*R & oHS AE C C OM AP P PR LI OV AN ED T Features Applications ■ AEC-Q200 qualified ■ Camera links ■ ESD protection to IEC 61000-4-2 Level 4 ■ Sensors ■ <1 ns response time to ESD strike ■ Touchscreen interfaces ■ Low leakage current ■ GPS ■ Extremely low capacitance (0.05 pF typ.) ■ Antennas ■ Bidirectional device ■ USB 3.0 ■ Multi-strike capability ■ High-speed communications buses ChipGuard® Automotive MLC Series - ESD Protectors General Information Bourns® ChipGuard® Automotive MLC Series is a sub-1 pF protector designed specifically for use in automotive circuits requiring ESD protection. The CGA-MLC series is available in industry standard 0402 and 0603 packages. In addition to its very low capacitance, these protectors exhibit extremely fast response times to ESD events making them ideal for protecting a wide array of high speed digitial electronic applications. The ChipGuard® Automotive MLC Series is fully AEC-Q200 qualified and supported. Electrical Characteristics @ 25 °C (unless otherwise noted) Parameter Symbol DC Working Voltage VW(DC) Maximum Leakage Current @ Max. VW(DC) IL Typical Clamping Voltage (Note 1) Typical Trigger Voltage (Note 1) CGA0402MLC- CGA0603MLC- 05E 12E 24E 05E 12E 24E ≤5 ≤12 ≤24 ≤5 ≤12 ≤24 Unit V <0.01 μA VC 30 V VT 300 V Typical Peak Voltage (Note 2) VP Typical Capacitance @ 1 MHz, 1 Vrms CO Response Time RT ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge Min. Air Discharge Typical ESD Withstand 300 0.2 V 0.2 0.2 0.05 pF <1 ns ±8 ±15 (Note 3) 1000 kV kV Pulses Operating Temperature TOPR -55 to +125 ˚C Storage Temperature TSTG -55 to +125 ˚C Notes: 1. VT and VC measured using TLP (Transmission Line Pulse) method. 2. Peak voltage measured under ESD Test Conditions: IEC61000-4-2, 8 kV contact discharge. 3. IEC 61000-4-2 ESD Performance for CGA0603MLC-05E and CGA0603MLC-12E devices will meet minimum 100 reps. Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance. Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ChipGuard® Automotive MLC Series - ESD Protectors Product Dimensions Recommended Pad Layout A H W B L B C H CGA0402MLC Series CGA0603MLC Series L 1.00 ± 0.10 (0.04 ± 0.004) 1.60 ± 0.10 (0.064 ± 0.004) W 0.50 ± 0.10 (0.02 ± 0.004) H B Dim. CGA0402MLC Series CGA0603MLC Series A 0.50 ± 0.1 (0.02 ± 0.004) 0.75 ± 0.1 (0.03 ± 0.004) 0.85 ± 0.15 (0.033 ± 0.006) B 0.50 ± 0.1 (0.02 ± 0.004) 0.75 ± 0.1 (0.03 ± 0.004) 0.34 ± 0.10 (0.014 ± 0.004) 0.51 ± 0.05 (0.020 ± 0.002) C 0.50 ± 0.1 (0.02 ± 0.004) 0.75 ± 0.1 (0.03 ± 0.004) 0.20 ± 0.15 (0.008 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) Dim. DIMENSIONS: MM (INCHES) Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Temperature (°C) 250 Stage 1 Preheat Ambient to Preheating Temperature 30 s to 60 s 60 s to 120 s 200 B Stage 2 Preheat 140 °C to 160 °C 150 C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 °C 210 °C 220 °C 230 °C 240 °C 250 °C to 255 °C 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s 5s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s 100 50 0 110 sec. (min.) 30-70 sec. 120 sec. (min.) Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ChipGuard® Automotive MLC Series - ESD Protectors Packaging Dimensions F E 13.0 ± 1.0 (0.52 ± 0.04) C B A 62.0 ± 1.5 (2.48 ± 0.06) 2.0 ± 0.5 (0.08 ± 0.02) L 13.0 ± 0.5 (0.52 ± 0.02) TOP TAPE W D NOTES: TAPE MATERIAL IS PAPER. 0.48 ± 0.03 (0.019 ± 0.0012) COVER TAPE ADHESION IS 35 ± 25 GRAMS. TAPE THICKNESS IS: CGA0402MLC DIMENSIONS: CGA0603MLC 0.6 ± 0.03 (0.024 ± 0.0012) 21.0 ± 0.8 (0.84 ± 0.032) 178 ± 2.0 (7.08 ± 0.08) MM (INCHES) 9.0 ± 0.5 (0.36 ± 0.02) CGA0402MLC Series CGA0603MLC Series A 8.00 ± 0.30 (0.315 ± 0.012) 8.00 ± 0.30 (0.315 ± 0.012) B 3.50 ± 0.05 (0.138 ± 0.002) 3.50 ± 0.05 (0.138 ± 0.002) C 1.75 ± 0.10 (0.069 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) D 2.00 ± 0.05 (0.079 ± 0.002) 2.00 ± 0.05 (0.079 ± 0.002) E 4.00 ± 0.10 (0.157 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) F 1.50 ± 0.10 (0.059 ± 0.004) 1.50 ± 0.10 (0.059 ± 0.004) Maximum DC Working Voltage 05 = 5 V 12 = 12 V 24 = 24 V L 1.19 ± 0.05 (0.047 ± 0.002) 2.02 ± 0.20 (0.080 ± 0.008) Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) W 0.69 ± 0.05 (0.027 ± 0.002) 1.27 ± 0.15 (0.050 ± 0.006) T 0.48 ± 0.03 (0.019 ± 0.0012) 0.60 ± 0.03 (0.024 ± 0.0012) Dimension How to Order CG A 0n0n MLC - nn x ChipGuard® Product Designator Automotive Series Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator REV. A 12/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.