HD74LS11 / HD74LS15 Triple 3-input Positive AND Gates / Triple 3-input Positive AND Gates (with Open Collector Outputs) REJ03D0397–0300 Rev.3.00 Jul.13.2005 Features • Ordering Information • HD74LS11 Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS11P DILP-14 pin PRDP0014AB-B (DP-14AV) P — HD74LS11FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS15FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) • HD74LS15 Note: Please consult the sales office for the above package availability. Pin Arrangement 1A 1 14 VCC 1B 2 13 1C 2A 3 12 1Y 2B 4 11 3C 2C 5 10 3B 2Y 6 9 3A GND 7 8 3Y (Top view) Rev.3.00, Jul.13.2005, page 1 of 5 HD74LS11 / HD74LS15 Circuit Schematic (1/3) HD74LS11 VCC 20k 8k 10k 75 Inputs A Output Y B 4.5k C 1.5k 3k GND HD74LS15 VCC 20k 10k 8k Inputs A Output Y B C 4.5k GND Absolute Maximum Ratings Item Symbol Ratings Note Supply voltage VCC 7 Input voltage VIN 7 Power dissipation PT 400 Storage temperature Tstg –65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Rev.3.00, Jul.13.2005, page 2 of 5 Unit V V mW °C HD74LS11 / HD74LS15 Recommended Operating Conditions • HD74LS11 Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 –400 8 75 Unit V µA mA °C Symbol VCC VOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 5.5 8 75 Unit V V mA °C • HD74LS15 Item Supply voltage Output voltage Output current Operating temperature Electrical Characteristics • HD74LS11 (Ta = –20 to +75 °C) Item Input voltage Output voltage Input current Short-circuit output current Supply current Input clamp voltage Symbol VIH VIL VOH typ.* — — — — — — — — max. — 0.8 — 0.5 0.4 20 –0.4 0.1 Unit V V V II min. 2.0 — 2.7 — — — — — µA mA mA VCC = 4.75 V, VIL = 2 V, IOH = –400 µA IOL = 8 mA VCC = 4.75 V, VIH = 0.8 V IOL = 4 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V IOS –20 — –100 mA VCC = 5.25 V ICCH ICCL VIK — — — 1.8 3.3 — 3.6 6.6 –1.5 mA mA V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA min. 2.0 — — — — — — — — typ.* — — — — — — — — 1.8 max. — 0.8 0.5 0.4 20 –0.4 0.1 100 3.6 Unit V V µA mA mA µA mA IOL = 8 mA VCC = 4.75 V, VIH = 0.8 V IOL = 4 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 4.75 V, VOH = 5.5 V VCC = 5.25 V — — 3.3 — 6.6 –1.5 mA V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA VOL IIH IIL V Condition Note: * VCC = 5 V, Ta = 25°C • HD74LS15 (Ta = –20 to +75 °C) Item Input voltage Output voltage Input current Output current Supply current Symbol VIH VIL VOL IIH IIL II IOH ICCH ICCL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C Rev.3.00, Jul.13.2005, page 3 of 5 V Condition HD74LS11 / HD74LS15 Switching Characteristics • HD74LS11 (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL min. — — typ. 8 10 max. 15 20 Unit ns ns Condition CL = 15 pF, RL = 2 kΩ • HD74LS15 (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL min. — — typ. 20 17 max. 35 35 Unit ns ns Condition CL = 15 pF, RL = 2 kΩ Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.3.00, Jul.13.2005, page 4 of 5 HD74LS11 / HD74LS15 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B MASS[Typ.] 0.97g Previous Code DP-14AV D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 L A θ bp e Dimension in Millimeters Min e1 A1 0.51 bp 0.40 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV D 0.48 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.23g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 7.4 1.30 Z ( Ni/Pd/Au plating ) 20.32 5.06 b3 c Max 8 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 Nom Max D 10.06 10.5 E 5.50 A2 7 e A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 1.42 Z L L Rev.3.00, Jul.13.2005, page 5 of 5 8° 0.50 1 0.70 1.15 0.90 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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