Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16646T CY74FCT162646T 16-Bit Registered Transceivers SCCS060B - August 1994 - Revised September 2001 Features Functional Description • Ioff supports partial-power-down mode operation • Edge-rate control circuitry for significantly improved noise characteristics • Typical output skew < 250 ps • ESD > 2000V • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages • Industrial temperature range of −40˚C to +85˚C • VCC = 5V ± 10% CY74FCT16646T Features: • 64 mA sink current, 32 mA source current • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25˚C CY74FCT162646T Features: • Balanced 24 mA output drivers • Reduced system switching noise • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA= 25˚C The CY74FCT16646T and CY74FCT162646T 16-bit transceivers are three-state, D-type registers, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes to a HIGH logic level. Output Enable (OE) and direction pins (DIR) are provided to control the transceiver function. In the transceiver mode, data present at the high impedance port may be stored in either the A or B register, or in both. The select controls can multiplex stored and real-time (transparent mode) data. The direction control determines which bus will receive data when the Output Enable (OE) is Active LOW. In the isolation mode (Output Enable (OE) HIGH), A data may be stored in the B register and/or B data may be stored in the A register. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16646T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162646T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162646T is ideal for driving transmission lines. Logic Block Diagrams 2OE 1OE 2DIR 2CLKBA 2SBA 2CLKAB 1DIR 1CLKBA 1SBA 1CLKAB 2SAB 1SAB B REG B REG D D C C 2A1 1A1 A REG D 1B1 A REG D 2B1 C C TO 7 OTHER CHANNELS TO 7 OTHER CHANNELS FCT16646-2 FCT16646-1 Copyright © 2001, Texas Instruments Incorporated CY74FCT16646T CY74FCT162646T Pin Configuration SSOP/TSSOP Top View 1DIR 1 56 1OE 1CLKAB 1SAB 2 55 3 54 1CLKBA 1SBA GND 4 53 GND 1A1 5 52 1B1 1A2 VCC 1A3 6 51 1B2 7 50 VCC 8 49 1B3 1A4 9 48 1B4 1A5 10 47 1B5 GND 11 46 GND 1A6 12 45 1B6 1A7 13 44 1B7 1A8 14 43 1B8 2A1 15 42 2B1 2A2 16 41 2B2 2A3 17 40 2B3 GND 18 39 GND 2A4 19 38 2B4 2A5 2A6 20 37 2B5 21 36 2B6 VCC 22 35 VCC 2A7 23 34 2B7 2A8 24 33 2B8 GND 25 32 GND 2SAB 26 31 2SBA 2CLKAB 27 30 2DIR 28 29 2CLKBA 2OE FCT16646-3 Pin Description Pin Names Description A Data Register A Inputs Data Register B Outputs B Data Register B Inputs Data Register A Outputs CLKAB, CLKBA Clock Pulse Inputs SAB, SBA Output Data Source Select Inputs DIR Direction OE Output Enable (Active LOW) 2 CY74FCT16646T CY74FCT162646T Function Table[1] Data I/O[2] Inputs Function OE DIR CLKAB CLKBA SAB SBA A B H H X X H or L H or L X X X X Input Input Isolation Store A and B Data L L L L X X X H or L X X L H Output Input Real Time B Data to A Bus Stored B Data to A Bus L L H H X H or L X X L H X X Input BUS A BUS B DIR L OE L CLKAB X CLKBA X SAB X Output Real Time A Data to Bus Stored A Data to B Bus BUS A SBA L DIR H BUS B OE L CLKAB X Real-Time Transfer Bus B to BusA OE L L H CLKAB CLKBA X X SAB L SBA X Real-Time Transfer BusA to Bus B BUS A DIR H L X CLKBA X SAB X X X BUS B BUS A SBA X X X DIR [3] L H Storage from A and/or B BUS A OE L L CLKAB X H or L CLKBA H or L X SAB X H SBA H X Transfer Stored Data to A and/or B Notes: 1. 2. 3. = LOW-to-HIGH Transition H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care The data output functions may be enabled or disabled by various signals at the OE or DIR inputs. Data input functions are always enabled, i.e., data at the bus pins will be stored on every LOW-to-HIGH transition on the clock inputs. Cannot transfer data to A-bus and B-bus simultaneously. . 3 CY74FCT16646T CY74FCT162646T Maximum Ratings[4] DC Output Current (Maximum Sink Current/Pin) ...........................−60 to +120 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Power Dissipation .......................................................... 1.0W Storage Temperature .....................Com’l −55°C to +125°C Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Ambient Temperature with Power Applied .................................Com’l −55°C to +125°C Operating Range DC Input Voltage .................................................−0.5V to +7.0V Ambient Temperature VCC −40°C to +85°C 5V ± 10% Range DC Output Voltage ..............................................−0.5V to +7.0V Industrial Electrical Characteristics Over the Operating Range Parameter Description Test Conditions VIH Input HIGH Voltage VIL Input LOW Voltage VH Input Hysteresis[6] VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 mA IIH Input HIGH Current IIL IOZH Min. Typ.[5] Max. 2.0 Unit V 0.8 100 −1.2 V VCC=Max., VI=VCC ±1 µA Input LOW Current VCC=Max., VI=GND ±1 µA High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=2.7V ±1 µA IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V ±1 µA IOS Short Circuit Current[7] VCC=Max., VOUT=GND −80 −200 mA Current[7] VCC=Max., VOUT=2.5V −50 −180 mA ±1 µA Max. Unit IO Output Drive IOFF Power-Off Disable −0.7 V mV −140 VCC=0V, VOUT≤4.5V[9] Output Drive Characteristics for CY74FCT16646T Parameter VOH VOL Description Output HIGH Voltage Output LOW Voltage Min. Typ.[5] VCC=Min., IOH=−3 mA 2.5 3.5 V VCC=Min., IOH=−15 mA 2.4 3.5 V VCC=Min., IOH=−32 mA 2.0 3.0 V Test Conditions VCC=Min., IOL=64 mA 0.2 0.55 V Typ.[5] Max. Unit Output Drive Characteristics for CY74FCT162646T Parameter Description Test Conditions Min. IODL Output LOW Current[7] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA IODH Output HIGH Current[7] VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA VOH Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 V 0.55 V Notes: 4. Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 5. Typical values are at VCC= 5.0V, TA= +25˚C ambient. 6. This parameter is specified but not tested. 7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametrics tests. In any sequence of parameter tests, IOS tests should be performed last. 8. This parameter is measured at characterization but not tested. 9. Tested at +25˚C. 4 CY74FCT16646T CY74FCT162646T Capacitance (TA = +25˚C, f = 1.0 MHz) Description[8] Symbol Typ. Max. Unit CIN Input Capacitance VIN = 0V Conditions 4.5 6.0 pF COUT Output Capacitance VOUT =0V 5.5 8.0 pF Power Supply Characteristics Parameter Description Test Conditions[10] VCC=Max. VIN<0.2V VIN>VCC−0.2V Min. Typ.[5] Max. Unit — 5 500 µA — 0.5 1.5 mA ICC Quiescent Power Supply Current ∆ICC Quiescent Power Supply Current VCC = Max. TTL Inputs HIGH VIN=3.4V[11] ICCD Dynamic Power Supply Current[12] VCC=Max. Outputs Open DIR=OE=GND One-Bit Toggling 50% Duty Cycle VIN=VCC or VIN=GND — 75 120 µA/MHz IC Total Power Supply Current[13] VCC=Max. Outputs Open fo=10 MHz (CLKBA) 50% Duty Cycle DIR=OE=GND One-Bit Toggling f1=5 MHz 50% Duty Cycle VIN=VCC or VIN=GND — 0.8 1.7 mA VIN=3.4V or VIN=GND — 1.3 3.2 VCC=Max. Outputs Open fo=10 MHz (CLKBA) 50% Duty Cycle DIR=OE=GND Sixteen-Bits Toggling f1=2.5 MHz 50% Duty Cycle VIN=VCC or VIN=GND — 3.8 6.5[14] VIN=3.4V or VIN=GND — 8.3 20.0[14] Notes: 10. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 11. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 12. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. = IQUIESCENT + IINPUTS + IDYNAMIC 13. IC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 14. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 5 CY74FCT16646T CY74FCT162646T Switching Characteristics Over the Operating Range[15] CY74FCT16646T Parameter Description CY74FCT16646AT CY74FCT162646AT Min. Max. Min. Max. Unit Fig. No.[16] tPLH tPHL Propagation Delay Bus to Bus 1.5 9.0 1.5 6.3 ns 1, 2 tPZH tPZL Output Enable Time DIR or OE to Bus 1.5 14.0 1.5 9.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time DIR or OE to Bus 1.5 9.0 1.5 6.3 ns 1, 7, 8 tPLH tPHL Propagation Delay Clock to Bus 1.5 9.0 1.5 6.3 ns 1, 5 tPLH tPHL Propagation Delay SBA or SAB to Bus 1.5 11.0 1.5 7.7 ns 1,5 tSU Set-Up Time HIGH or LOW Bus to Clock 2.0 — 2.0 — ns 4 tH Hold Time HIGH or LOW Bus to Clock 1.5 — 1.5 — ns 4 tW Clock Pulse Width HIGH or LOW 5.0 — 5.0 — ns 6 tSK(O) Output Skew[17] — 0.5 — 0.5 ns — CY74FCT16646CT CY74FCT162646CT Parameter Description Min. Max. Unit Fig. No.[16] tPLH tPHL Propagation Delay Bus to Bus 1.5 5.4 ns 1, 2 tPZH tPZL Output Enable Time DIR or OE to Bus 1.5 7.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time DIR or OE to Bus 1.5 6.3 ns 1, 7, 8 tPLH tPHL Propagation Delay Clock to Bus 1.5 5.7 ns 1, 5 tPLH tPHL Propagation Delay SBA or SAB to Bus 1.5 6.2 ns 1,5 tSU Set-Up Time HIGH or LOW Bus to Clock 2.0 — ns 4 tH Hold Time HIGH or LOW Bus to Clock 1.5 — ns 4 tW Clock Pulse Width HIGH or LOW 5.0 — ns 6 tSK(O) Output Skew[17] — 0.5 ns — Notes: 15. Minimum limits are specified but not tested on Propagation Delays. 16. See “Parameter Measurement Information” in the General Information section. 17. Skew any two outputs of the same package switching in the same direction. This parameter is ensured by design. 6 CY74FCT16646T CY74FCT162646T Ordering Information CY74FCT16646 Speed (ns) Ordering Code Package Name Package Type Operating Range 5.4 CY74FCT16646CTPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial 6.3 CY74FCT16646ATPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial 9.0 CY74FCT16646TPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial Ordering Information CY74FCT162646 Speed (ns) 5.4 6.3 Ordering Code Package Name Package Type 74FCT162646CTPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162646CTPVC O56 56-Lead (300-Mil) SSOP 74FCT162646CTPVCT O56 56-Lead (300-Mil) SSOP 74FCT162646ATPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162646ATPVC O56 56-Lead (300-Mil) SSOP 74FCT162646ATPVCT O56 56-Lead (300-Mil) SSOP 7 Operating Range Industrial Industrial CY74FCT16646T CY74FCT162646T Package Diagrams 56-Lead Shrunk Small Outline Package O56 56-Lead Thin Shrunk Small Outline Package Z56 8 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74FCT162646ATPACT ACTIVE TSSOP DGG 56 74FCT162646ATPVCG4 ACTIVE SSOP DL 56 74FCT162646ATPVCT ACTIVE SSOP DL 74FCT162646CTPACT ACTIVE TSSOP 74FCT162646CTPVCG4 ACTIVE 74FCT162646CTPVCT 2000 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162646ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI 74FCT162646ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI 74FCT16646ATPVCG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16646ATPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16646CTPVCG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16646CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16646TPVCG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16646TPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162646ATPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162646CTPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162646ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT162646ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16646ATPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16646ATPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16646CTPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16646CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 20 20 20 20 20 CY74FCT16646ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16646ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16646TPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16646TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162646ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty FCT162646ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162646ATPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162646CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162646CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162646CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74FCT162646ATPACT Package Package Pins Type Drawing TSSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 74FCT162646ATPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 74FCT162646CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 74FCT162646CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT16646ATPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT16646CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT16646TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162646ATPACT TSSOP DGG 56 2000 346.0 346.0 41.0 74FCT162646ATPVCT SSOP DL 56 1000 346.0 346.0 49.0 74FCT162646CTPACT TSSOP DGG 56 2000 346.0 346.0 41.0 74FCT162646CTPVCT SSOP DL 56 1000 346.0 346.0 49.0 CY74FCT16646ATPVCT SSOP DL 56 1000 346.0 346.0 49.0 CY74FCT16646CTPVCT SSOP DL 56 1000 346.0 346.0 49.0 CY74FCT16646TPVCT SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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