HCTS244MS Radiation Hardened Octal Buffer/Line Driver, Three-State September 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T20 TOP VIEW • 3 Micron Radiation Hardened CMOS SOS • Total Dose 200K RAD (Si)/s • SEP Effective LET No Upsets: >100 MEV-cm2/mg • Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/ Bit-Day (Typ) • Dose Rate Survivability: >1 x 1012 RAD (Si)/s 10 • Dose Rate Upset >10 RAD (Si)/s 20ns Pulse • Latch-Up Free Under Any Conditions • Fanout (Over Temperature Range) - Bus Driver Outputs - 15 LSTTL Loads • Military Temperature Range: -55oC to +125oC OE 1 1 20 A0 1 2 19 2 OE VCC Y3 2 3 18 1 Y0 A1 1 4 17 2 A3 Y2 2 5 16 1 Y1 A2 1 6 15 2 A2 Y1 2 7 14 1 Y2 A3 1 8 13 2 A1 Y0 2 9 12 1 Y3 10 11 2 A0 GND • Significant Power Reduction Compared to LSTTL ICs • DC Operating Voltage Range: 4.5V to 5.5V 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (FLATPACK) MIL-STD-1835 CDFP4-F20 TOP VIEW • LSTTL Input Compatibility - VIL = 0.8V Max - VIH = VCC/2 Min • Input Current Levels Ii ≤ 5µA at VOL, VOH Description The Intersil HCTS244MS is a Radiation Hardened NonInverting Octal Buffer/Line Driver, Three-State, with two active-low output enables. The HCTS244MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. VCC OE 1 1 20 A0 1 2 19 2 OE Y3 2 3 18 1 Y0 A1 1 4 17 2 A3 Y2 2 5 16 1 Y1 A2 1 6 15 2 A2 Y1 2 7 14 1 Y2 A3 1 8 13 2 A1 Y0 2 9 12 1 Y3 10 11 2 A0 GND The HCTS244MS is supplied in a 20 lead Ceramic flatpack (K suffix) or a SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE HCTS244DMSR -55oC to +125oC Intersil Class S Equivalent 20 Lead SBDIP HCTS244KMSR -55oC to +125oC Intersil Class S Equivalent 20 Lead Ceramic Flatpack +25oC Sample 20 Lead SBDIP HCTS244K/Sample +25oC Sample 20 Lead Ceramic Flatpack HCTS244HMSR +25oC Die Die DB NA HCTS244D/Sample CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 602 Spec Number File Number 518616 2133.2 HCTS244MS Functional Diagram 1Y0 18 N P 1Y1 16 N P 1Y2 14 N P 1Y3 12 N 2Y0 9 P P N 2Y1 7 P N 2Y2 5 P N 2Y3 3 P N 19 2OE 1 1OE 2 1A0 4 1A1 6 1A2 8 1A3 11 2A0 13 2A1 15 2A2 17 2A3 TRUTH TABLE INPUTS H L X Z = = = = OUTPUT 1OE, 2OE A Y L L L L H H H X Z High Voltage Level Low Voltage Level Immaterial High Impedance Spec Number 603 518616 Specifications HCTS244MS Absolute Maximum Ratings Reliability Information Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±25mA (All Voltage Reference to the VSS Terminal) Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265oC Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance θJA θJC SBDIP Package. . . . . . . . . . . . . . . . . . . . 72oC/W 24oC/W Ceramic Flatpack Package . . . . . . . . . . . 107oC/W 28oC/W Maximum Package Power Dissipation at +125oC Ambient SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.69W Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.47W If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.9mW/oC Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 9.3mW/oC CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation.. Operating Conditions Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V Input Rise and Fall Times at 4.5V VCC (TR, TF) . . . . . . .500ns Max Operating Temperature Range (TA) . . . . . . . . . . . . -55oC to +125oC Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . . . . . . 0.0V to 0.8V Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . .VCC/2 to VCC TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER Quiescent Current Output Current (Sink) Output Current (Source) Output Voltage Low Output Voltage High Input Leakage Current Three-State Output Leakage Current Noise Immunity Functional Test GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS 1 +25oC - 40 µA 2, 3 +125oC, -55oC - 750 µA 1 +25oC 7.2 - mA 2, 3 +125oC, -55oC 6.0 - mA 1 +25oC -7.2 - mA 2, 3 +125oC, -55oC -6.0 - mA VCC = 4.5V, VIH = 2.25V, IOL = 50µA, VIL = 0.8V 1, 2, 3 +25oC, +125oC, -55oC - 0.1 V VCC = 5.5V, VIH = 2.75V, IOL = 50µA, VIL = 0.8V 1, 2, 3 +25oC, +125oC, -55oC - 0.1 V VCC = 4.5V, VIH = 2.25V, IOH = -50µA, VIL = 0.8V 1, 2, 3 +25oC, +125oC, -55oC VCC -0.1 - V VCC = 5.5V, VIH = 2.75V, IOH = -50µA, VIL = 0.8V 1, 2, 3 +25oC, +125oC, -55oC VCC -0.1 - V VCC = 5.5V, VIN = VCC or GND 1 +25oC - ±0.5 µA 2, 3 +125oC, -55oC - ±5.0 µA 1 +25oC - ±1 µA 2, 3 +125oC, -55oC - ±50 µA 7, 8A, 8B +25oC, +125oC, -55oC - - - (NOTE 1) CONDITIONS SYMBOL ICC IOL IOH VOL VOH IIN IOZ FN VCC = 5.5V, VIN = VCC or GND VCC = 4.5V, VIH = 4.5V, VOUT = 0.4V, VIL = 0V VCC = 4.5V, VIH = 4.5V, VOUT = VCC -0.4V, VIL = 0V Applied Voltage = 0V or VCC, VCC = 5.5V VCC = 4.5V, VIH = 2.25V, VIL = 0.8V, (Note 2) LIMITS NOTES: 1. All voltages reference to device GND. 2. For functional tests, VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”. Spec Number 604 518616 Specifications HCTS244MS TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER Propagation Delay Data to Output Data to Output Enable to Output Enable to Output Disable to Output (NOTES 1, 2) CONDITIONS SYMBOL TPLH TPHL TPZL TPZH TPLZ TPHZ GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS 9 +25oC 2 17 ns 10, 11 +125oC, -55oC 2 20 ns 9 +25oC 2 23 ns 10, 11 +125oC, -55oC 2 26 ns 9 +25oC 2 28 ns 10, 11 +125oC, -55oC 2 32 ns 9 +25oC 2 22 ns 10, 11 +125oC, -55oC 2 25 ns 9 +25oC 2 22 ns 10, 11 +125oC, -55oC 2 25 ns VCC = 4.5V VCC = 4.5V VCC = 4.5V VCC = 4.5V VCC = 4.5V LIMITS NOTES: 1. All voltages referenced to device GND. 2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V. TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER SYMBOL Capacitance Power Dissipation CPD Input Capacitance Output Transition Time CIN TTHL TTLH CONDITIONS NOTES TEMPERATURE MIN MAX UNITS 1 +25oC - 45 pF 1 +125oC, -55oC - 45 pF 1 +25oC - 10 pF 1 +125oC - 10 pF 1 +25oC - 12 ns 1 +125oC, -55oC - 18 ns VCC = 5.0V, f = 1MHz VCC = 5.0V, f = 1MHz VCC = 4.5V NOTE: 1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics. Spec Number 605 518616 Specifications HCTS244MS TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS 200K RAD LIMITS PARAMETER (NOTES 1, 2) CONDITIONS SYMBOL TEMPERATURE MIN MAX UNITS Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND +25oC - 0.75 mA Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V +25oC 6.0 - mA Output Current (Source) IOH VCC = 4.5V, VIN = VCC or GND, VOUT = VCC -0.4V +25oC -6.0 - mA Output Voltage Low VOL VCC = 4.5V and 5.5V, VIH = VCC/2, VIL = 0.8V, IOL = 50µA +25oC - 0.1 V Output Voltage High VOH VCC = 4.5V and 5.5V, VIH = VCC/2, VIL = 0.8V, IOH = -50µA +25oC VCC -0.1 - V Three-State Output Leakage Current IOZ Applied Voltage = 0V or VCC, VCC = 5.5V +25oC - ±50 µA Input Leakage Current IIN VCC = 5.5V, VIN = VCC or GND +25oC - ±5 µA Noise Immunity Functional Test FN VCC = 4.5V, VIH = 2.25V, VIL = 0.8V, (Note 3) +25oC - - - ns Propagation Delay Data to Output TPLH VCC = 4.5V +25oC 2 20 Data to Output TPHL VCC = 4.5V +25oC 2 26 Enable to Output TPZL VCC = 4.5V +25oC 2 32 ns Enable to Output TPZH VCC = 4.5V +25oC 2 25 ns Disable to Output TPLZ, TPHZ VCC = 4.5V +25oC 2 25 ns NOTES: 1. All voltages referenced to device GND. 2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V. TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25oC) GROUP B SUBGROUP DELTA LIMIT ICC 5 12µA IOL/IOH 5 -15% of 0 Hour IOZL/IOZH 5 ±200nA PARAMETER Spec Number 606 518616 Specifications HCTS244MS TABLE 6. APPLICABLE SUBGROUPS CONFORMANCE GROUPS METHOD GROUP A SUBGROUPS Initial Test (Preburn-In) 100%/5004 1, 7, 9 ICC, IOL/H, IOZL/H Interim Test I (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H, IOZL/H Interim Test II (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H, IOZL/H PDA 100%/5004 1, 7, 9, Deltas Interim Test III (Postburn-In) 100%/5004 1, 7, 9 PDA 100%/5004 1, 7, 9, Deltas Final Test 100%/5004 2, 3, 8A, 8B, 10, 11 Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11 Subgroup B-5 Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroup B-6 Sample/5005 1, 7, 9 Sample/5005 1, 7, 9 Group A (Note 1) Group B Group D READ AND RECORD ICC, IOL/H, IOZL/H Subgroups 1, 2, 3, 9, 10, 11 NOTE: 1. Alternate group A testing in accordance with Method 5005 of Mil-Std-883 may be exercised. TABLE 7. TOTAL DOSE IRRADIATION TEST CONFORMANCE GROUPS READ AND RECORD METHOD PRE RAD POST RAD PRE RAD POST RAD 5005 1, 7, 9 Table 4 1, 9 Table 4 (Note 1) Group E Subgroup 2 NOTE: 1. Except FN test which will be performed 100% go/no-go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OSCILLATOR GROUND 1/2 VCC = 3V ± 0.5V VCC = 6V ± 0.5V 50kHz 25kHz 1, 2, 4, 6, 8, 10, 11, 13, 15, 17, 19 - 20 - - 10 - 1, 2, 4, 6, 8, 11, 13, 15, 17, 19, 20 - - 1, 10, 19 3, 5, 7, 9, 12, 14, 16, 18 20 2, 4, 6, 8, 11, 13, 15, 17 - OPEN STATIC I BURN-IN (Note 1) 3, 5, 7, 9, 12, 14, 16, 18 STATIC II BURN-IN (Note 1) 3, 5, 7, 9, 12, 14, 16, 18 DYNAMIC BURN-IN (Note 2) NOTES: 1. Each pin except VCC and GND will have a resistor of 10kΩ ± 5% for static burn-in 2. Each pin except VCC and GND will have a resistor of 680Ω ± 5% for dynamic burn-in TABLE 9. IRRADIATION TEST CONNECTIONS OPEN GROUND VCC = 5V ± 0.5V 3, 5, 7, 9, 12, 14, 16, 18 10 1, 2, 4, 6, 8, 11, 13, 15, 17, 19, 20 NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing. Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures. Spec Number 607 518616 HCTS244MS Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) 100% Interim Electrical Test 1 (T1) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Static Burn-In 2, Condition A or B, 24 hrs. min., +125oC min., Method 1015 100% Nondestructive Bond Pull, Method 2023 100% Interim Electrical Test 2 (T2) Sample - Wire Bond Pull Monitor, Method 2011 100% Delta Calculation (T0-T2) Sample - Die Shear Monitor, Method 2019 or 2027 100% PDA 1, Method 5004 (Notes 1and 2) 100% Internal Visual Inspection, Method 2010, Condition A 100% Dynamic Burn-In, Condition D, 240 hrs., +125oC or Equivalent, Method 1015 100% Delta Calculation (T0-T1) 100% Temperature Cycle, Method 1010, Condition C, 10 Cycles 100% Interim Electrical Test 3 (T3) 100% Constant Acceleration, Method 2001, Condition per Method 5004 100% Delta Calculation (T0-T3) 100% PDA 2, Method 5004 (Note 2) 100% PIND, Method 2020, Condition A 100% Final Electrical Test 100% External Visual 100% Fine/Gross Leak, Method 1014 100% Serialization 100% Radiographic, Method 2012 (Note 3) 100% Initial Electrical Test (T0) 100% Static Burn-In 1, Condition A or B, 24 hrs. min., +125oC min., Method 1015 100% External Visual, Method 2009 Sample - Group A, Method 5005 (Note 4) 100% Data Package Generation (Note 5) NOTES: 1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1. 2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the failures from subgroup 7. 3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004. 4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005. 5. Data Package Contents: • Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). • Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage. • GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read and Record data on file at Intersil. • X-Ray report and film. Includes penetrometer measurements. • Screening, Electrical, and Group A attributes (Screening attributes begin after package seal). • Lot Serial Number Sheet (Good units serial number and lot number). • Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test. • The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed by an authorized Quality Representative. Spec Number 608 518616 HCTS244MS AC Timing Diagrams AC Load Circuit VIH DUT TEST POINT INPUT VS VIL CL TPLH RL TPHL VOH VS OUTPUT CL = 50pF VOL RL = 500Ω TTLH VOH TTHL 80% 20% VOL 80% 20% OUTPUT AC VOLTAGE LEVELS PARAMETER HCTS UNITS VCC 4.50 V VIH 3.00 V VS 1.30 V VIL 0 V GND 0 V Three-State Low Load Circuit Three-State Low Timing Diagrams RL VIH VS INPUT VIL TEST POINT DUT TPZL TPLZ CL VOZ CL = 50pF VT VW OUTPUT RL = 500Ω VOL THREE-STATE LOW VOLTAGE LEVELS PARAMETER HCTS UNITS VCC 4.50 V VIH 3.00 V VS 1.30 V VT 1.30 V VW 0.90 V 0 V GND Spec Number 609 518616 HCTS244MS Three-State High Timing Diagrams Three-State High Load Circuit TEST POINT DUT VIH VS INPUT RL VIL CL = 50pF RL = 500Ω TPZH TPHZ VOH CL VT OUTPUT VW VOZ THREE -STATE HIGH VOLTAGE LEVELS PARAMETER HCTS UNITS VCC 4.50 V VIH 3.00 V VS 1.30 V VT 1.30 V VW 3.60 V 0 V GND All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 Spec Number 610 518616 HCTS244MS Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: Al/Sil Metal Thickness: 11kÅ ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13kÅ ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS244MS 2Y3 (3) 1A0 (2) 1OE (1) VCC (20) 2OE (19) (18) 1Y0 1A1 (4) (17) 2A3 2Y2 (5) (16) 1Y1 1A2 (6) (15) 2A2 2Y1 (7) (14) 1Y2 (8) 1A3 (9) 2Y0 (10) GND (11) 2A0 (12) 1Y3 (13) 2A1 NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS244 is TA14402A. Spec Number 611 518616