Revised August 2005 FSAV430 Low Voltage 1.1GHz 4 Channel 2:1 Video Switch General Description The FSAV430 is a high performance Quad SPDT (2-to-1 multiplexer/demultiplexer) video switch designed specifically for switching high definition YPbPr and computer RGB (up to UXGA) signals. The bandwidth of this device is 1.1GHz (Typ) which allows signals to pass with minimal edge and phase distortion. Image integrity is maintained with low crosstalk, high OFF-Isolation and low differential gain and phase. The low On Resistance (4.5 typical) minimizes signal insertion loss. Low voltage operation (3V), low power consumption (1uA maximum) and small scale packaging (including leadless DQFN) make this device ideal for a broad range of applications. : Features O 40dB OFF Isolation at 30MHz O 60dB non-adjacent channel crosstalk at 30MHz O 4.5: typical On Resistance (RON) O 3dB bandwidth: 1.1GHz O Low power consumption (1uA max) O Control input: TTL compatible O Bidirectional operation Applications O RGB Video Switch in LCD, plasma and projection displays O DVD-RW Ordering Code: Order Package Number Number Package Description FSAV430BQX (Note 1) MLP016E Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm FSAV430QSC MQA16A 16-Lead Quarter Size Small Outline Package (QSOP), JEDEC MO-137, 0.150" Wide FSAV430MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: DQFN package available in Tape and Reel only. © 2005 Fairchild Semiconductor Corporation DS500890 www.fairchildsemi.com FSAV430 Low Voltage 1.1GHz 4 Channel 2:1 Video Switch December 2004 FSAV430 Analog Symbol Connection Diagrams Pin Assignments for QSOP and TSSOP Pad Assignments for DQFN Pin Descriptions Truth Table Pin Name Description S OE Function OE Bus Switch Enable X H Disconnect S Select Input L L A = B1 A Bus A H L A = B2 B1–B2 Bus B www.fairchildsemi.com 2 Supply Voltage (VCC) DC Switch Voltage (VS) DC Input Voltage (VIN) (Note 3) DC Input Diode Current (lIK) VIN 0V DC Output (IOUT) Sink Current DC VCC/GND Current (ICC/IGND) Storage Temperature Range (TSTG) Recommended Operating Conditions (Note 4) 0.5V to 4.6V 0.5V to VCC 0.05V 0.5V to 4.6V 50 mA Power Supply Operating (VCC) 128 mA 3.0V to 3.6V Input Voltage (VIN) 0V to VCC Output Voltage (VOUT) 0V to VCC Input Rise and Fall Time (tr, tf) r100 mA 65qC to 150 qC Switch Control Input 0 ns/V to 5 ns/V Switch I/O ESD 0 ns/V to DC 40 qC to 85 qC Free Air Operating Temperature (TA) Human Body Model 4kV Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions tables will define the conditions for actual device operation. Note 3: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 4: Unused control inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol Parameter VCC (V) Analog Signal Range TA = 40 qC to 85 qC Min Typ (Note 5) 0 Max Units 2.0 V 1.2 3.0 IIN = 18 mA VIK Clamp Diode Voltage VIH HIGH Level Input Voltage 3.0 - 3.6 VIL LOW Level Input Voltage 3.0 - 3.6 0.8 V II Input Leakage Current 3.6 r1.0 PA 0 d VIN d 3.6V IOFF OFF-STATE Leakage Current 3.6 r1.0 PA 0 d A, B d VCC RON Switch On Resistance 2.0 V Conditions V 3.0 5.0 7.0 : 3.0 4.5 6.0 : 1.0 (Note 6) VIN = 1.0V RI = 75 :, ION = 13 mA VIN = 2.0V RI = 75 :, ION = 26 mA RFLAT(ON) On Resistance Flatness (Note 7) 3.0 : IOUT = 13 mA, VIN = 0 to VCC ICC Quiescent Supply Current 3.6 1.0 PA VIN = VCC or GND, IOUT = 0 ' ICC Increase in ICC per Input 3.6 30.0 uA One Input at 3.0V Other Inputs at VCC or GND Note 5: Typical values are at TA = 25qC Note 6: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B) pins. Note 7: Flatness is defined as the difference between the maximum and minimum value On Resistance over the specified range of conditions. 3 www.fairchildsemi.com FSAV430 Absolute Maximum Ratings(Note 2) FSAV430 AC Electrical Characteristics Symbol Parameter VCC (V) TA = 40qC to 85qC Min Typ (Note ) Turn ON Time S-to-Bus A 3.0 to 3.6 4.8 7.0 Output Enable Time OE-to-A 3.0 to 3.6 4.5 6.8 Turn OFF Time S-to-Bus A 3.0 to 3.6 2.2 4.0 Output Disable Time OE-to-A 3.0 to 3.6 2.2 4.0 DG Differential Gain 3.0 to 3.6 0.2 DP Differential Phase 3.0 to 3.6 0.1 OIRR Non-Adjacent OFF-Isolation 3.0 to 3.6 XTALK Non-Adjacent Channel Crosstalk 3.0 to 3.6 BW 3dB Bandwidth tON Units Max ns tOFF Conditions Bn = 2.0V Figures 8, 9 Figures 8, 9 ns Bn = 2.0V % RL = 75:, f= 3.58MHz Figures 2, 3 Degree RL = 75:, f= 3.58MHz Figures 2, 3 40.0 dB f = 30MHz, RL = 75: Figures 4, 10 60.0 dB RL = 75:, f= 30MHz Figures 5, 11 3.0 to 3.6 1.1 GHz 3.0 to 3.6 800 3.0 to 3.6 650 3.0 to 3.6 600 RL = 50: (DQFN) RL = 50: (QSOP and TSSOP) MHz RL = 75: (DQFN) RL = 75: (QSOP and TSSOP) Note 8: Typical values are at VCC = 3.3V and TA = 25qC Capacitance Symbol Parameter TA = 40qC to 85qC Units Conditions Typ (Note ) CIN Control Pin Input Capacitance 2.5 pF VCC = 0V CON A/B ON Capacitance 12.0 pF VCC = 3.3V, OE = 0V COFF Port B OFF Capacitance 4.0 pF VCC and OE = 3.3V Note 9: Typical values are at VCC = 3.3V and TA = 25qC FIGURE 1. Gain vs. Frequency www.fairchildsemi.com Figure Number 4 Figures 1, 12 FSAV430 FIGURE 2. Differential Gain vs. dc bias FIGURE 3. Differential Phase vs. dc bias FIGURE 4. OFF Isolation FIGURE 5. OFF Crosstalk vs. Frequency 5 www.fairchildsemi.com FSAV430 FIGURE 6. RON Switch On Resistance, ION = 13mA, VCC = 3.0V FIGURE 7. RON Switch On Resistance, ION = 26mA, VCC = 3.0V www.fairchildsemi.com 6 FSAV430 AC Loading and Waveforms Note: Input driven by 50 : source terminated in 50 : Note: CL includes load and stray capacitance Note: Input PRR = 1.0 MHz, tW = 500 ns FIGURE 8. AC Test Circuit FIGURE 9. AC Waveforms FIGURE 10. OFF Isolation Test FIGURE 11. Crosstalk Test FIGURE 12. Bandwidth Test 7 www.fairchildsemi.com FSAV430 Tape and Reel Specification Tape Format for DQFN Package Tape Number Cavity Cover Tape Designator Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed Carrier 2500/3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed BQX TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size 12 mm www.fairchildsemi.com A B C D N W1 W2 13.0 0.059 0.512 0.795 7.008 0.488 0.724 (330) (1.50) (13.00) (20.20) (178) (12.4) (18.4) 8 FSAV430 Physical Dimensions inches (millimeters) unless otherwise noted Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016E 9 www.fairchildsemi.com FSAV430 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Quarter Size Small Outline Package (QSOP), JEDEC MO-137, 0.150" Wide Package Number MQA16A www.fairchildsemi.com 10 FSAV430 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC16 Technology Description The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its 74LVX3L384 (FST3384) bus switch product. 11 www.fairchildsemi.com FSAV430 Low Voltage 1.1GHz 4 Channel 2:1 Video Switch DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION As used herein: provided in the labeling, can be reasonably expected to result in significant injury to the user. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or 2. A critical component is any component of a life support (b) support or sustain life, or (c) whose failure to perform device or system whose failure to perform can be reasonwhen properly used in accordance with instructions for use ably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. www.fairchildsemi.com 12