TI CY74FCT162646CTPVC

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16646T
CY74FCT162646T
16-Bit Registered Transceivers
SCCS060B - August 1994 - Revised September 2001
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of −40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16646T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162646T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
The CY74FCT16646T and CY74FCT162646T 16-bit
transceivers are three-state, D-type registers, and control
circuitry arranged for multiplexed transmission of data directly
from the input bus or from the internal registers. Data on the A
or B bus will be clocked into the registers as the appropriate
clock pin goes to a HIGH logic level. Output Enable (OE) and
direction pins (DIR) are provided to control the transceiver
function. In the transceiver mode, data present at the high
impedance port may be stored in either the A or B register, or
in both. The select controls can multiplex stored and real-time
(transparent mode) data. The direction control determines
which bus will receive data when the Output Enable (OE) is
Active LOW. In the isolation mode (Output Enable (OE) HIGH),
A data may be stored in the B register and/or B data may be
stored in the A register.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16646T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162646T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162646T is ideal for driving transmission lines.
Logic Block Diagrams
2OE
1OE
2DIR
2CLKBA
2SBA
2CLKAB
1DIR
1CLKBA
1SBA
1CLKAB
2SAB
1SAB
B REG
B REG
D
D
C
C
2A1
1A1
A REG
D
1B1
A REG
D
2B1
C
C
TO 7 OTHER CHANNELS
TO 7 OTHER CHANNELS
FCT16646-2
FCT16646-1
Copyright
© 2001, Texas Instruments Incorporated
CY74FCT16646T
CY74FCT162646T
Pin Configuration
SSOP/TSSOP
Top View
1DIR
1
56
1OE
1CLKAB
1SAB
2
55
3
54
1CLKBA
1SBA
GND
4
53
GND
1A1
5
52
1B1
1A2
VCC
1A3
6
51
1B2
7
50
VCC
8
49
1B3
1A4
9
48
1B4
1A5
10
47
1B5
GND
11
46
GND
1A6
12
45
1B6
1A7
13
44
1B7
1A8
14
43
1B8
2A1
15
42
2B1
2A2
16
41
2B2
2A3
17
40
2B3
GND
18
39
GND
2A4
19
38
2B4
2A5
2A6
20
37
2B5
21
36
2B6
VCC
22
35
VCC
2A7
23
34
2B7
2A8
24
33
2B8
GND
25
32
GND
2SAB
26
31
2SBA
2CLKAB
27
30
2DIR
28
29
2CLKBA
2OE
FCT16646-3
Pin Description
Pin Names
Description
A
Data Register A Inputs
Data Register B Outputs
B
Data Register B Inputs
Data Register A Outputs
CLKAB, CLKBA
Clock Pulse Inputs
SAB, SBA
Output Data Source Select Inputs
DIR
Direction
OE
Output Enable (Active LOW)
2
CY74FCT16646T
CY74FCT162646T
Function Table[1]
Data I/O[2]
Inputs
Function
OE
DIR
CLKAB
CLKBA
SAB
SBA
A
B
H
H
X
X
H or L
H or L
X
X
X
X
Input
Input
Isolation
Store A and B Data
L
L
L
L
X
X
X
H or L
X
X
L
H
Output
Input
Real Time B Data to A Bus
Stored B Data to A Bus
L
L
H
H
X
H or L
X
X
L
H
X
X
Input
BUS A
BUS B
DIR
L
OE
L
CLKAB
X
CLKBA
X
SAB
X
Output Real Time A Data to Bus
Stored A Data to B Bus
BUS A
SBA
L
DIR
H
BUS B
OE
L
CLKAB
X
Real-Time Transfer
Bus B to BusA
OE
L
L
H
CLKAB
CLKBA
X
X
SAB
L
SBA
X
Real-Time Transfer
BusA to Bus B
BUS A
DIR
H
L
X
CLKBA
X
SAB
X
X
X
BUS B
BUS A
SBA
X
X
X
DIR [3]
L
H
Storage from
A and/or B
BUS A
OE
L
L
CLKAB
X
H or L
CLKBA
H or L
X
SAB
X
H
SBA
H
X
Transfer Stored Data
to A and/or B
Notes:
1.
2.
3.
= LOW-to-HIGH Transition
H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care
The data output functions may be enabled or disabled by various signals at the OE or DIR inputs. Data input functions are always enabled, i.e., data at the
bus pins will be stored on every LOW-to-HIGH transition on the clock inputs.
Cannot transfer data to A-bus and B-bus simultaneously.
.
3
CY74FCT16646T
CY74FCT162646T
Maximum Ratings[4]
DC Output Current
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
(Above which the useful life may be impaired. For user guidelines, not tested.)
Power Dissipation .......................................................... 1.0W
Storage Temperature .....................Com’l −55°C to +125°C
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Ambient Temperature with
Power Applied .................................Com’l −55°C to +125°C
Operating Range
DC Input Voltage .................................................−0.5V to +7.0V
Ambient
Temperature
VCC
−40°C to +85°C
5V ± 10%
Range
DC Output Voltage ..............................................−0.5V to +7.0V
Industrial
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VH
Input Hysteresis[6]
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=−18 mA
IIH
Input HIGH Current
IIL
IOZH
Min.
Typ.[5]
Max.
2.0
Unit
V
0.8
100
−1.2
V
VCC=Max., VI=VCC
±1
µA
Input LOW Current
VCC=Max., VI=GND
±1
µA
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=2.7V
±1
µA
IOZL
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
Short Circuit Current[7]
VCC=Max., VOUT=GND
−80
−200
mA
Current[7]
VCC=Max., VOUT=2.5V
−50
−180
mA
±1
µA
Max.
Unit
IO
Output Drive
IOFF
Power-Off Disable
−0.7
V
mV
−140
VCC=0V, VOUT≤4.5V[9]
Output Drive Characteristics for CY74FCT16646T
Parameter
VOH
VOL
Description
Output HIGH Voltage
Output LOW Voltage
Min.
Typ.[5]
VCC=Min., IOH=−3 mA
2.5
3.5
V
VCC=Min., IOH=−15 mA
2.4
3.5
V
VCC=Min., IOH=−32 mA
2.0
3.0
V
Test Conditions
VCC=Min., IOL=64 mA
0.2
0.55
V
Typ.[5]
Max.
Unit
Output Drive Characteristics for CY74FCT162646T
Parameter
Description
Test Conditions
Min.
IODL
Output LOW
Current[7]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115
150
mA
IODH
Output HIGH Current[7]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
−60
−115
−150
mA
VOH
Output HIGH Voltage
VCC=Min., IOH=−24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
0.3
V
0.55
V
Notes:
4. Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
5. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametrics tests. In any sequence of parameter
tests, IOS tests should be performed last.
8. This parameter is measured at characterization but not tested.
9. Tested at +25˚C.
4
CY74FCT16646T
CY74FCT162646T
Capacitance (TA = +25˚C, f = 1.0 MHz)
Description[8]
Symbol
Typ.
Max.
Unit
CIN
Input Capacitance
VIN = 0V
Conditions
4.5
6.0
pF
COUT
Output Capacitance
VOUT =0V
5.5
8.0
pF
Power Supply Characteristics
Parameter
Description
Test Conditions[10]
VCC=Max.
VIN<0.2V
VIN>VCC−0.2V
Min.
Typ.[5]
Max.
Unit
—
5
500
µA
—
0.5
1.5
mA
ICC
Quiescent Power Supply Current
∆ICC
Quiescent Power Supply Current VCC = Max.
TTL Inputs HIGH
VIN=3.4V[11]
ICCD
Dynamic Power Supply
Current[12]
VCC=Max.
Outputs Open
DIR=OE=GND
One-Bit Toggling
50% Duty Cycle
VIN=VCC or
VIN=GND
—
75
120
µA/MHz
IC
Total Power Supply Current[13]
VCC=Max.
Outputs Open
fo=10 MHz (CLKBA)
50% Duty Cycle
DIR=OE=GND
One-Bit Toggling
f1=5 MHz
50% Duty Cycle
VIN=VCC or
VIN=GND
—
0.8
1.7
mA
VIN=3.4V or
VIN=GND
—
1.3
3.2
VCC=Max.
Outputs Open
fo=10 MHz (CLKBA)
50% Duty Cycle
DIR=OE=GND
Sixteen-Bits Toggling
f1=2.5 MHz
50% Duty Cycle
VIN=VCC or
VIN=GND
—
3.8
6.5[14]
VIN=3.4V or
VIN=GND
—
8.3
20.0[14]
Notes:
10. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
11. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
12. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
13. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
14. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
5
CY74FCT16646T
CY74FCT162646T
Switching Characteristics Over the Operating Range[15]
CY74FCT16646T
Parameter
Description
CY74FCT16646AT
CY74FCT162646AT
Min.
Max.
Min.
Max.
Unit
Fig. No.[16]
tPLH
tPHL
Propagation Delay
Bus to Bus
1.5
9.0
1.5
6.3
ns
1, 2
tPZH
tPZL
Output Enable Time
DIR or OE to Bus
1.5
14.0
1.5
9.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
DIR or OE to Bus
1.5
9.0
1.5
6.3
ns
1, 7, 8
tPLH
tPHL
Propagation Delay
Clock to Bus
1.5
9.0
1.5
6.3
ns
1, 5
tPLH
tPHL
Propagation Delay
SBA or SAB to Bus
1.5
11.0
1.5
7.7
ns
1,5
tSU
Set-Up Time HIGH or
LOW Bus to Clock
2.0
—
2.0
—
ns
4
tH
Hold Time HIGH or
LOW Bus to Clock
1.5
—
1.5
—
ns
4
tW
Clock Pulse Width
HIGH or LOW
5.0
—
5.0
—
ns
6
tSK(O)
Output Skew[17]
—
0.5
—
0.5
ns
—
CY74FCT16646CT
CY74FCT162646CT
Parameter
Description
Min.
Max.
Unit
Fig. No.[16]
tPLH
tPHL
Propagation Delay
Bus to Bus
1.5
5.4
ns
1, 2
tPZH
tPZL
Output Enable Time
DIR or OE to Bus
1.5
7.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
DIR or OE to Bus
1.5
6.3
ns
1, 7, 8
tPLH
tPHL
Propagation Delay
Clock to Bus
1.5
5.7
ns
1, 5
tPLH
tPHL
Propagation Delay
SBA or SAB to Bus
1.5
6.2
ns
1,5
tSU
Set-Up Time HIGH or
LOW Bus to Clock
2.0
—
ns
4
tH
Hold Time HIGH or
LOW Bus to Clock
1.5
—
ns
4
tW
Clock Pulse Width
HIGH or LOW
5.0
—
ns
6
tSK(O)
Output Skew[17]
—
0.5
ns
—
Notes:
15. Minimum limits are specified but not tested on Propagation Delays.
16. See “Parameter Measurement Information” in the General Information section.
17. Skew any two outputs of the same package switching in the same direction. This parameter is ensured by design.
6
CY74FCT16646T
CY74FCT162646T
Ordering Information CY74FCT16646
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
5.4
CY74FCT16646CTPVC/PVCT
O56
56-Lead (300-Mil) SSOP
Industrial
6.3
CY74FCT16646ATPVC/PVCT
O56
56-Lead (300-Mil) SSOP
Industrial
9.0
CY74FCT16646TPVC/PVCT
O56
56-Lead (300-Mil) SSOP
Industrial
Ordering Information CY74FCT162646
Speed
(ns)
5.4
6.3
Ordering Code
Package
Name
Package Type
74FCT162646CTPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT162646CTPVC
O56
56-Lead (300-Mil) SSOP
74FCT162646CTPVCT
O56
56-Lead (300-Mil) SSOP
74FCT162646ATPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT162646ATPVC
O56
56-Lead (300-Mil) SSOP
74FCT162646ATPVCT
O56
56-Lead (300-Mil) SSOP
7
Operating
Range
Industrial
Industrial
CY74FCT16646T
CY74FCT162646T
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
8
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT162646ATPACT
ACTIVE
TSSOP
DGG
56
74FCT162646ATPVCG4
ACTIVE
SSOP
DL
56
74FCT162646ATPVCT
ACTIVE
SSOP
DL
74FCT162646CTPACT
ACTIVE
TSSOP
74FCT162646CTPVCG4
ACTIVE
74FCT162646CTPVCT
2000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162646ETPACT
OBSOLETE
TSSOP
DGG
56
TBD
Call TI
Call TI
74FCT162646ETPVCT
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
74FCT16646ATPVCG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16646ATPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16646CTPVCG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16646CTPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16646TPVCG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16646TPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162646ATPVC
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162646CTPVC
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162646ETPAC
OBSOLETE
TSSOP
DGG
56
TBD
Call TI
Call TI
CY74FCT162646ETPVC
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
CY74FCT16646ATPVC
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16646ATPVCT
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16646CTPVC
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16646CTPVCT
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
20
20
20
20
20
20
CY74FCT16646ETPVC
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
CY74FCT16646ETPVCT
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
CY74FCT16646TPVC
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16646TPVCT
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162646ATPACTE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
FCT162646ATPACTG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162646ATPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162646CTPACTE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162646CTPACTG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162646CTPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74FCT162646ATPACT
Package Package Pins
Type Drawing
TSSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
74FCT162646ATPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
74FCT162646CTPACT
TSSOP
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
74FCT162646CTPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
CY74FCT16646ATPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
CY74FCT16646CTPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
CY74FCT16646TPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74FCT162646ATPACT
TSSOP
DGG
56
2000
346.0
346.0
41.0
74FCT162646ATPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
74FCT162646CTPACT
TSSOP
DGG
56
2000
346.0
346.0
41.0
74FCT162646CTPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
CY74FCT16646ATPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
CY74FCT16646CTPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
CY74FCT16646TPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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