[ /Title (CD74 HC195 ) /Subject (High Speed CMOS Logic 4-Bit Parallel Access Register) /Autho CD54HC195, CD74HC195 Data sheet acquired from Harris Semiconductor SCHS165E High-Speed CMOS Logic 4-Bit Parallel Access Register September 1997 - Revised October 2003 Features Description • Asynchronous Master Reset The device is useful in a wide variety of shifting, counting and storage applications. It performs serial, parallel, serial to parallel, or parallel to serial data transfers at very high speeds. • J, K, (D) Inputs to First Stage • Fully Synchronous Serial or Parallel Data Transfer The two modes of operation, shift right (Q0-Q1) and parallel load, are controlled by the state of the Parallel Enable (PE) input. Serial data enters the first flip-flop (Q0) via the J and K inputs when the PE input is high, and is shifted one bit in the direction Q0-Q1-Q2-Q3 following each Low to High clock transition. The J and K inputs provide the flexibility of the JKtype input for special applications and by tying the two pins together, the simple D-type input for general applications. The device appears as four common-clocked D flip-flops when the PE input is Low. After the Low to High clock transition, data on the parallel inputs (D0-D3) is transferred to the respective Q0-Q3 outputs. Shift left operation (Q3-Q2) can be achieved by tying the Qn outputs to the Dn-1 inputs and holding the PE input low. • Shift Right and Parallel Load Capability • Complementary Output From Last Stage • Buffered Inputs • Typical fMAX = 50MHz at VCC = 5V, CL = 15pF, TA = 25oC • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs All parallel and serial data transfers are synchronous, occurring after each Low to High clock transition. The ’HC195 series utilizes edge triggering; therefore, there is no restriction on the activity of the J, K, Pn and PE inputs for logic operations, other than set-up and hold time requirements. A Low on the asynchronous Master Reset (MR) input sets all Q outputs Low, independent of any other input condition. • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30%of VCC at VCC = 5V Ordering Information PInout PART NUMBER CD54HC195 (CERDIP) CD74HC195 (PDIP, SOIC, SOP, TSSOP) TOP VIEW MR 1 TEMP. RANGE (oC) CD54HC195F3A -55 to 125 16 Ld CERDIP CD74HC195E -55 to 125 16 Ld PDIP CD74HC195M -55 to 125 16 Ld SOIC CD74HC195NSR -55 to 125 16 Ld SOP CD74HC195PW -55 to 125 16 Ld TSSOP CD74HC195PWR -55 to 125 16 Ld TSSOP CD74HC195PWT -55 to 125 16 Ld TSSOP 16 VCC J 2 15 Q0 K 3 14 Q1 D0 4 13 Q2 D1 5 12 Q3 D2 6 11 Q3 D3 7 10 CP GND 8 9 PE NOTE: When ordering, use the entire part number. The suffix R denotes tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated PACKAGE 1 CD54HC195, CD74HC195 Functional Diagram PE D0 D1 D2 D3 9 4 5 6 7 2 J 10 CP 11 Q3 3 K 1 MR 15 14 13 12 Q0 Q1 Q2 Q3 TRUTH TABLE INPUTS OPERATING MODES OUTPUT MR CP PE J K Dn Q0 Q1 Q2 Q3 Q3 Asynchronous Reset L X X X X X L L L L H Shift, Set First Stage H ↑ h h h X H q0 q1 q2 q2 Shift, Reset First Stage H ↑ h l l X L q0 q1 q2 q2 Shift, Toggle First Stage H ↑ h h l X q0 q0 q1 q2 q2 Shift, Retain First Stage H ↑ h l h X q0 q0 q1 q2 q2 Parallel Load H ↑ l X X dn d0 d1 d2 d3 d2 H = High Voltage Level L = Low Voltage Level, X = Don’t Care ↑ = Transition from Low to High Level l = Low Voltage Level One Set-up Time Prior to the Low to High Clock Transition h = Low Voltage Level One Set-up Time prior to the High to Low Clock Transition, dn (qn) = Lower Case Letters Indicate the State of the Referenced Input (or output) One Set-up Time Prior to the Low to High Clock Transition. 2 CD54HC195, CD74HC195 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Package Thermal Impedance, θJA (see Note 1): E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL High Level Output Voltage CMOS Loads VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current 25oC VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54HC195, CD74HC195 Prerequisite For Switching Function PARAMETER SYMBOL Clock Frequency fMAX MR Pulse Width - tw Clock Pulse Width Removal Time, MR to Clock Switching Specifications MIN MAX MIN MAX MIN MAX UNITS 6 - 5 - 4 - MHz 30 - 25 - 20 - MHz 35 - 29 - 23 - MHz 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns 2 100 - 125 - 150 - ns 4.5 20 - 25 - 30 - ns 6 17 - 21 - 26 - ns - tREM -40oC TO 85oC -55oC TO 125oC 6 - tH 25oC 4.5 - tSU Hold Time J, K, PE to Clock 2 - tw Set-up Time J, K, PE to Clock PARAMETER TEST CONDITIONS VCC (V) 2 3 - 3 - 3 - ns 4.5 3 - 3 - 3 - ns 6 5 - 3 - 3 - ns 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns - Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 175 220 265 ns 4.5 - 35 44 53 ns 6 - 30 37 45 ns 2 - 150 190 225 ns 4.5 - 30 38 45 ns 6 - 26 33 38 ns HC TYPES Propagation Delay, CP to Output Propagation Delay, MR toOutput Output Transition Times (Figure 1) Input Capacitance CP to Qn Propagation Delay tPLH, tPHL tTLH, tTHL CIN CL = 50pF CL = 50pF - 2 - 75 95 110 ns 4.5 - 15 19 22 ns 6 - 13 16 19 ns - - 10 10 10 pF tPLH, tPHL CL = 15pF 5 14 - - - ns MR to Qn tPHL CL = 15pF 5 13 - - - ns Maximum Clock Frequency fMAX CL = 15pF 5 50 - - - MHz Power Dissipation Capacitance (Notes 2, 3) CPD CL = 15pF 45 - - - pF NOTES: 2. CPD is used to determine the dynamic power consumption, per flip-flop. 3. PD = VCC2 fi + ∑ (CL VCC2 + fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. 4 CD54HC195, CD74HC195 Test Circuit and Waveforms tW RESET tr CLOCK V S GND tf VCC 90% 10% tW Q GND 90% 10% tTLH tPLH 0.5 VCC tPHL l/fMAX tPLH tPHL Q OR Q VCC VS Q VS tREM 0.5 VCC CLOCK tTHL 0.5 VCC VCC GND FIGURE 2. MASTER RESET PREREQUISITE AND PROPAGATION DELAYS FIGURE 1. CLOCK PREREQUISITE AND PROPAGATION DELAYS AND OUTPUT TRANSITION TIMES VALID PE, K VCC VS J GND th tSU CLOCK 0.5 VCC GND FIGURE 3. J, K, OR PARALLEL ENABLE PREREQUISITE TIMES 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type CD54HC195F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD74HC195E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC195EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC195M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC195PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HC195M96 Package Package Pins Type Drawing SOIC SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HC195NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD74HC195PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC195M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HC195NSR SO NS 16 2000 346.0 346.0 33.0 CD74HC195PWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated