EL7532 ® Data Sheet August 12, 2005 FN7435.5 Monolithic 2A Step-Down Regulator Features The EL7532 is a synchronous, integrated FET 2A step-down regulator with internal compensation. It operates with an input voltage range from 2.5V to 5.5V, which accommodates supplies of 3.3V, 5V, or a single Li-Ion battery source. The output can be externally set from 0.8V to VIN with a resistive divider. • 2A continuous current (from -40°C to +85°C) The EL7532 features PWM mode control. The operating frequency is typically 1.5MHz. Additional features include a 100ms Power-On-Reset output, <1µA shut-down current, short-circuit protection, and over-temperature protection. The EL7532 is available in the 10-pin MSOP package, making the entire converter occupy less than 0.18 in2 of PCB area with components on one side only. The package is specified for operation over the full -40°C to +85°C temperature range. • 1.5MHz (typ.) switching frequency • 100ms Power-On-Reset output (POR) • Internally-compensated voltage mode controller • Up to 94% efficiency • <1µA shut-down current • Overcurrent and over temperature protection • Pb-Free plus anneal available (RoHS compliant) Applications • Bar code readers PACKAGE TAPE & REEL PKG. DWG. # EL7532IY (BABAA) 10-Pin MSOP - MDP0043 EL7532IY-T7 (BABAA) 10-Pin MSOP 7” MDP0043 EL7532IY-T13 (BABAA) 10-Pin MSOP 13” MDP0043 EL7532IYZ (BAARA) (Note) 10-Pin MSOP (Pb-free) - MDP0043 EL7532IYZ-T7 (BAARA) (Note) 10-Pin MSOP (Pb-free) 7” MDP0043 EL7532IYZ-T13 (BAARA) (Note) • Max height 1.1mm MSOP10 • PDA and pocket PC computers Ordering Information PART NUMBER (BRAND) • Less than 0.18 in2 footprint for the complete 2A converter • ADSL Modems • Portable instruments • Li-Ion battery powered devices 10-Pin MSOP (Pb-free) 13” MDP0043 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. • ASIC/FPGA/DSP supplies • Set Top Boxes Typical Application Schematic VIN (2.5V-6V) C1 10µF R3 100Ω VIN LX VDD C3 0.1µF VO (1.8V@ 2A) VO L1 1.8µH C2 10µF EL7532 EN FB POR SGND RSI PGND R2* 124kΩ R1* 100kΩ * VO = 0.8V * (1 + R2 / R1) Pinout 1 SGND FB 10 2 PGND VO 9 3 LX POR 8 4 VIN EN 7 5 VDD RSI 6 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004, 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. EL7532 Absolute Maximum Ratings (TA = 25°C) Thermal Information VIN, VDD, POR to SGND . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V LX to PGND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VIN + +0.3V) RSI, EN, VO, FB to SGND . . . . . . . . . . . . . . . -0.3V to (VIN + +0.3V) PGND to SGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4A ESD Classification Human Body Model (Per JESD22-A114-B) . . . . . . . . . . . . Class 2 Thermal Resistance (Typical) θJA (°C/W) MSOP10 Package (Note 1) . . . . . . . . . . . . . . . . . . . 115 Operating Ambient Temperature . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA NOTE: 1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. Electrical Specifications PARAMETER VDD = VIN = VEN = 3.3V, C1 = C2 = 10µF, L = 1.8µH, VO = 1.8V, unless otherwise specified. DESCRIPTION CONDITIONS MIN TYP MAX UNIT 790 800 810 mV 250 nA 2.5 5.5 V DC CHARACTERISTICS VFB Feedback Input Voltage IFB Feedback Input Current VIN, VDD Input Voltage VIN,OFF Minimum Voltage for Shutdown VIN falling 2 2.2 V VIN,ON Maximum Voltage for Startup VIN rising 2.2 2.4 V IDD Supply Current PWM, VIN = VDD = 5V 400 500 µA EN = 0, VIN = VDD = 5V 0.1 1 µA PMOS FET Resistance VDD = 5V, wafer test only 52 80 mΩ RDS(ON)-NMOS NMOS FET Resistance VDD = 5V, wafer test only 35 65 mΩ RDS(ON)-PMOS ILMAX Current Limit (GBD) TOT,OFF Over-temperature Threshold (GBD) TOT,ON 3 A T rising 145 °C Over-temperature Hysteresis (GBD) T falling 130 °C IEN, IRSI EN, RSI Current VEN, VRSI = 0V and 3.3V VEN1, VRSI1 EN, RSI Rising Threshold VDD = 3.3V VEN2, VRSI2 EN, RSI Falling Threshold VDD = 3.3V VPOR Minimum VFB for POR, WRT Targeted VFB Value VFB rising VOLPOR POR Voltage Drop ISINK = 5mA 35 VLINEREG Line Regulation (GBD) VIN = 2.5V to 6V, IOUT = 2A, VOUT = 1.8V 0.1 %/V VLOADREG Load Regulation (GBD) VIN = 3.3V, VOUT = 1.8V, IOUT = 0 to 2A 0.5 % VFB falling -1 1 V 2.4 V 0.8 V 95 % 86 % 70 mV AC CHARACTERISTICS FPWM PWM Switching Frequency tRSI Minimum RSI Pulse Width (GBD) tSS Soft-start Time (GBD) tPOR Power On Reset Delay Time (GBD) 1.35 Guaranteed by design 1.5 1.65 MHz 25 50 ns 650 80 100 µs 120 ms GBD = Guaranteed By Design 2 FN7435.5 August 12, 2005 EL7532 Pin Descriptions PIN NUMBER PIN NAME PIN FUNCTION 1 SGND Negative supply for the controller stage 2 PGND Negative supply for the power stage 3 LX Inductor drive pin; high current digital output with average voltage equal to the regulator output voltage 4 VIN Positive supply for the power stage 5 VDD Power supply for the controller stage 6 RSI Resets POR timer; Connect to ground if not used 7 EN Enable; Can be connected directly to the VIN for enable 8 POR 9 VO Output voltage sense pin 10 FB Voltage feedback input; connected to an external resistor divider between VO and SGND for variable output Power on reset open drain output; Leave open if not used Block Diagram 5 9 VDD VO + - 10pF 124K 10 FB PWM COMPENSATION 100K CLOCK 1.5MHz 7 EN 4 CURRENT LIMIT 5M + VIN + PWM COMPARATOR P-DRIVER 1.8µ LX CONTROL LOGIC RAMP GENERATOR 1.8V 2A 3 EN SOFTSTART 10µF 10µF N-DRIVER 2.5V5V + – BANDGAP REFERENCE 1 6 UNDERVOLTAGE LOCKOUT PGND 100K TEMPERATURE SENSE SGND 2 POR PG 8 POR RSI 3 FN7435.5 August 12, 2005 EL7532 100 100 80 80 60 VO=1.2V EFFICIENCY (%) EFFICIENCY (%) Typical Performance Curves VO=3.3V 40 VO=1.8V 20 60 VO=1.8V VO=2.5V 40 VO=1.2V 20 MAXIMUM EFFICIENCY, η=95% MAXIMUM EFFICIENCY, η=95% 0 0 0 0.5 1 1.5 2 2.5 0 0.5 1 IOUT (A) 1.5 2 2.5 IOUT (A) FIGURE 1. EFFICIENCY vs IOUT @ VIN=5V FIGURE 2. EFFICIENCY vs IOUT @ VIN=3.3V 100 1 IO=2A VO=0.8V 0.6 VO CHANGES (%) EFFICIENCY (%) 80 60 VO=1.8V 40 VO=1.2V 20 0.2 VO=2.5V -0.2 VO=3.3V -0.6 MAXIMUM EFFICIENCY, η=94% 0 0 0.5 1 1.5 2 -1 2.5 2.5 3 3.5 4 IOUT (A) 1 0.6 0.6 VO CHANGES (%) VO CHANGES (%) 5.5 6 FIGURE 4. LINE REGULATION 1 VO=0.8V VO=3.3V -0.2 5 VIN (V) FIGURE 3. EFFICIENCY vs IOUT @ VIN=2.5V 0.2 4.5 -0.6 0.2 VO=0.8V VO=2.5V -0.2 -0.6 -1 -1 0 0.5 1 1.5 2 IOUT (A) FIGURE 5. LOAD REGULATION @ VIN=5V 4 2.5 0 0.5 1 1.5 2 2.5 IOUT (A) FIGURE 6. LOAD REGULATION @ VIN=3.3V FN7435.5 August 12, 2005 EL7532 Typical Performance Curves (Continued) 1 VO CHANGES (%) ∆VIN 100mV/d VO=0.8V 0.5 0.5A/d iL 0 VO=1.8V VLX 2V/d ∆VO 10mV/d -0.5 -1 0 0.5 1 1.5 2 2.5 1µs/d IOUT (A) FIGURE 7. LOAD REGULATION @ VIN=2.5V FIGURE 8. LOAD REGULATION @ VIN=2.5V VIN (1V/d) VIN (2V/d) VO (2V/d) IIN (0.5A/d) POR (2V/d) VO (1V/d) 50ms/d 0.5ms/d FIGURE 9. START-UP 1 FIGURE 10. START-UP 2 VIN (2V/d) ∆VO 50mV/d VO (2V/d) RSI (2V/d) 2A IO POR (2V/d) 0.1A 50ms/d 0.5ms/d FIGURE 11. POR FUNCTION FIGURE 12. TRANSIENT RESPONSE 5 FN7435.5 August 12, 2005 EL7532 Typical Performance Curves JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1 486mW 0.5 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 870mW 0.9 0.4 θ M JA = 0.3 POWER DISSIPATION (W) POWER DISSIPATION (W) 0.6 (Continued) SO P8 /1 20 0 6° C/ W 0.2 0.1 0.8 0.7 θ M SO P8 /1 11 0 5° C/ W JA = 0.6 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 85 100 125 AMBIENT TEMPERATURE (°C) FIGURE 13. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 6 0 0 25 50 75 85 100 125 AMBIENT TEMPERATURE (°C) FIGURE 14. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN7435.5 August 12, 2005 EL7532 Applications Information Product Description The EL7532 is a synchronous, integrated FET 2A step-down regulator which operates from an input of 2.5V to 6V. The output voltage is user-adjustable with a pair of external resistors. The internally-compensated controller makes it possible to use only two ceramic capacitors and one inductor to form a complete, very small footprint 2A DC-DC converter. Start-Up and Shut-Down When the EN pin is tied to VIN, and VIN reaches approximately 2.4V, the regulator begins to switch. The output voltage is gradually increased to ensure proper softstart operation. When the EN pin is connected to a logic low, the EL7532 is in the shut-down mode. All the control circuitry and both MOSFETs are off, and VOUT falls to zero. In this mode, the total input current is less than 1µA. When the EN reaches logic HI, the regulator repeats the start-up procedure, including the soft-start function. PWM Operation In the PWM mode, the P channel MOSFET and N channel MOSFET always operate complementary. When the PMOSFET is on and the NMOSFET off, the inductor current increases linearly. The input energy is transferred to the output and also stored in the inductor. When the P channel MOSFET is off and the N channel MOSFET on, the inductor current decreases linearly, and energy is transferred from the inductor to the output. Hence, the average current through the inductor is the output current. Since the inductor and the output capacitor act as a low pass filter, the duty cycle ratio is approximately equal to VO divided by VIN. The output LC filter has a second order effect. To maintain the stability of the converter, the overall controller must be compensated. This is done with the fixed internally compensated error amplifier and the PWM compensator. Because the compensations are fixed, the values of input and output capacitors are 10µF to 22µF ceramic. The inductor is nominally 1.8µH, though 1.5µH to 2.2µH can be used. 100% Duty Ratio Operation EL7532 utilizes CMOS power FET's as the internal synchronous power switches. The upper switch is a PMOS and lower switch a NMOS. This not only saves a boot capacitor, it also allows 100% turn-on of the upper PFET switch, achieving VO close to VIN. The maximum achievable VO is, V O = V IN – ( R L + R DSON1 ) × I O 7 Where RL is the DC resistance on the inductor and RDSON1 the PFET on-resistance, nominal 70mΩ at room temperature with tempco of 0.2mΩ/°C. As the input voltage drops gradually close or even below the preset VO, the converter gets into 100% duty ratio. At this condition, the upper PFET needs some minimum turn-off time if it is turned off. This off-time is related to input/output conditions. This makes the duty ratio appear randomly and increases the output ripple somewhat until the 100% duty ratio is reached. A larger output capacitor could reduce the random-looking ripple. Users need to verify if this condition has an adverse effect on the overall circuit if close to 100% duty ratio is expected. RSI/POR Function When powering up, the open-collector Power-On-Reset output holds low for about 100ms after VO reaches the preset voltage. When the active-HI reset signal RSI is issued, POR goes to low immediately and holds for the same period of time after RSI comes back to LOW. The output voltage is unaffected. (Please refer to the timing diagram). When the function is not used, connect RSI to ground and leave open the pull-up resister R4 at POR pin. The POR output also serves as a 100ms delayed Power Good signal when the pull-up resister R4 is installed. The RSI pin needs to be directly (or indirectly through a resister R6) connected to Ground for this to function properly. VO MIN 25ns RSI 100ms 100ms POR FIGURE 15. RSI & POR TIMING DIAGRAM Output Voltage Selection Users can set the output voltage of the converter with a resister divider, which can be chosen based on the following formula: R V O = 0.8 × 1 + ------2- R 1 Component Selection Because of the fixed internal compensation, the component choice is relatively narrow. We recommend 10µF to 22µF multi-layer ceramic capacitors with X5R or X7R rating for both the input and output capacitors, and 1.5µH to 2.2µH inductance for the inductor. FN7435.5 August 12, 2005 EL7532 At extreme conditions (VIN < 3V, IO > 0.7A, and junction temperature higher than 75°C), input cap C1 is recommended to be 22µF. Otherwise, if any of the above 3 conditions is not true, C1 can remain as low as 10µF. Layout Considerations The RMS current present at the input capacitor is decided by the following formula: • Separate the Power Ground ( ) and Signal Ground ( ); connect them only at one point right at the pins V O × ( V IN - V O ) I INRMS = ------------------------------------------------ × I O V IN This is about half of the output current IO for all the VO. This input capacitor must be able to handle this current. The inductor peak-to-peak ripple current is given as: ( V IN - V O ) × V O ∆I IL = ------------------------------------------L × V IN × f S The layout is very important for the converter to function properly. The following PC layout guidelines should be followed: • Place the input capacitor as close to VIN and PGND pins as possible • Make the following PC traces as small as possible: - from LX pin to L - from CO to PGND • If used, connect the trace from the FB pin to R1 and R2 as close as possible • Maximize the copper area around the PGND pin • L is the inductance • fS the switching frequency (nominally 1.5MHz) The inductor must be able to handle IO for the RMS load current, and to assure that the inductor is reliable, it must handle the 3A surge current that can occur during a current limit condition. • Place several via holes under the chip to additional ground plane to improve heat dissipation The demo board is a good example of layout based on this outline. Please refer to the EL7532 Application Brief. Current Limit and Short-Circuit Protection The current limit is set at about 3A for the PMOS. When a short-circuit occurs in the load, the preset current limit restricts the amount of current available to the output, which causes the output voltage to drop below the preset voltage. In the meantime, the excessive current heats up the regulator until it reaches the thermal shut-down point. Thermal Shut-Down Once the junction reaches about 145°C, the regulator shuts down. Both the P channel and the N channel MOSFETs turn off. The output voltage will drop to zero. With the output MOSFETs turned off, the regulator will soon cool down. Once the junction temperature drops to about 130°C, the regulator will restart again in the same manner as the EN pin connects to logic HI. Thermal Performance The EL7532 is in a fused-lead MSOP10 package. Compared to the regular MSOP10 package, the fused-lead package provides lower thermal resistance. The typical θJA of 115°C/W (See Thermal Information section in spec table) can be improved by maximizing the copper area around the pins. A θJA of 100°C/W can be achieved on a 4-layer board and 125°C/W on a 2-layer board. Refer to Intersil’s Tech Brief, TB379, for more information on thermal resistance. 8 FN7435.5 August 12, 2005 EL7532 MSOP Package Outline Drawing NOTE: The package drawing shown here may not be the latest version. To check the latest revision, please refer to the Intersil website at <http://www.intersil.com/design/packages/index.asp> All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 9 FN7435.5 August 12, 2005