PL IA N T Features M ■ 0402 and 0603 package options *R oH S CO ■ Rated for IEC 61000-4-2, for applications requiring up to 18 V DC ■ Withstands multiple ESD strikes ■ Low capacitance and leakage currents for invisible load protection ■ Tape and reel packaging ChipGuard® MLE Series Varistor ESD Clamp Protectors Description The ChipGuard® CG0402MLE and CG0603MLE Series have been designed to provide high frequency attenuation, thereby providing suppression and filtering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging. Electrical Characteristics @ 25 °C (unless otherwise noted) Continuous Operating Voltage Model Vrms (V) Max. VDC (V) Typ. Clamping Voltage Off-state Current Capacitance VCLAMP (V) IL (µA) CP (pF) Typ. Max. Max. Max. 1A @ 8/20 µs 3.5 V 5.5 V 9V 12 V 18 V 1 Vrms @ 1 MHz CG0402MLE-18G 8.5 12 18 100 0.3 0.4 0.5 1 10 9 CG0603MLE-18E 8.5 12 18 60 0.3 0.4 0.5 1 10 50 Environmental Characteristics Surge Withstand Ratings Operating Temperature ...-55 °C to +125 °C Storage Temperature.......-55 °C to +125 °C Response Time.................................. <1 ns Standard ................. IEC 61000-4-2 Level 4 These products are RoHS compliant. There is some lead contained within the glass of the ceramic. This is acceptable under exemption no. 5 of the RoHS directive (DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment). Peak Current 8/20 µs (Max.) Peak Current @ 8 kV (Max.) CG0402MLE-18G 15 A 30 A CG0603MLE-18E 20 A 45 A Model Voltage-Current Characteristics 10 2 CG0402MLE-18G CG0603MLE-18E Schematic Voltage (Volts) CG0402MLE-18G *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CG0603MLE-18E 10 1 10 0 10-8 10-7 10-6 10-5 SOURCE = DC 10-4 10-3 10-2 10-1 10 0 10 1 10 2 SOURCE = 8/20 μs PULSE, IPEAK I Current (Amps) 10 3 10 4 ® ChipGuard 3312 - 2 mm MLE SMD Series Trimming Varistor ESD Potentiometer Clamp Protectors Product Dimensions Recommended Pad Layout A A W DIMENSIONS: MM (INCHES) B L B C D CG0402MLE Series CG0603MLE Series L 1.00 ± 0.15 (0.04 ± 0.006) 1.60 ± 0.20 (0.064 ± 0.008) W 0.50 ± 0.10 (0.02 ± 0.004) A B Dimension CG0402MLE Series CG0603MLE Series A 0.51 (0.020) 0.76 (0.030) 0.80 ± 0.20 (0.032 ± 0.008) B 0.61 (0.024) 1.02 (0.040) 0.50 ± 0.10 (0.02 ± 0.004) 0.80 ± 0.20 (0.032 ± 0.008) C 0.51 (0.020) 0.50 (0.020) 0.25 ± 0.15 (0.10 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) D 1.70 (0.067) 2.54 (0.100) Dim. Solder Reflow Recommendations Preheat Stages 1-3 300 Soldering Cooling A Temperature (°C) 250 Stage 1 Preheat Ambient to Preheating Temperature 30 s to 60 s 60 s to 120 s B Stage 2 Preheat 140 °C to 160 °C 200 C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s 150 D Main Heating 200 °C 210 °C 220 °C 230 °C 240 °C 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s 100 50 0 110 sec. (min.) 30-70 sec. 120 sec. (min.) Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. How to Order CG 0n0n MLE - 18 x ® ChipGuard Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 18 = 18 V Tape & Reel Packaging E = 4,000 pcs. per reel (0603 package) G = 10,000 pcs. per reel (0402 package) Ni barrier terminations are standard on all ChipGuard® part numbers. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard® MLE Series Varistor ESD Clamp Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP TAPE G W D 21.0 ± 0.80 (0.84 ± 0.032) 3.50 ± 0.05 (0.14 ± 0.002) NOTES: TAPE MATERIAL IS PAPER. 0.48 ± 0.03 TAPE THICKNESS IS (0.019 ± 0.0012) COVER TAPE ADHESION IS 40 ± 15 GRAMS. DIMENSIONS: MM (INCHES) CG0402MLE Series CG0603MLE Series C 1.75 ± 0.05 (0.04 ± 0.002) 1.75 ± 0.10 (0.04 ± 0.004) D 2.00 ± 0.02 (0.08 ± 0.0008) 2.00 ± 0.05 (0.08 ± 0.002) L 1.19 ± 0.05 (0.047 ± 0.002) 1.80 ± 0.20 (0.072 ± 0.008) W 0.69 ± 0.05 (0.027 ± 0.002) 0.90 ± 0.20 (0.036 ± 0.008) G 2.0 ± 0.05 (0.08 ± 0.002) 4.0 ± 0.05 (0.16 ± 0.002) Dimension Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. I 09/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 180.8 ± 2.0 (7.12 ± 0.08) 9.0 ± 0.50 (0.36 ± 0.02)