TI CY74FCT16823CTPVC

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16823T
CY74FCT162823T
18-Bit Registers
SCCS062 - August 1994 - Revised March 2000
Features
• FCT-E speed at 4.4 ns
• Power-off disable outputs permits live insertion
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of −40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16823T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162823T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
Functional Description
The CY74FCT16823T and the CY74FCT162823T 18-bit bus
interface registers are designed for use in high-speed,
low-power systems needing wide registers and parity. 18-bit
operation is achieved by connecting the control lines of the two
9-bit registers. Flow-through pinout and small shrink
packaging aids in simplifying board layout. The outputs are
designed with a power-off disable feature to allow live insertion
of boards.
The CY74FCT16823T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162823T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162823T is ideal for driving transmission lines.
Logic Block Diagrams
Pin Configuration
SSOP/TSSOP
Top View
1OE
1CLR
1CLK
1CLKEN
R
C
D
1Q1
1D1
FCT16823-1
TO 8 OTHER CHANNELS
1CLR
1
56
1CLK
1OE
2
55
1CLKEN
1Q1
3
54
1D1
GND
4
53
GND
1Q 2
5
52
1D2
1D3
1Q 3
6
51
VCC
7
50
VCC
1Q4
8
49
1D4
1Q5
9
48
1D5
1Q 6
10
47
1D6
GND
11
46
GND
1Q7
12
45
1 D7
1Q 8
13
44
1 D8
1Q 9
14
43
1D9
2Q1
42
2D1
41
2D2
2OE
2Q2
15
16
2Q3
17
40
2D3
2CLR
GND
18
39
GND
2Q4
19
38
2D4
2Q5
20
37
2D5
2Q6
21
36
2D6
VCC
22
35
VCC
2Q7
23
34
2 D7
2Q8
24
25
33
2 D8
GND
32
GND
2CLK
2CLKEN
R
C
D
2Q1
2D2
TO 8 OTHER CHANNELS
2Q9
26
31
2D9
2OE
27
30
2CLKEN
2CLR
28
29
2CLK
FCT16823-3
FCT16823-2
Copyright
© 2000, Texas Instruments Incorporated
CY74FCT16823T
CY74FCT162823T
Function Table[1]
Pin Description
Name
Inputs
Description
Outputs
Data Inputs
OE
CLR
CLKEN
CLK
D
Q
Function
CLK
Clock Inputs
H
X
X
X
X
Z
High Z
CLKEN
Clock Enable Inputs (Active LOW)
L
L
X
X
X
L
Clear
X
[2]
Hold
D
CLR
Asynchronous Clear Inputs (Active LOW)
L
H
H
OE
Output Enable Inputs (Active LOW)
H
H
L
L
Z
Three-State Outputs
H
H
L
H
Z
L
H
L
L
L
L
H
L
H
H
Q
X
Q
Load
Maximum Ratings[3, 4]
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Power Dissipation .......................................................... 1.0W
Storage Temperature ..................................... −55°C to +125°C
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Ambient Temperature with
Power Applied .................................................. −55°C to +125°C
Operating Range
DC Input Voltage .................................................−0.5V to +7.0V
Range
DC Output Voltage ..............................................−0.5V to +7.0V
Industrial
DC Output Current
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
Ambient
Temperature
VCC
−40°C to +85°C
5V ± 10%
Notes:
1. H = HIGH Voltage Level.
L = LOW Voltage Level.
X = Don’t Care.
Z = HIGH Impedance.
=LOW-to-HIGH transition.
2. Output level before indicated steady-state input conditions were established.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
2
CY74FCT16823T
CY74FCT162823T
Electrical Characteristics Over the Operating Range
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Test Conditions
Min.
Typ.[5]
Max.
2.0
V
0.8
[6]
VH
Input Hysteresis
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=−18 mA
IIH
Input HIGH Current
IIL
Unit
100
mV
−1.2
V
VCC=Max., VI=VCC
±1
µA
Input LOW Current
VCC=Max., VI=GND
±1
µA
IOZH
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=2.7V
±1
µA
IOZL
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
Short Circuit Current[7]
VCC=Max., VOUT=GND
−80
−200
mA
Current[7]
VCC=Max., VOUT=2.5V
−50
−180
mA
1
µA
Max.
Unit
IO
IOFF
Output Drive
Power-Off Disable
VCC=0V,
−0.7
V
−140
VOUT≤4.5V[8]
Output Drive Characteristics for CY74FCT16823T
Parameter
VOH
VOL
Min.
Typ.[5]
VCC=Min., IOH=−3 mA
2.5
3.5
VCC=Min., IOH=−15 mA
2.4
3.5
VCC=Min., IOH=−32 mA
2.0
3.0
Description
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=Min., IOL=64 mA
V
0.2
0.55
V
Min.
Typ.[5]
Output Drive Characteristics for CY74FCT162823T
Parameter
Max.
Unit
Output LOW
Voltage[7]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115
150
mA
IODH
Output HIGH
Voltage[7]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
−60
−115
−150
mA
VOH
Output HIGH Voltage
VCC=Min., IOH=−24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
IODL
Description
Test Conditions
V
0.3
0.55
V
Typ.[5]
Capacitance[9] (TA = +25˚C, f = 1.0 MHz)
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
Notes:
5. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
6. This input is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
8. Tested at +25˚C.
9. This parameter is specified but not tested.
3
CY74FCT16823T
CY74FCT162823T
Power Supply Characteristics
Parameter
Test Conditions[10]
Description
Min.
Typ.[5]
Max.
Unit
ICC
Quiescent Power Supply
Current
VCC=Max.
VIN<0.2V
VIN>VCC−0.2V
—
5
500
µA
∆ICC
Quiescent Power Supply
Current (TTL inputs HIGH)
VCC=Max.
VIN=3.4V[11]
—
0.5
1.5
mA
ICCD
Dynamic Power Supply
Current[12]
VCC=Max.,
One Input Toggling,
50% Duty Cycle,
Outputs Open,
OE=CLKEN=GND
VIN=VCC or
VIN=GND
—
75
120
µA/
MHz
IC
Total Power Supply Current[13]
VCC=Max.,
f0=10 MHz,
50% Duty Cycle,
Outputs Open,
One Bit Toggling,
OE=CLKEN=GND
at f1=5 MHz
VIN=VCC or
VIN=GND
—
0.8
1.7
mA
VIN=3.4V or
VIN=GND
—
1.3
3.2
VCC=Max.,
at f1=2.5 MHz,
50% Duty Cycle,
Outputs Open,
Eighteen Bits Toggling,
OE=CLKEN=GND
f0=10 MHz
VIN=VCC or
VIN=GND
—
4.2
7.1[14]
VIN=3.4V or
VIN=GND
—
9.2
22.1[14]
Notes:
10. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
11. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
12. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
13. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
14. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
4
CY74FCT16823T
CY74FCT162823T
Switching Characteristics Over the Operating Range[15]
CY74FCT16823AT
CY74FCT162823AT
Parameter
tPLH
tPHL
Description
Condition[16]
Min.
Max.
Unit
Fig.No.[16]
CL=50 pF
RL=500Ω
1.5
10.0
ns
1, 5
CL=300 pF[17]
RL=500Ω
1.5
20.0
Propagation Delay CLK to Q
tPHL
Propagation Delay CLR to Q
CL=50 pF
RL=500Ω
1.5
14.0
ns
1, 5
tPZH
tPZL
Output Enable Time OE to Q
CL=50 pF
RL=500Ω
1.5
12.0
ns
1, 7, 8
CL=300 pF[17]
RL=500Ω
1.5
23.0
CL=5 pF[17]
RL=500Ω
1.5
7.0
ns
1, 7, 8
CL=50 pF
RL=500Ω
1.5
8.0
CL=50 pF
RL=500Ω
3.0
—
ns
4
tPHZ
tPLZ
Output Disable Time OE to Q
tSU
Set-Up Time HIGH or LOW, D to CLK
tH
Hold Time HIGH or LOW, D to CLK
1.5
—
ns
4
tSU
Set-Up Time HIGH or LOW, CLKEN to CLK
3.0
—
ns
9
tH
Hold Time HIGH or LOW CLKEN to CLK
0.0
—
ns
9
tW
CLK Pulse Width HIGH or LOW
6.0
—
ns
5
tW
CLR Pulse Width LOW
6.0
—
ns
5
tREM
Recovery Time CLR to CLK
6.0
—
ns
6
—
0.5
ns
—
tSK(O)
Output
Skew[18]
Switching Characteristics Over the Operating Range[15]
CY74FCT16823CT CY74FCT16823ET
CY74FCT162823CT CY74FCT162823ET
Parameter
tPLH
tPHL
Description
Propagation Delay
CLK to Q
Condition[16]
Min.
Max.
Min.
Max.
Unit
Fig.No.[16]
CL=50 pF
RL=500Ω
1.5
6.0
1.5
4.4
ns
1, 5
CL=300 pF[17]
RL=500Ω
1.5
12.5
1.5
8.0
tPHL
Propagation Delay
CLR to Q
CL=50 pF
RL=500Ω
1.5
6.1
1.5
4.4
ns
1, 5
tPZH
tPZL
Output Enable Time
OE to Q
CL=50 pF
RL=500Ω
1.5
5.5
1.5
4.4
ns
1, 7, 8
CL=300 pF[17]
RL=500Ω
1.5
12.5
1.5
9.0
CL=5 pF[17]
RL=500Ω
1.5
5.2
1.5
3.6
ns
1, 7, 8
CL=50 pF
RL=500Ω
1.5
6.5
1.5
3.6
tPHZ
tPLZ
Output Disable Time
OE to Q
5
CY74FCT16823T
CY74FCT162823T
Switching Characteristics Over the Operating Range[15] (continued)
CY74FCT16823CT CY74FCT16823ET
CY74FCT162823CT CY74FCT162823ET
Parameter
Description
Condition[16]
Min.
Max.
Min.
Max.
Unit
Fig.No.[16]
CL=50 pF
RL=500Ω
2.0
—
1.5
—
ns
4
tSU
Set-Up Time
HIGH or LOW, D to CLK
tH
Hold Time
HIGH or LOW, D to CLK
1.5
—
0.0
—
ns
4
tSU
Set-Up Time
HIGH or LOW, CLKEN to CLK
3.0
—
2.5
—
ns
9
tH
Hold Time HIGH or LOW
CLKEN to CLK
0.0
—
0.0
—
ns
9
tW
CLK Pulse Width
HIGH or LOW
3.3
—
3.3
—
ns
5
tW
CLR Pulse Width LOW
3.3
—
3.0
—
ns
5
tREM
Recovery Time
CLR to CLK
6.0
—
3.0
—
ns
6
tSK(O)
Output Skew[18]
—
0.5
—
0.5
ns
—
Notes:
15. Minimum limits are specified but not tested on Propagation Delays.
16. See “Parameter Measurement Information” in the General Information section.
17. These limits are specified but not tested.
18. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT16823
Speed
(ns)
4.4
6.0
10.0
Ordering Code
Package
Name
Package Type
CY74FCT16823ETPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT16823ETPVC/PVCT
O56
56-Lead (300-Mil) SSOP
CY74FCT16823CTPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT16823CTPVC/PVCT
O56
56-Lead (300-Mil) SSOP
CY74FCT16823ATPACT
Z56
56-Lead (240-Mil) TSSOP
Operating
Range
Industrial
Industrial
Industrial
Ordering Information CY74FCT162823
Speed
(ns)
4.4
6.0
10.0
Ordering Code
Package
Name
Package Type
74FCT162823ETPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT162823ETPVC
O56
56-Lead (300-Mil) SSOP
74FCT162823ETPVCT
O56
56-Lead (300-Mil) SSOP
74FCT162823CTPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT162823CTPVC
O56
56-Lead (300-Mil) SSOP
74FCT162823CTPVCT
O56
56-Lead (300-Mil) SSOP
74FCT162823ATPACT
Z56
56-Lead (240-Mil) TSSOP
6
Operating
Range
Industrial
Industrial
Industrial
CY74FCT16823T
CY74FCT162823T
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
7
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  2000, Texas Instruments Incorporated