM >BW F-9073B 9/06 3 = 25V Voltage 5 = 50V Capacitance Value Capacitance Value (µF) KEMET Part Number Voltage Capacitance Tolerance Thickness Qty 7" Reel Qty 13" Reel 0.22 C0805F224_3RAC 25 K, M 0.90 (.035) ± 0.10 (.004) 4,000 10,000 0.22 C0805F224_5RAC 50 K, M 1.25 (.049) ± 0.15 (.006) 2,500 10,000 0.47 C0805F474_4RAC 16 K, M 1.00 (.039) ± 0.10 (.004) 2,500 10,000 0.47 C0805F474_3RAC 25 K, M 1.25 (.049) ± 0.15 (.006) 2,500 10,000 0.68 C0805F684_4RAC 16 K, M 1.25 (.049) ± 0.15 (.006) 2,500 10,000 0.47 C1206F474_5RAC 50 K, M 0.90 (.035) ± 0.10 (.004) 4,000 10,000 1 C1206F105_3RAC 25 K, M 0.90 (.035) ± 0.10 (.004) 4,000 10,000 1 C1206F105_5RAC 50 K, M 1.60 (.063) ± 0.20 (.008) 2,000 8,000 2.2 C1206F225_4RAC 16 K, M 0.90 (.035) ± 0.10 (.004) 4,000 10,000 2.2 C1206F225_3RAC 25 K, M 1.60 (.063) ± 0.20 (.008) 2,000 8,000 4.7 C1206F475_4RAC 16 K, M 1.60 (.063) ± 0.20 (.008) 2,000 8,000 2.2 C1210F225_5RAC 50 K, M 1.70 (.067) ± 0.20 (.008) 2,000 8,000 4.7 C1210F475_4RAC 16 K, M 1.25 (.049) ± 0.15 (.006) 2,500 10,000 4.7 C1210F475_3RAC 25 K, M 1.70 (.067) ± 0.20 (.008) 2,000 8,000 Electrical Parameters As detailed in the KEMET Surface Mount Catalog F3102 for X7R, with the following specific requirements based on room temperature (25°C) parameters: • Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to the ± 15% over that range. • Insulating Resistance (IR) measured after 2 minutes at rated voltage @25°C: Limit is 500 megohmmicrofarads or 10,000MΩ , whichever of the two is smaller. • Capacitance and Dissipation Factor (DF) are measured under the following conditions: 1kHz and 1 Vrms if capacitance * 10µF 120Hz and 0.5 Vrms if capacitance $ 10µF • DF limits: 50 -200 Volts ü 2.5% 16 -25 Volts ü 3.5% 6.3 / 10 Volts ü 5.0% Soldering Process All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resistance to leaching. The recommended mounting techniques are as follows: • 0402 / 1210 case sizes ü Solder Reflow • 0603 / 0805 / 1206 case sizes ü Solder Wave / Solder Reflow Marking These chips will be supplied unmarked. If required, they can be laser-marked as an extra option. Details on the marking format are included in KEMET Surface Mount catalog F3102. In general, the information provided in the KEMET Surface Mount catalog F3102 applies to these capacitors. The Information in this bulletin supplements that in the catalog F-9073B 9/06 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com