HFBR-772BWZ/BEWZ/BHWZ/BEPWZ and HFBR-782BZ/BEZ/BHZ/BEPZ Pluggable Parallel Fiber Optic Modules, Transmitter and Receiver Data Sheet Description The HFBR-772BWZ transmitter and HFBR-782BZ receiver are high performance fiber optic modules for parallel optical data communication applications. These 12-channel devices, operating up to 2.7 Gbd per channel, provide a cost effective solution for short-reach applications requiring up to 32 Gb/s aggregate bandwidth. These modules are designed to operate on multimode fiber systems at a nominal wavelength of 850 nm. They incorporate high performance, highly reliable, short wavelength optical devices coupled with proven circuit technology to provide long life and consistent service. The HFBR-772BWZ transmitter module incorporates a 12- channel VCSEL (Vertical Cavity Surface Emitting Laser) array together with a custom 12-channel laser driver integrated circuit providing IEC-60825 and CDRH Class 1M laser eye safety. The HFBR-782BZ receiver module contains a 12-channel PIN photodiode array coupled with a custom preamplifier / post amplifier integrated circuit. Features • RoHS Compliant • Low cost per Gb/s • High package density per Gb/s • 3.3 volt power supply for low power consumption • 850 nm VCSEL array source • 12 independent channels per module • Separate transmitter and receiver modules • 2.7 Gbd data rate per channel • Standard MTP® (MPO) ribbon fiber connector interface • Pluggable package • 50/125 micron multimode fiber operation: Distance up to 300 m with 500 MHz.km fiber at 2.5 Gbd Distance up to 600 m with 2000 MHz.km fiber at 2.5 Gbd • Data I/O is CML compatible • Control I/O is LVTTL compatible • Manufactured in an ISO 9002 certified facility Ordering Information Operating from a single +3.3 V power supply, both modules provide LVTTL or LVCMOS control interfaces and Current Mode Logic (CML) compatible data interfaces to simplify external circuitry. The HFBR-772BWZ and HFBR-782BZ products are available for production orders through the Avago Component Field Sales office. HFBR-772BWZ No EMI Nose Shield The transmitter and receiver devices are housed in MTP®/ MPO receptacled packages. Electrical connections to the devices are achieved by means of a pluggable 10 x 10 connector array. HFBR-782BZ No EMI Nose Shield HFBR-772BEWZ With Extended EMI Nose Shield HFBR-782BEZ With Extended EMI Nose Shield HFBR-772BHWZ No Heatsink, No EMI Nose Shield HFBR-782BHZ No Heatsink, No Nose Shield HFBR-772BEPWZ With Extended EMI Nose Shield, With “flush pin-fin” Heatsink HFBR-782BEPZ With Extended EMI Nose Shield, With “flush pin-fin” Heatsink Applications • Datacom switch and router backplane connections • Telecom switch and router backplane connections • InfiniBand connections Patent - www.avagotech.com/patents Design Summary: Functional Description, Receiver Section Design for low-cost, high-volume manufacturing The receiver section, Figure 2, contains a 12-channel AlGaAs/ GaAs photodetector array, transimpedance preamplifier, filter, gain stages to amplify and buffer the signal, and a quantizer to shape the signal. Avago’s parallel optics solution combines twelve 2.7 Gbd channels into discrete transmitter and receiver modules providing a maximum aggregate data rate of 32 Gb/s. Moreover, these modules employ a heat sink for thermal management when used on high-density cards, have excellent EMI performance, and interface with the industry standard MTP®/MPO connector systems. They provide the most cost-effective high- density (Gbd per inch) solutions for high-data capacity applications. See Figure 1 for the transmitter and Figure 2 for the receiver block diagrams. The HFBR-772BWZ transmitter and the HFBR-782BZ receiver modules provide very closely spaced, high-speed parallel data channels. Within these modules there will be some level of cross talk between channels. The cross talk within the modules will be exhibited as additional data jitter or sensitivity reduction compared to single-channel performance. Avago Technologies’ jitter and sensitivity specifications include cross talk penalties and thus represent real, achievable module performance. Functional Description, Transmitter Section The transmitter section, Figure 1, uses a 12-channel 850 nm VCSEL array as the optical source and a diffractive optical lens array to launch the beam of light into the fiber. The package and connector system are designed to allow repeatable coupling into standard 12-fiber ribbon cable. In addition, this module has been designed to be compliant with IEC 60825 Class 1 eye safety requirements. The optical output is controlled by a custom IC, which provides proper laser drive parameters and monitors drive current to ensure eye safety. An EEPROM and state machine are programmed to provide both ac and dc current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over variations of temperature and power supply voltages. The Signal Detect function is designed to sense the proper optical output signal on each of the 12 channels. If loss of signal is detected on an individual channel, that channel output is squelched. Packaging The flexible electronic subassembly was designed to allow high-volume assembly and test of the VCSEL, PIN photo diode and supporting electronics prior to final assembly. Regulatory Compliance The overall equipment design into which the parallel optics module is mounted will determine the certification level. The module performance is offered as a figure of merit to assist the designer in considering their use in the equipment design. Organization Recognition See the Regulatory Compliance Table for a listing of the standards, standards associations and testing laboratories applicable to this product. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. The first case is during handling of the module prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. The second case to consider is static discharges to the exterior of the equipment chassis containing the module parts. To the extent that the MTP® (MPO) connector receptacle is exposed to the outside of the equipment chassis it may be subject to system level ESD test criteria that the equipment is intended to meet. See the Regulatory Compliance Table for further details. 2 COMPARATOR SHUT DOWN DIN+ DIN- SERIAL CONTROL I/O* AMPLIFIER D/A CONVERTER 12 INPUT STAGE 12 4 LEVEL SHIFTER CONTROLLER 12 DRIVER VCSEL ARRAY D/A CONVERTER TEMPERATURE DETECTION CIRCUIT Figure 1. Transmitter block diagram. * TX_EN, TX_DIS, RESET-, FAULT- OFFSET CONTROL PIN DOUT+ TRANS-IMPEDANCE PRE-AMPLIFIER LIMITING AMPLIFIER OUTPUT BUFFER DOUT- SIGNAL DETECT CIRCUIT Figure 2. Receiver block diagram (each channel). 3 SD Electromagnetic Interference (EMI) Connector Cleaning Many equipment designs using these high-data-rate modules will be required to meet the requirements of the FCC in the United States, CENELEC in Europe and VCCI in Japan. These modules, with their shielded design, perform to the levels detailed in the Regulatory Compliance Table. The performance detailed in the Regulatory Compliance Table is intended to assist the equipment designer in the management of the overall equipment EMI performance. However, system margins are dependent on the customer board and chassis design. The optical connector used is the MTP® (MPO). The optical ports have recessed optics that are visible through the nose of the ports. The provided port plug should be installed any time a fiber cable is not connected. The port plug ensures the optics remain clean and no cleaning should be necessary. In the event the optics become contaminated, forced nitrogen or clean dry air at less than 20 psi is the recommended cleaning agent. The optical port features, including guide pins, preclude use of any solid instrument. Liquids are not advised due to potential damage. Immunity Equipment using these modules will be subject to radio frequency electromagnetic fields in some environments. These modules have good immunity due to their shielded designs. See the Regulatory Compliance Table for further detail. Eye Safety These 850 nm VCSEL-based modules provide eye safety by design. The HFBR-772BWZ has been registered with CDRH and certified by TUV as a Class 1M device under Amendment 2 of IEC 60825-1. See the Regulatory Compliance Table for further detail. If Class 1M exposure is possible, a safety-warning label should be placed on the product stating the following: LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS CLASS 1M LASER PRODUCT 4 Process Plug Each parallel optics module is supplied with an inserted process plug for protection of the optical ports within the MTP® (MPO) connector receptacle. Handling Precautions The HFBR-772BWZ and HFBR-782BZ can be damaged by current surges and overvoltage conditions. Power supply transient precautions should be taken. Application of wave soldering, reflow soldering and/or aqueous wash processes with the parallel optic device on board is not recommended as damage may occur. Normal handling precautions for electrostatic sensitive devices should be taken (see ESD section). The HFBR-772BWZ is a Class 1M laser product. DO NOT VIEW RADIATION DIRECTLY WITH OPTICAL INSTRUMENTS. Absolute Maximum Ratings [1,2] Parameter Symbol Min. Max. Unit Reference Storage Temperature (non-operating) TS –40 100 °C 1 Case Temperature (operating) TC 90 °C 1, 2, 4 Supply Voltage VCC –0.5 4.6 V 1, 2 Data/Control Signal Input Voltage VI –0.5 VCC + 0.5 V 1 Transmitter Differential Data Input Voltage |VD| 2 V 1, 3 Output Current (dc) ID 25 mA 1 95 % 1 Relative Humidity (non-condensing) RH 5 Notes: 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur. See Reliability Data Sheet for specific reliability performance. 2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. 3. This is the maximum voltage that can be applied across the Transmitter Differential Data Inputs without damaging the input circuit. 4. Case Temperature is measured as indicated in Figure 3. Recommended Operating Conditions [1] Parameter Symbol Min. Typ. Max. Unit Reference Case Temperature TC 0 40 80 °C 2, Figs. 3 Supply Voltage VCC 3.135 3.3 3.465 V Figs. 5, 6, 12 1 2.7 Gbd 3 4, Figs. 7, 8 Signaling Rate per Channel Data Input Differential Peak-to-Peak Voltage Swing DVDINP-P 175 1400 mVP-P Control Input Voltage High VIH 2.0 VCC V Control Input Voltage Low VIL VEE 0.8 V Power Supply Noise for Transmitter and Receiver NP 200 mVP-P 5, Figs. 5, 6 Transmitter/Receiver Data I/O Coupling Capacitors CAC 0.1 mF Fig. 7 Receiver Differential Data Output Load RDL 100 W Fig. 7 Notes: 1. Recommended Operating Conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. See Reliability Data Sheet for specific reliability performance. 2. Case Temperature is measured as indicated in Figure 3. 3. The receiver has a lower cut off frequency near 100 kHz. 4. Data inputs are CML compatible. Coupling capacitors are required to block DC. ∆VDINP-P = ∆VDINH – ∆VDINL, where ∆VDINH = High State Differential Data Input Voltage and ∆VDINL = Low State Differential Data Input Voltage. 5. Power Supply Noise is defined for the supply, VCC, over the frequency range from 500 Hz to 2500 MHz, with the recommended power supply filter in place, at the supply side of the recommended filter. See Figures 5 and 6 for recommended power supply filters. 5 Electrical Characteristics Transmitter Electrical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Typ. Max. Unit Reference (Conditions) ICCT 320 415 mA Fig. 6 Power Dissipation PDIST 1.1 1.45 W Differential Input Impedance Zin 100 120 W 1, Fig. 7, 11 FAULT Assert Time TOFF 200 250 ms Fig. 13 RESET Assert Time TOFF 5 7.5 ms Fig. 14 RESET De-assert Time TON 55 100 ms Fig. 14 Transmit Enable (TX_EN) Assert Time TON 55 100 ms Fig. 15 Transmit Enable (TX_EN) De-assert Time TOFF 5 7.5 ms 2, Fig. 15 Transmit Disable (TX_DIS) Assert Time TOFF 5 7.5 ms Fig. 15 Transmit Disable (TX_DIS) De-assert Time TON 55 100 ms Fig. 15 Power On Initiation Time TINT 60 100 ms Fig. 12 Control I/Os (TX_EN, TX_DIS FAULT, RESET) Compatible |Input Current High | |IIH| 0.5 mA (2.0 V < VIH < VCC) | Input Current Lo w| |IIL| 0.5 mA (VEE < VIL < 0.8 V) Output Voltage Low VOL VEE 0.4 V (IOL = 4.0 mA) Output Voltage High VOH 2.5 VCC V (IOH = –0.5 mA) Parameter Symbol Supply Current Min. 80 3.3 Notes: 1. Differential impedance is measured between DIN+and DIN– over the range 4 MHz to 2 GHz. 2. When the control signal Transmitter Enable, Tx_EN, is used to disable the transmitter, Tx_EN must be taken to a logic low-state level (VIL) for one millisecond or longer. Similarly, if the control signal Transmitter Disable, Tx_DIS, is used, then Tx_DIS must be taken to a logic high- state level (VIH) for one millisecond or longer. 6 Receiver Electrical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Typ. Max. Unit Reference (Conditions) ICCR 400 445 mA 1, Fig. 5 Power Dissipation PDISR 1.3 1.55 W Differential Output Impedance ZOUT 80 100 120 W 2, Fig. 8, 10 Data Output Differential Peak-to-Peak Voltage Swing DVDOUTP-P 450 600 750 mVP-P 3, Figs. 7, 8 100 150 ps 4 150 ps 5 µs µs 6 7 V V (IOL = 4.0 mA) (IOH = -0.5 mA) Parameter Symbol Supply Current Min. Inter-channel Skew Differential Data Output Rise/Fall Time tr/tf 110 Signal Detect Assert Time (OFF-to-ON) De-assert Time (ON-to-OFF) tSDA tSDD 170 190 Control I/O Output Voltage LowLVTTL & LVCMOS Output Voltage HighCompatible VOL VOH VEE 2.5 3.1 0.4 VCC Notes: 1. ICCR is the dc supply current, dependent upon the number of active channels, where the Data Outputs are ac coupled with capacitors between the outputs and any resistive terminations. See Figure 7 for recommended termination. 2. Measured over the range 4 MHz to 2 GHz. 3. DVDOUTP-P = DVDOUTH – DVDOUTL, where DVDOUTH = High State Differential Data Output Voltage and DVDOUTL = Low State Differential Data Output Voltage. DVDOUTH and DVDOUTL = VDOUT+ – VDOUT–, measured with a 100 W differential load connected with the recommended coupling capacitors and with a 2500 MBd, 8B10B serial encoded data pattern. 4. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. Input power at –10 dBm. 5. Rise and Fall Times are measured between the 20% and 80% levels using a 500 MHz square wave signal. 6. The Signal Detect output will change from logic “0” (Low) to “1” (High) within the specified assert time for a step transition in optical input power from the de-asserted condition to the specified asserted optical power level on all 12 channels. 7. The Signal Detect output will change from logic “1” (High) to “0” (Low) within the specified de-assert time for a step transition in optical input power from the specified asserted optical power level to the de-asserted condition on any 1 channel. 7 Optical Characteristics Transmitter Optical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Parameter Symbol Min. Typ. Max. Unit Reference Output Optical Power POUT –8 –4 –2 dBm avg. 1 Output Optical Power – Off State POUT DIS –30 dBm avg. Extinction Ratio Output Power -2 to -8 dBm ER 6 7 Center Wavelength lC 830 850 860 nm Spectral Width – rms s 0.4 0.85 nm rms Rise/Fall Time tr/tf 50 100 ps 3 110 200 ps 4 –124 dB/Hz 60 120 psp-p psp-p Inter-channel Skew Relative Intensity Noise RIN Jitter Contribution Deterministic Total DJ TJ 20 60 dB 2 5 6 Notes: 1. The specified optical output power, measured at the output of a short test cable, will be compliant with IEC 60825-1 Amendment 2, Class 1 Accessible Emission Limits, AEL, and the output power of the module without an attached cable will be compliant with the IEC 60825-1 Amendment 2, Class 1M AEL. See discussion in the Regulatory Compliance section. 2. Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the low (“0”) state and is expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg). The transmitter is driven with a 550 MBaud, 27-1 PRBS serial encoded pattern. 3. These are filtered rise/fall time measurements as defined in IEEE Gb Ethernet specification using a 2.488GBd (1.875 GHz bandwidth) 4th Bessel Thompson filter. A max spec of 100ps for unfiltered waveform is equivalent to a max spec 215ps for filtered waveform. 4. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. 5. Deterministic Jitter (DJ) is defined as the combination of Duty Cycle Distortion (Pulse-Width Distortion) and Data Dependent Jitter. Deterministic Jitter is measured at the 50% signal threshold level using a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern with zero skew between the differential data input signals. 6. Total Jitter (TJ) includes Deterministic Jitter and Random Jitter (RJ). Total Jitter is specified at a BER of 10-12 for the same 2.5 GBd test pattern as for DJ. 8 Receiver Optical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Parameter Symbol Min. Input Optical Power Sensitivity PIN MIN Input Optical Power Saturation PIN MAX –2 Operating Center Wavelength lC 830 Stressed Receiver Sensitivity Typ. Max. Unit Reference –18.5 -16 dBm avg. 1 dBm avg. 2 –1 –15.5 860 nm -11.3 dBm 3 Stressed Receiver Eye Opening 120 190 ps 4 Return Loss 12 19 dB 5 -31 0.5 -19 -21 2 dBm avg. dBm avg. dB 6 Signal Detect Asserted De-asserted Hysteresis PA PD PA-PD -17 Notes: 1. Sensitivity is defined as the average input power with the worst case, minimum, Extinction Ratio necessary to produce a BER of 10-12 at the center of the Baud interval using a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is equivalent to that provided by an ideal source, i.e., a source with RIN and switching attributes that do not degrade the sensitivity measurement. All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN. 2. Saturation is defined as the average input power that produces at the center of the output swing a receiver output eye width less than 120 ps where BER < 10-12 using a 2.5 GBd Pseudo Random Bit Sequence of length 223 –1 (PRBS), or equivalent, test pattern. 3. Stressed receiver sensitivity is defined as the average input power necessary to produce a BER < 10-12 at the center of the Baud interval using a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is conditioned with 2.5 dB Inter-Symbol Interference, ISI, (min), 33 ps Duty Cycle Dependent Deterministic Jitter, DCD DJ (min) and 6 dB ER (ER Penalty = 2.23 dB). All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN. 4. Stressed receiver eye opening is defined as the receiver output eye width where BER < 10-12 at the center of the output swing using a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is an average input optical power of –10.7 dBm and conditioned with 2.5 dB ISI (min), 33 ps DCD DJ (min), 6 dB ER (ER Penalty = 2.23 dB). All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN. 5. Return loss is defined as the ratio, in dB, of the received optical power to the optical power reflected back down the fiber. 6. Signal Detect assertion requires all optical inputs to exhibit a minimum 6 dB Extinction Ratio at PA = –17 dBm. All channels not under test are operating with PRBS 23 serial encoded patterns, asynchronous with the channel under test, and an average input power up to 6 dB higher than PIN MIN. 9 Regulatory Compliance Table Feature Test Method Performance Electrostatic Discharge (ESD) to the Electrical Pads JEDEC Human Body Model (HBM) (JESD22-A114-B) Transmitter Module > 1000 V Receiver Module > 2000 V JEDEC Machine Model (MM) Transmitter Module > 50 V Receiver Module > 200 V Electrostatic Discharge (ESD) to the Connector Receptacle Variation of IEC 61000-4-2 Typically withstands at leasr 6 kV air discharge (with module biased) without damage. Electromagnetic Interference (EMI) FCC Part 15 CENELEC EN55022 (CISPR 22A) VCCI Class 1 Typically pass with 10 dB margin. Actual performance dependent on enclosure design. Immunity Variation of IEC 61000-4-3 Typically minimal effect from a 10 v/m field swept from 80 MHz to 1 GHz applied to the module without a chassis enclosure. Laser Eye Safety and Equipment Type Testing IEC 60825-1 Amendment 2 CFR 21 Section 1040 POUT: IEC AEL & US FDA CRDH Class 1M CDRH Accession Number: 9720151-22 TUV Certficate Number: E2171095.04 Component Recognition Underwriters Laboratories and Canadian StanUL File Number: E173874 dards Association Joint Component Recognition for Information Technology Equipment including Electrical Business Equipment RoHS Complaince 10 Less than 1000ppm of Cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated biphenyl ethers Table 1. Transmitter Module Pad Description Symbol Functional Description VEE Transmitter Signal Common. All voltages are referenced to this potential unless otherwise indicated. Directly connect these pads to transmitter signal ground plane. VCCT Transmitter Power Supply. Use recommended power supply filter circuit in Figure 6. DIN0+ through DIN11+ Transmitter Data In+ for channels 0 through 11, respectively. Differential termination and self bias are included, see Figure 11. DIN0– through DIN11– Transmitter Data In- for channels 0 through 11, respectively. Differential termination and self bias are included; see Figure 11. TX_EN TX Enable. Active high. Internal pull-up High = VCSEL array is enabled if TX_DIS is inactive (Low).Low = VCSEL array is off. TX_EN must be taken to a logic low state level (VOL) for 1 ms or longer. TX_DIS TX Disable. Active high. Internal pull-down Low = VCSEL array is enabled if TX_EN is active (High).High = VCSEL array is off. TX_DIS must be taken to a logic High state level (VOH) for 1 ms or longer. RESET- Transmitter RESET- input. Active low. Internal pull-up. Low = Resets logic function clears FAULT- signal, VCSEL array is off. high = Normal operation. See Figure 14. FAULT- Transmitter FAULT- output. Active low. Low (logic “0”) results from a VCSEL over-current condition, out of temperature range, or EEPROM calibration data corruption condition detected for any VCSEL. An asserted (logic “0”) FAULT- disables the VCSEL array and is cleared by RESET- or power cycling VCCT FAULT- is a single ended LVTTL compatible output. DNC Do not connect to any electrical potential. Table 2. Receiver Module Pad Description Symbol Functional Description VEE Receiver Signal Common. All voltages are referenced to this potential unless otherwise indicated.Directly connect these pads to receiver signal ground plane. VCCR Receiver Power Supply. Use recommended power supply filter circuit in Figure 5. VPP Not required for Avago product. Pads not internally connected.(Voltage for MSA compatibility in order to ac-couple receiver data outputs). DOUT0+ through DOUT11+ Receiver Data Out+ for channels 0 through 11, respectively. Terminate these high-speed differential CML outputs with standard CML techniques at the inputs of the receiving device. Individual data outputs will be squelched for insufficient input signal level. DOUT0– through DOUT11– Receiver Data Out- for channel 0 through 11, respectively. Terminate these high-speed differential CML outputs with standard CML techniques at the inputs of the receiving device. Individual data outputs will be squelched for insufficient input signal level. SD Signal Detect. Normal optical input levels to all channels results in a logic “1” output, VOH, asserted. Low input optical levels to any channel results in a fault condition indicated by a logic “0” output, VOL, de-asserted. SD is a single-ended LVTTL compatible output. RX_EN Receiver output enable. Active high (logic “1”), internal pull-up. Low (logic “0”) = receiver outputs disabled, all outputs are high (logic “1”). SQ_EN Squelch enable input. Active high (logic “1”), internal pull-up. Low (logic “0”) = squelch disabled. When SQ_EN is high and SD is low, corresponding outputs are squelched. EN_SD Enable Signal Detect. Active high (logic “1”), internal pull-up. Low (logic “0”) = Signal detect output forced active high. DNC Do not connect to any electrical potential. 11 TRANSMITTER MODULE PAD ASSIGNMENT (TOWARD MTP® CONNECTOR) J I H G F E D C B A 1 DNC DNC DNC V EE V EE V EE V EE V EE V EE DNC 2 DNC DNC DNC V EE V EE DIN5+ V EE V EE DIN8+ V EE 3 DNC V CCT V CCT V EE DIN4+ DIN5- V EE DIN7+ DIN8- V EE 4 DNC V CCT V CCT DIN3+ DIN4- V EE DIN6+ DIN7- V EE DNC 5 DNC V CCT V CCT DIN3- V EE DIN2+ DIN6- V EE DIN9- V EE 6 DNC V CCT V CCT V EE DIN1+ DIN2- V EE DIN10- DIN9+ V EE 7 DNC DNC DNC DIN0+ DIN1- V EE DIN11- DIN10+ V EE DNC 8 DNC RESET- FAULT- DIN0- V EE V EE DIN11+ V EE V EE DNC 9 DNC TX_EN TX_DIS V EE V EE V EE V EE V EE V EE DNC 10 DNC DNC DNC DNC DNC DNC DNC DNC DNC DNC TOP VIEW (PCB LAYOUT) (10 x 10 ARRAY) 12 RECEIVER MODULE PAD ASSIGNMENT (TOWARD MTP® CONNECTOR) J I H G F E D C B A 1 V PP DNC DNC V EE V EE V EE V EE V EE V EE DNC 2 V PP DNC DNC V EE V EE DOUT5- V EE V EE DOUT8- V EE 3 DNC V CCR V CCR V EE DOUT4- DOUT5+ V EE DOUT7- DOUT8+ V EE 4 DNC V CCR V CCR DOUT3- DOUT4+ 5 DNC V CCR V CCR DOUT3+ 6 DNC V CCR V CCR V EE 7 DNC DNC SD 8 V PP DNC 9 V PP 10 SQ_EN V EE V EE DOUT6- DOUT7+ DOUT2- DOUT6+ DOUT1- DOUT2+ V EE DNC DOUT9+ V EE DOUT10+ DOUT9- V EE V EE DOUT0- DOUT1+ V EE DOUT11+ DOUT10- V EE DNC DNC DOUT0+ V EE V EE DOUT11- V EE V EE DNC RX_EN EN_SD V EE V EE V EE V EE V EE V EE DNC DNC DNC DNC DNC DNC DNC DNC DNC DNC TOP VIEW (PCB LAYOUT) (10 x 10 ARRAY) 13 V EE Case Temperature Measurement Point Figure 3. Case temperature measurement point (label and heatsink removed for clarity) Case to Ambient Thermal Resistance (C/W) 25.0 No heatsink Heatsink 20.0 15.0 10.0 5.0 0.0 0 0.5 1 Air Velocity (m/s) 1.5 2 Figure 4. Sample HFBR-772BWZ(BHWZ)/782BZ(BHZ) Case to Ambient thermal resistance (C/W) versus air velocity (sea level) 14 HFBR-782BZ V CCR V CCR V CCR V CCR R = 1.0 kΩ 0603 R = 100Ω 0603 L = 6.8 nH 0805 L = 1 µH 2220 C = 0.1 µF 0603 C = 0.1 µF 0603 C = 10 µF 1210 V CC C = 10 µF 1210 V CCR V CCR V CCR V CCR NOTE: 1. Vcc is defined by 3.135 <Vcc <3.465 Volts and the power supply filter has <50 mV drop across it resulting in 3.085 <Vccr, <3.415 volts. Figure 5. Recommended receiver power supply filter. HFBR-772BWZ V CCT V CCT V CCT V CCT R = 1.0 kΩ 0603 R = 100Ω 0603 L = 6.8 nH 0805 L = 1 µH 2220 C = 0.1 µF 0603 C = 0.1 µF 0603 C = 10 µF 1210 V CCT V CCT V CCT V CCT NOTE: 1. Vcc is defined by 3.135 <Vcc <3.465 Volts and the power supply filter has <50 mV drop across it resulting 3.085 < Vcct <3.145 volts. Figure 6. Recommended transmitter power supply filter. 15 V CC C = 10 µF 1210 HFBR-772BWZ DATA OUT (+) R 100 Ω C = 100 nF R 50 Ω C = 100 nF R 50 Ω DATA OUT (–) HFBR-782BZ ASIC D OUT (+) C = 100 nF RDL 100 Ω D OUT (–) C = 100 nF NOTE: AC coupling capacitors should be used to connect data outputs to data inputs between the HFBR-772BWZ, HFBR-782BZ, and host board ICs (eg ASIC) with either 50Ω single ended or 100Ω differential terminations as shown. The capacitors' value can be reduced from 100 nF (0603 size) if the data rate and run length are limited. Figure 7. Recommended ac coupling and data signal termination. V DI/O+ D IN+ + ∆V DIN TRANSMITTER ∆V DI/OH – ∆V DI/OL D IN– V DI/O– D OUT+ + RECEIVER ∆V DOUT – ∆V DI/OH V DI/O REFERS TO EITHER V DIN OR V DOUT AS APPROPRIATE Figure 8. Differential signals. 16 + D V DI/O P-P D OUT– ∆V DI/OL – Unused receiver channel outputs must be terminated 2 x ∅2.54 MIN. PAD KEEP-OUT Æ 0.1 A B-C 2 x ∅1.7 ± 0.05 HOLES Æ 0.1 A B-C 3 x ∅ 4.17 MIN. PAD KEEP-OUT Æ 0.1 A B-C 5.46 B 3 x ∅ 2.69 ± 0.05 HOLES FOR #2 SCREW ∅ 0.1 A B-C A Rx SYM. 13.72 18 REF. 100 PIN FCI MEG-Array® RECEPTACLE CONNECTORS 18.42 MIN. C Tx SYM. 9 x 1.27 TOT = 11.43 END OF MODULE FRONT (10 x 10 =) 100 x ∅ 0.58 ± 0.05 PADS ∅ 0.05 A B-C 8.00 50 KEEP-OUT AREA FOR MPO CONNECTOR 9 x 1.27 TOT = 11.43 1.89 REF. 8.95 REF. 30.23 PCB LAYOUT (TOP VIEW) Note: The host electrical connector attached to the PCB must be a 100-position FCI Meg-Array Plug (FCI PN: 84512-102) or equivalent. Figure 9. Package board footprint (dimensions in mm). PCB top view. 17 V CCR 50 Ω V CCT 50 Ω D IN+ D OUT+ D OUT– 50Ω Z IN 50Ω V BIAS (NOMINAL 1.7 V) D IN– V EE V EE Figure 10. Rx data output equivalent circuit. Figure 11. Tx data input equivalent circuit. V CC > 2.8 V V CC ~60 ms ~6.5 ms SHUTDOWN TX OUT 0 NORMAL ~4.6 ms TX OUT 1 SHUTDOWN NORMAL ~4.6 ms TX OUT 2 SHUTDOWN TX OUT 11 SHUTDOWN NORMAL NORMAL Figure 12. Typical transmitter power-up sequence. NO FAULT DETECTED FAULT DETECTED ~Toff <200 µs -FAULT TX OUT CH 0-11 Figure 13. Transmitter FAULT signal timing diagram. 18 ~100 ns RESET FAULT > 100 ns (Ton) ~55 ms ~4.2 ms SHUTDOWN ~4.6 ms TX OUT 0 NORMAL TX OUT 1 ~4.6 ms TX OUT 2 TX OUT 11 ~5 µs (Toff) Figure 14. Transmitter RESET timing diagram. TX_DIS TX_EN ~5 µs (Toff) TX OUT CH 0-11 NORMAL ~5 µs (Toff) TX OUT CH 0-11 SHUTDOWN (a) TX_EN [1] ~4.2 ms SHUTDOWN (b) NOTE [1]: TX_DIS, WHICH IS NOT SHOWN, IS THE FUNCTIONAL COMPLIMENT OF TX_EN. (Ton) ~55 ms ~4.6 ms TX OUT CH 0 TX OUT CH 1 TX OUT CH 11 (c) Figure 15. Transmitter TX_EN and TX_DIS timing diagram. 19 NORMAL Module Outline Notes: 1. Module supplied with port process plug. 2. Module mass approximately 20 grams. Figure 16. Package outline for HFBR-772BWZ and HFBR-782BZ (dimensions in mm). 20 Notes: 1. Module supplied with port process plug. 2. Module mass approximately 20 grams. Figure 17. Package Outline for HFBR-772BHWZ/782BHZ (dimensions in mm) 21 Figure 18. Package Outline for HFBR-772BEWZ/782BEZ (dimensions in mm) 22 Figure 19. Package Outline for HFBR-772BEPWZ/782BEPZ (dimensions in mm) 23 Figure 20. Host Frontplate Layout (dimensions in mm) For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0658EN AV02-1158EN - January 29, 2013 HFBR-772BxxxZ and HFBR-782BxxZ Pluggable Parallel Fiber Optic Modules, Transmitter and Receiver Datasheet Addendum Description The HFBR-772BxxxZ transmitter and HFBR-782Bxxz receiver are high performance fiber optic modules for parallel optical data communications applications. These 12 channels devices are optimized for short reach optical link applications requiring data transfer rates of up to 2.7 Gb/s per channel. For applications requiring higher data rates, the HFBR-772BxxxZ and HFBR-782Bxxz can be operated at 3.125 Gb/s with reduced link length and marginally increased link contributed jitter. This data sheet addendum highlights the changes to maximum link distance and contributed jitter that can be expected when operating at 3.125 Gb/s. Table 1. Modified Module Specifications @ 3.125 Gb/s Description Units Notes Link Distance (500 MHz.km) Symbol Maximum 220 Average Minimum m 300 m max @ 2.5 Gb/s Link Distance (2000 MHz.km) 400 m 600 m max @ 2.5 Gb/s TX Contributed Deterministic Jitter DJ 70 30 ps 60 ps @ 2.5 Gb/s TX Contributed Total Jitter TJ 130 70 ps 120 ps @ 2.5 Gb/s RX Input Optical Power Sensitivity Pin Min -14 -16.5 dBm avg -16 dBm max @2.5 Gb/s ps 120ps min @ 2.5 Gb/s Stressed RX Eye Opening 180 110 Patent - www.avagotech.com/patents For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Addendum to AV02-1158EN - January 29, 2013