TI CY74FCT16240ATPVC

1CY74FCT162240T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16240T
CY74FCT162240T
16-Bit Buffers/Line Drivers
SCCS027B - August 1994 - Revised September 2001
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of –40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16240T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce)
<1.0V at VCC = 5V, TA = 25˚C
These 16-bit buffer/line drivers are used in memory driver,
clock driver, or other bus interface applications, where high
speed and low power are required. With flow-through pinout
and small shrink packaging, board layout is simplified. The
three-state controls are designed to allow 4-, 8-, or 16-bit
operation.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16240T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162240T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The
CY74FCT162240T is ideal for driving transmission lines.
CY74FCT162240T Features:
• Balanced output drivers: 24 mA
• Reduced system switching noise
• Typical VOLP (ground bounce)
<0.6V at VCC = 5V, TA= 25˚C
Logic Block Diagrams
Pin Configuration
1OE
3OE
1A1
3A1
1A2
1A3
1A4
1Y1
1Y2
1Y3
1Y4
3A2
3A3
3A4
2OE
4OE
2A1
4A1
2A2
2A3
2A4
2Y2
2Y3
2Y4
FCT16240–2
3Y1
3Y2
3Y3
3Y4
FCT16240–3
FCT16240–1
2Y1
SSOP/TSSOP
Top View
4A2
4A3
4A4
4Y1
4Y2
4Y3
4Y4
FCT16240–4
1OE
1
48
1Y1
2
47
1A1
1Y2
3
46
1A2
GND
4
45
GND
1Y3
5
44
1A3
1Y4
6
43
1A4
VCC
7
42
VCC
2Y1
8
41
2A1
2Y2
9
40
2A2
GND
10
39
GND
2Y3
11
38
2A3
2Y4
37
2A4
3Y1
12
13
36
3A1
3Y2
14
35
3A2
GND
15
34
GND
3Y3
16
33
3A3
3Y4
17
32
3A4
VCC
18
31
VCC
4Y1
19
30
4A1
4Y2
20
29
4A2
GND
21
28
GND
4Y3
22
27
4A3
4Y4
23
26
4A4
4OE
24
25
3OE
2OE
FCT16240–5
Copyright
© 2001, Texas Instruments Incorporated
CY74FCT16240T
CY74FCT162240T
Maximum Ratings[2, 3]
Pin Summary
Name
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Description
OE
Three-State Output Enable Inputs (Active LOW)
A
Data Inputs
Y
Three-State Outputs
Storage Temperature ......................Com’l . –55°C to +125°C
Ambient Temperature with
Power Applied..................................Com’l . –55°C to +125°C
DC Input Voltage ........................................... –0.5V to +7.0V
Function Table[1]
DC Output Voltage......................................... –0.5V to +7.0V
Inputs
Outputs
OE
A
Y
DC Output Current
(Maximum Sink Current/Pin) ........................–60 to +120 mA
L
L
H
Power Dissipation .......................................................... 1.0W
L
H
L
H
X
Z
Static Discharge Voltage
(per MIL-STD-883, Method 3015) .............................>2001V
Operating Range
Range
Industrial
Ambient Temperature
VCC
–40°C to +85°C
5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
Min.
Typ.[4]
Max.
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VH
Input
Hysteresis[5]
VIK
Input Clamp Diode Voltage
VCC = Min., IIN= –18 mA
–1.2
V
IIH
Input HIGH Current
VCC = Max., VI = VCC
±1
µA
IIH
Input HIGH Current
VCC = Max., VI = VCC
±1
µA
IIL
Input LOW Current
VCC = Max., VI = GND
±1
µA
IIL
Input LOW Current
VCC = Max., VI = GND
±1
µA
IOZH
High Impedance Output Current
(Three-State Output pins)
VCC = Max., VOUT = 2.7V
±1
µA
IOZL
High Impedance Output Current
(Three-State Output pins)
VCC = Max., VOUT = 0.5V
±1
µA
IOS
Short Circuit Current[6]
VCC = Max., VOUT = GND
–80
–200
mA
IO
Output Drive Current[6]
VCC = Max., VOUT = 2.5V
–50
–180
mA
Power-Off Disable
VCC = 0V, VOUT ≤
±1
µA
Max.
Unit
IOFF
2.0
Unit
V
0.8
100
–0.7
–140
4.5V[7]
V
mV
Output Drive Characteristics for CY74FCT16240T
Parameter
VOH
VOL
Description
Output HIGH Voltage
Output LOW Voltage
Min.
Typ.[4]
VCC = Min., IOH= –3 mA
2.5
3.5
V
VCC = Min., IOH= –15 mA
2.4
3.5
V
VCC = Min., IOH= –32 mA
2.0
3.0
V
Test Conditions
VCC = Min., IOL= 64 mA
0.2
0.55
V
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
2. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. Typical values are at VCC=5.0V, TA= +25˚C ambient.
5. This parameter is specified but not tested.
6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
7. Tested at +25˚C.
2
CY74FCT16240T
CY74FCT162240T
Output Drive Characteristics for CY74FCT162240T
Parameter
Description
[6]
Test Conditions
Min.
Typ.[4]
Max.
Unit
IODL
Output LOW Current
VCC = 5V, VIN = VIH or VIL,VOUT = 1.5V
60
115
150
mA
IODH
Output HIGH Current[6]
VCC = 5V, VIN = VIH or VIL, VOUT = 1.5V
–60
–115
–150
mA
VOH
Output HIGH Voltage
VCC = Min., IOH = –24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC = Min., IOL = 24 mA
V
0.3
0.55
V
Typ.[4]
Capacitance[5] (TA = +25˚C, f = 1.0 MHz)
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[4]
Max.
Unit
5
500
µA
ICC
Quiescent Power Supply Current VCC=Max.
VIN≤0.2V,
VIN≥VCC–0.2V
∆ICC
Quiescent Power Supply Current
(TTL inputs HIGH)
VCC=Max.
VIN=3.4V[8]
0.5
1.5
mA
ICCD
Dynamic Power Supply
Current[9]
VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=GND
VIN=VCC or
VIN=GND
60
100
µA/MHz
IC
Total Power Supply Current[10]
VCC=Max., f1=10 MHz, 50%
Duty Cycle, Outputs Open,
One Bit Toggling, OE=GND
VIN=VCC or
VIN=GND
0.6
1.5
mA
VIN=3.4V or
VIN=GND
0.9
2.3
mA
VIN=VCC or
VIN=GND
2.4
4.5[11]
mA
VIN=3.4V or
VIN=GND
6.4
16.5[11]
mA
VCC=Max., f1=2.5 MHz, 50%
Duty Cycle, Outputs Open,
Sixteen Bits Toggling,
OE=GND
Notes:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. IC = IQUIESCENT + IINPUTS + IDYNAMIC
IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH = Duty Cycle for TTL inputs HIGH
NT = Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
f0 = Clock frequency for registered devices, otherwise zero
f1 = Input signal frequency
N1 = Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
3
CY74FCT16240T
CY74FCT162240T
Switching Characteristics Over the Operating Range[12]
CY74FCT16240AT
Parameter
Description
CY74FCT162240CT
Min.
Max.
Min.
Max.
Unit
Fig.
No.[13]
tPLH
tPHL
Propagation Delay Data to Output
1.5
4.8
1.5
4.3
ns
1, 2
tPZH
tPZL
Output Enable Time
1.5
6.2
1.5
5.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
5.6
1.5
5.2
ns
1, 7, 8
tSK(O)
Output Skew[14]
0.5
ns
—
0.5
Note:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT16240
Speed
(ns)
4.8
Ordering Code
CY74FCT16240ATPVC/PVCT
Package
Name
O48
Package Type
48-Lead (300-Mil) SSOP
Operating
Range
Industrial
Ordering Information CY74FCT162240
Speed
(ns)
4.3
Ordering Code
Package
Name
Package Type
74FCT162240CTPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162240CTPVC
O48
48-Lead (300-Mil) SSOP
74FCT162240CTPVCT
O48
48-Lead (300-Mil) SSOP
Document #: 38-00395-C
4
Operating
Range
Industrial
CY74FCT16240T
CY74FCT162240T
Package Diagrams
48-Lead Shrunk Small Outline Package O48
5
CY74FCT16240T
CY74FCT162240T
Package Diagrams
48-Lead Thin Shrunk Small Outline Package
6
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT162240ATPACT
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162240CTPACT
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162240CTPVCT
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162240ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
74FCT162240ETPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
74FCT16240ATPACTE4
ACTIVE
TSSOP
DGG
48
CY74FCT162240CTPVC
ACTIVE
SSOP
DL
48
CY74FCT162240ETPAC
OBSOLETE
TSSOP
DGG
CY74FCT162240ETPVC
OBSOLETE
SSOP
DL
CY74FCT16240ATPACT
ACTIVE
TSSOP
DGG
48
CY74FCT16240ATPVC
ACTIVE
SSOP
DL
48
CY74FCT16240ATPVCT
ACTIVE
SSOP
DL
48
2000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
TBD
Call TI
Call TI
48
TBD
Call TI
Call TI
25
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
CY74FCT16240ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
CY74FCT16240ETPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
FCT162240ATPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162240CTPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2005
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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