EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED – 0.5W EHP-A09/SUG31-PU5/TR Features Feature of the device: small package with high efficiency Typical view angle: 120° ESD protection. Soldering methods: SMT Grouping parameter: luminous Intensity, wavelength, forward voltage. z Typical optical efficiency: 50 lm/W. z Thermal resistance (junction to sink): 80 K/W z The product itself will remain within RoHS compliant version. z z z z z Applications z z z Interior automotive lighting (e.g. dashboard backlighting) backlighting (illuminated advertising, general lighting) Signal and symbol luminaries z Marker lights (e.g. steps, exit ways, etc.) Scanner z Materials Items Description Reflector Heat resistant polymer Encapsulating Resin Colorless clear resin Electrodes Ag plating Die attach Silver paste Chip InGaN Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 1/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Dimensions N A N N C N Package mark Notes: 1. Dimensions are in millimeters. 2. Tolerances unless dimensions ±0.25mm. Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 2/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Maximum Ratings (T Ambient=25ºC) Parameter Symbol Rating Unit DC Operating Current IF 150 mA Pulsed Forward Current IF 300 mA ESD 2000 V Junction Temperature Tj 125 Operating Temperature Topr -40 ~ +100 °C °C Storage Temperature Tstg -40 ~ +100 °C Power Dissipation Pd 1 W Junction To Heat-Sink Thermal Resistance Rth 80 K/W ESD Sensitivity Electro-Optical Characteristics (TAmbient=25ºC) Parameter Luminous Intensity(1) Wavelength(2) Forward Voltage(3) Bin Min Typ. Max C2 3550 ---- 4500 D1 4500 ---- 5600 5600 ---- 7100 E1 7100 ---- 9000 E2 9000 ---- 11200 G1 520 ---- 525 525 ---- 530 G3 530 ---- 535 V2 3.25 ---- 3.55 3.55 ---- 3.85 3.85 ---- 4.15 ---- 120 ---- D2 G2 V3 Symbol Iv λd VF V4 Viewing Angle(4) ---- 2θ1/2 Unit Condition mcd nm IF=150mA V deg Note. 1. Luminous Intensity measurement tolerance: ±10% 2. Wavelength measurement tolerance : ±1nm 3. Forward Voltage measurement tolerance: ±0.1V 4. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 3/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Typical Electro-Optical Characteristics Curves Forward Voltage vs Forward Current, T Ambient=25ºC 1.0 3.8 0.8 3.6 Forward Voltage (V) Relative Luiminous Intensity Relative Spectral Distribution, IF=150mA, T Ambient=25ºC 0.6 0.4 0.2 3.4 3.2 3.0 2.8 0.0 400 450 500 550 600 650 0 700 50 100 Relative Luminous Intensity vs Forward Current, T Ambient=25ºC 200 250 300 Ambient Temperature & Operating Current Derating based on TJMAX = 125℃ 1.6 250 Forward Current (mA) Relative Luminous Intensity 150 Forward Current (mA) Wavelength(nm) 1.4 1.2 1.0 0.8 0.6 0.4 200 150 100 50 0.2 0 50 100 150 200 250 300 0 Forward Current (mA) Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 20 40 60 80 100 120 Ambient Temperature (οC) Rev. 1.0 140 Page: 4/10 Prepared by: Terry Hsu 160 EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Typical Representative Spatial Radiation Pattern Relative Luminous Intensity 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2θ) Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 5/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Label explanation CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Domain Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is ±0.1mm. Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 6/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Carrier Tape Dimensions: Loaded quantity 1000 PCS per reel Package mark Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is ±0.1mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Desiccant Rev. 1.0 Label Page: 7/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Reliability Test Items Stress Test Stress Condition Stress Duration Reflow Tsol=260°C, 10sec, 6min(total) 2 times DC Operating Life Ta=25°C , IF=150mA 1000 hours High Temperature Storage Ta=100°C 1000 hours High Temperature Operation Life #1 Ta=55°C, IF=150mA 1000 hours High Temperature Operation Life #2 Ta=85℃, IF=120mA 1000hours Low Temperature Storage Ta=-40°C 1000 hours High Temperature/ Humidity Reverse Bias Ta=85℃ , RH=85% 1000hours High Temperature/ Humidity Operation Life Ta=85°C , RH=60%, IF=120mA 1000 hours H：＋100°C Temperature Cycle Shock 15min. 1000 Cycles '∫ 5min. 'L：－40°C 15min. H：＋110°C Thermal 300 Cycles '∫ 5min. 'L：－40°C 15min. H：＋85°C Power Temperature Cycle 15min. 5min. 300 Cycles Pulse Test '∫ 10sec. 'L：－40°C 5min. Ta=25℃, IF=1000mA 30mS on/ 2500mS off 30000 times ESD Human Body Model 2000V, Interval:0.5sec 3 times ESD Machine Model 200V, Interval:0.5sec 3 times *lm: Brightness attenuate difference(1000hrs)＜50% *VF: Forward voltage difference＜20% Notes: All reliability items are tested under superior thermal management with 1.5 x 1.5 cm2 MCPCB. Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 8/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Precautions For Use 1. Over-current-proof Though EHP-A09 has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage difference may cause enormous current shift and burn out failure would happen. 2. Storage i. Do not open the moisture proof bag before the devices are ready to use. ii. Before the package is opened, LEDs should be stored at temperature less than 30℃and humidity less than 90%. iii. LEDs should be used within a year. iv. After the package is opened, LEDs should be stored at temperature less than 30℃and humidity less than 70%. v. LEDs should be used within 168 hours (7 days) after the package is opened. vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following the conditions: pre-curing at 60±5℃ for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A09 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximate 0.5W of thermal energy at 150mA operation. ii. Special thermal designs are also recommended to take in heat dissipation management, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of dies might be over the limit at high current driving condition and LEDs’ lifetime might be decreases dramatically. iv. For further thermal management suggestions, please consult Everlight Design Guide or local representatives for assistance. Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 9/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR 4. Soldering Condition 4-1. For Reflow process i. EHP-A09 series are suitable for SMT process. ii. Lead reflow soldering temperature profile iii. Reflow soldering should not be done more than two times. iv. In soldering process, stress on the LEDs during heating should be avoided. v. After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. http://www.everlight.com Device No. : DSE-A09-003 Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 10/10 Prepared by: Terry Hsu