INTERSIL HIN237CB-T

HIN232, HIN236, HIN237,HIN238,
HIN239, HIN240, HIN241
®
Data Sheet
August 31, 2005
FN3138.15
+5V Powered RS-232
Transmitters/Receivers
Features
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and -10V supplies from the 5V supply.
The family of devices offer a wide variety of RS-232
transmitter/receiver combinations to accommodate various
applications (see Selection Table).
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN239)
The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
• Multiple Drivers
- ±10V Output Swing for 5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Meets All RS-232E and V.28 Specifications
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Receivers
- ±30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
LEADS
HIN232
+5V
2
2
4 Capacitors
No/No
16
HIN236
+5V
4
3
4 Capacitors
Yes/Yes
24
HIN237
+5V
5
3
4 Capacitors
No/No
24
HIN238
+5V
4
4
4 Capacitors
No/No
24
HIN239
+5V and +7.5V to 13.2V
3
5
2 Capacitors
No/Yes
24
HIN240
+5V
5
5
4 Capacitors
Yes/Yes
44
HIN241
+5V
4
5
4 Capacitors
Yes/Yes
28
PART
NUMBER
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright © Intersil Americas Inc. 2004, 2005. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pin Descriptions
PIN
VCC
FUNCTION
Power Supply Input 5V ±10%.
V+
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
V-
Internally generated negative supply (-10V nominal).
GND
Ground lead. Connect to 0V.
C1+
External capacitor (+ terminal) is connected to this lead.
C1-
External capacitor (- terminal) is connected to this lead.
C2+
External capacitor (+ terminal) is connected to this lead.
C2-
External capacitor (- terminal) is connected to this lead.
TIN
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.
TOUT
RIN
ROUT
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
EN
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in
a high impedance state.
SD
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
NC
No Connect. No connections are made to these leads.
2
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Ordering Information (Continued)
Ordering Information
PART
NUMBER
PART
MARKING
TEMP.
RANGE
(oC)
PACKAGE
HIN232CB
232CB
0 to 70
16 Ld SOIC
HIN232CB-T
232CB
0 to 70
Tape and Reel
HIN232CBZ
(See Note)
232CBZ
0 to 70
16 Ld SOIC
(Pb-free)
PKG.
DWG. #
M16.3
M16.3
HIN232CBZ-T 232CBZ
(See Note)
0 to 70
Tape and Reel (Pb-free)
HIN232CP
HIN232CP
0 to 70
16 Ld PDIP
E16.3
HIN232CPZ
(See Note)
HIN232CPZ
0 to 70
16 Ld PDIP*
(Pb-free)
E16.3
M16.3
HIN232IB
232IB
-40 to 85 16 Ld SOIC
HIN232IB-T
232IB
-40 to 85 Tape and Reel
HIN232IBZ
(See Note)
232IBZ
-40 to 85 16 Ld SOIC
(Pb-free)
M16.3
HIN232IBZ-T
(See Note)
232IBZ
HIN232IP
HIN232IP
-40 to 85 16 Ld PDIP
E16.3
HIN232IPZ
(See Note)
HIN232IPZ
-40 to 85 16 Ld PDIP*
(Pb-free)
E16.3
HIN236CB
236CB
0 to 70
24 Ld SOIC
M24.3
HIN236CBZ
(See Note)
236CBZ
0 to 70
24 Ld SOIC
(Pb-free)
M24.3
M24.3
-40 to 85 Tape and Reel (Pb-free)
HIN237CB
237CB
0 to 70
24 Ld SOIC
HIN237CB-T
237CB
0 to 70
Tape and Reel
HIN237CBZ
(See Note)
237CBZ
0 to 70
24 Ld SOIC
(Pb-free)
HIN237CBZ-T 237CBZ
(See Note)
0 to 70
Tape and Reel (Pb-free)
HIN238CB
238CB
0 to 70
24 Ld SOIC
HIN238CB-T
238CB
0 to 70
Tape and Reel
HIN238CBZ
(See Note)
238CBZ
0 to 70
24 Ld SOIC
(Pb-free)
HIN238CBZ-T 238CBZ
(See Note)
0 to 70
Tape and Reel (Pb-free)
M24.3
M24.3
M24.3
HIN238CP
HIN238CP
0 to 70
24 Ld PDIP
E24.3
HIN238CPZ
(See Note)
HIN238CPZ
0 to 70
24 Ld PDIP*
(Pb-free)
E24.3
HIN238IB
238IB
-40 to 85 24 Ld SOIC
M24.3
HIN238IBZ
(See Note)
238IBZ
-40 to 85 24 Ld SOIC
(Pb-free)
M24.3
HIN239CB
239CB
0 to 70
24 Ld SOIC
HIN239CB-T
239CB
0 to 70
Tape and Reel
HIN239CBZ
(See Note)
239CBZ
0 to 70
24 Ld SOIC
(Pb-free)
HIN239CBZ-T 239CBZ
(See Note)
0 to 70
Tape and Reel (Pb-free)
HIN239CP
0 to 70
24 Ld PDIP
HIN239CP
3
M24.3
M24.3
E24.3
PART
NUMBER
PART
MARKING
TEMP.
RANGE
(oC)
HIN239CPZ
(See Note)
HIN239CPZ
0 to 70
24 Ld PDIP*
(Pb-free)
E24.3
HIN240CN
HIN240CN
0 to 70
44 Ld MQFP
Q44.10X10
HIN240CNZ
(See Note)
HIN240CNZ
0 to 70
44 Ld MQFP
(Pb-free)
Q44.10X10
HIN240CNZ-T HIN240CNZ
(See Note)
0 to 70
44 Ld MQFP Tape and Reel
(Pb-free)
HIN241CA
HIN241CA
0 to 70
28 Ld SSOP
M28.209
HIN241CAZ
(See Note)
HIN241CAZ
0 to 70
28 Ld SSOP
(Pb-free)
M28.209
M28.3
PACKAGE
PKG.
DWG. #
HIN241CB
241CB
0 to 70
28 Ld SOIC
HIN241CB-T
241CB
0 to 70
Tape and Reel
HIN241CBZ
(See Note)
241CBZ
0 to 70
28 Ld SOIC
(Pb-free)
HIN241CBZ-T 241CBZ
(See Note)
0 to 70
Tape and Reel (Pb-free)
M28.3
HIN241IB
241IB
-40 to 85 28 Ld SOIC
M28.3
HIN241IBZ
(See Note)
241IBZ
-40 to 85 28 Ld SOIC
(Pb-free)
M28.3
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
HIN232 (PDIP, SOIC)
TOP VIEW
HIN236 (SOIC)
TOP VIEW
T3OUT
1
24 T4OUT
15 GND
T1OUT
2
23 R2IN
14 T1OUT
T2OUT
3
22 R2OUT
R1IN
4
21 SD
R1OUT
5
20 EN
T2IN
6
19 T4IN
16 VCC
C1+ 1
V+ 2
C1- 3
13 R1IN
C2+ 4
12 R1OUT
C2- 5
6
11 T1IN
T2OUT 7
10 T2IN
V-
9 R2OUT
R2IN 8
T1IN
7
18 T3IN
GND
8
17 R3OUT
VCC
9
16 R3IN
C1+ 10
14 C2-
C1- 12
13 C2+
+5V
+5V
+
1µF
16
1µF
1
NOTE 1
+
3
4
NOTE 1
T1IN
+
5
11
VCC
C1+
C1C2+
C2-
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
+5V
400kΩ
V+
2
+
NOTE 1
1µF
T1IN
V- 6
+
T2IN
T1
14
T2IN
10
T1OUT
T2
7
12
T2OUT
T4IN
R1IN
T1
+5V
400kΩ
T2
6
18
+5V
400kΩ
T3
+5V
400kΩ
19
T4
2
3
1
24
R2OUT
8
1µF
1µF
T1OUT
T2OUT
T3OUT
T4OUT
4
R1IN
5kΩ
R1
22
9
+
V- 15
R1OUT
5kΩ
R1
V+
11
+
+5V
400kΩ
7
5
13
R1OUT
9
10
VCC
C1+
+
+5V TO 10V
12
C1- VOLTAGE DOUBLER
13
C2+
+
+10V TO -10V
14
VOLTAGE INVERTER
C2-
NOTE 1
T3IN
+5V
400kΩ
15 V-
V+ 11
23
R2IN
R2OUT
R2IN
5kΩ
R2
5kΩ
R2
17
16
R3IN
R3OUT
15
20
5kΩ
R3
SD
EN
NOTE:
8
1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor
may be terminated to VCC or to GND.
4
21
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
HIN237 (SOIC)
TOP VIEW
HIN238 (PDIP, SOIC)
TOP VIEW
T3OUT 1
24 T4OUT
T2OUT 1
24 T3OUT
T1OUT 2
23 R2IN
T1OUT 2
23 R3IN
T2OUT 3
22 R2OUT
R2IN 3
R2OUT 4
22 R3OUT
21 T4IN
T1IN 5
R1OUT 6
20 T4OUT
19 T3IN
18 T2IN
17 R4OUT
R1IN
21 T5IN
4
R1OUT 5
20 T5OUT
T2IN
6
19 T4IN
T1IN
7
18 T3IN
R1IN 7
GND
8
17 R3OUT
VCC
9
16 R3IN
GND 8
VCC 9
C1+ 10
C1+ 10
15 V-
V+ 11
14 C2-
V+ 11
14 C2-
C1- 12
13 C2+
C1- 12
13 C2+
+5V
+5V
9
1µF
1µF
T1IN
T2IN
T3IN
T4IN
T5IN
10
C1+
+
12
C113
C2+
+
14
C2-
16 R4IN
15 V-
11
+5V TO 10V
VOLTAGE DOUBLER
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400kΩ
7
T1
+5V
400kΩ
T2
6
18
+5V
400kΩ
T3
T4
+5V
400kΩ
21
T5
+
1µF
1µF
1µF
+
2
3
+5V
400kΩ
19
9
1µF
VCC
1
24
T1OUT
T1IN
T2OUT
T2IN
T3OUT
T3IN
T4OUT
T4IN
10
C1+
+
12
C113
C2+
+
14
C2-
1µF
VCC
+5V TO 10V
VOLTAGE DOUBLER
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
5
T5OUT
T1
+5V
400kΩ
T2
18
19
+5V
400kΩ
T3
+5V
400kΩ
21
T4
2
1
24
20
22
4
R2IN
R2IN
22
23
R3IN
5kΩ
R3
17
T4OUT
5kΩ
R3OUT
5kΩ
T3OUT
3
R2
23
R2
T2OUT
R1IN
R2OUT
R2OUT
T1OUT
5kΩ
R1
R1IN
5kΩ
R1
1µF
7
R1OUT
4
R1OUT
+
+
+5V
400kΩ
5
6
20
11
16
R3IN
R3OUT
5kΩ
R3
17
16
R4IN
R4OUT
5kΩ
R4
8
5
8
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
HIN239 (PDIP, SOIC)
TOP VIEW
R1OUT 1
24 T1IN
R1IN 2
23 T2IN
GND 3
22 R2OUT
VCC 4
21 R2IN
NC
R5IN
R5OUT
T3IN
T4IN
R4OUT
R4IN
T5OUT
EN
SD
NC
HIN240 (MQFP)
44 43 42 41 40 39 38 37 36 35 34
33
2
32
NC
1
T5IN
NC
NC
V+ 5
20 T2OUT
R3OUT
3
31
NC
C1+ 6
19 T1OUT
R3IN
4
30
V-
C1- 7
18 R3IN
T4OUT
5
29
C2-
17 R3OUT
T3OUT
6
28
C2+
C1-
V-
8
16 T3IN
T1OUT
7
27
R5OUT 10
15 NC
T2OUT
8
26
V+
R4OUT 11
14 EN
NC
9
25
C1+
R2IN
NC
NC
NC
NC
NC
VCC
GND
R1IN
R1OUT
NC
T1IN
24
10
11
23
12 13 14 15 16 17 18 19 20 21 22
NC
T2IN
13 T3OUT
R4IN 12
R2OUT
R5IN 9
+5V
+7.5V TO +13.2V (NOTE)
+5V
4
6
1µF
+
7
(NOTE)
T1IN
T2IN
T3IN
R1OUT
VCC
C1+
C1-
+10V TO -10V
VOLTAGE INVERTER
+5V
400kΩ
24
23
16
1µF
+5V
400kΩ
+5V
400kΩ
V+
V-
5
8
1µF
+
T1
19
1µF
T1OUT
T2
20
T3
13
T2OUT
T2IN
T3OUT
T3IN
R1IN
T4IN
2
1
R1
5kΩ
22
T5IN
21
R2IN
R2OUT
R2
5kΩ
R1OUT
17
18
R3IN
R3
5kΩ
11
+5V
400kΩ
37
T3
+5V
400kΩ
T4
+5V
400kΩ
2
T5
38
R4IN
10
1µF
7
T1OUT
T2OUT
T3OUT
T4OUT
41
T5OUT
17
R1IN
5kΩ
13
10
R2IN
5kΩ
3
4
R3IN
R3OUT
5kΩ
40
R4IN
R4OUT
R4
5kΩ
5kΩ
36
EN
35
R5IN
R5OUT
3
42
R5
EN
NOTE: For V+ > 11V, use C1 ≤ 0.1µF.
6
1µF
30
5
39
R5IN
+
6
R3
9
V-
26
8
16
5kΩ
R5OUT
V+
R2OUT
12
R5
T2
R2
R4OUT
R4
+5V
400kΩ
14
R1
R3OUT
14
T1IN
19
25
VCC
C1+
+
+5V TO 10V
27
C1- VOLTAGE DOUBLER
28
C2+
+10V TO -10V
+
29
VOLTAGE INVERTER
C2+5V
T1
400kΩ
15
18
5kΩ
43
SD
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
HIN241 (SOIC, SSOP)
TOP VIEW
T3OUT 1
28 T4OUT
T1OUT 2
27 R3IN
T2OUT 3
26 R3OUT
R2IN 4
25 SD
R2OUT 5
24 EN
T2IN 6
23 R4IN
T1IN 7
22 R4OUT
R1OUT 8
21 T4IN
R1IN 9
20 T3IN
GND 10
19 R5OUT
VCC 11
18 R5IN
C1+ 12
17 V-
V+ 13
16 C2-
C1- 14
15 C2+
+5V
1µF
1µF
T1IN
T2IN
T3IN
T4IN
R1OUT
11
12
V
CC
C1+
+
+5V TO 10V
14
C1- VOLTAGE DOUBLER
15
C2+
+
+10V TO -10V
16
VOLTAGE INVERTER
C2+5V
400kΩ
7
T1
+5V
400kΩ
6
T2
+5V
400kΩ
20
T3
+5V
400kΩ
T4
21
1µF
V+
13
+
V- 17
+ 1µF
2
T1OUT
3
T2OUT
1
T3OUT
28
8
T4OUT
9
R1IN
5kΩ
R1
5
4
R2IN
R2OUT
5kΩ
R2
26
27
R3IN
R3OUT
5kΩ
R3
22
23
R4IN
R4OUT
5kΩ
R4
19
18
R5IN
R5OUT
24
5kΩ
R5
25
EN
10
7
SD
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Thermal Resistance (Typical, Note 3)
16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . .
90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC, SSOP, MQFP - Lead Tips Only)
Operating Conditions
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
θJA (oC/W)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
HIN232
-
5
10
mA
HIN236-HIN238, HIN240-HIN241
-
7
15
mA
HIN239
-
0.4
1
mA
HIN239
-
5.0
15
mA
-
1
10
µA
-
-
0.8
V
SUPPLY CURRENTS
Power Supply Current, ICC
No Load,
TA = 25oC
V+ Power Supply Current, ICC
No Load, TA = 25oC
No Load,
TA = 25oC
Shutdown Supply Current, ICC(SD)
TA = 25oC
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN, EN, Shutdown
Input Logic High, VlH
TIN
2.0
-
-
V
EN, Shutdown
2.4
-
-
V
Transmitter Input Pullup Current, IP
TIN = 0V
-
15
200
µA
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 1.6mA
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1.0mA
3.5
4.6
-
V
-30
-
+30
V
RECEIVER INPUTS
RS-232 Input Voltage Range VIN
Receiver Input Impedance RIN
VIN = ±3V
3.0
5.0
7.0
kΩ
Receiver Input Low Threshold, VlN (H-L)
VCC = 5V, TA = 25oC
0.8
1.2
-
V
Receiver Input High Threshold, VIN (L-H)
VCC = 5V, TA = 25oC
-
1.7
2.4
V
0.2
0.5
1.0
V
Receiver Input Hysteresis VHYST
8
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued)
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
120
-
-
kbps
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
RL = 3kΩ
Output Enable Time, tEN
HIN236, HIN239, HIN240, HIN241
-
400
-
ns
Output Disable Time, tDIS
HIN236, HIN239, HIN240, HIN241
-
250
-
ns
Propagation Delay, tPD
RS-232 to TTL
-
0.5
-
µs
Instantaneous Slew Rate SR
CL = 10pF, RL = 3kΩ, TA = 25oC (Note 4)
-
-
30
V/µs
Transition Region Slew Rate, SRT
RL = 3kΩ, CL = 2500pF Measured from +3V to -3V or
-3V to +3V, 1 Transmitter Switching
-
3
-
V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT
Transmitter Outputs, 3kΩ to Ground
±5
±9
±10
V
Output Resistance, TOUT
VCC = V+ = V- = 0V, VOUT = ±2V
300
-
-
Ω
RS-232 Output Short Circuit Current, ISC
TOUT shorted to GND
-
±10
-
mA
NOTE:
4.
Guaranteed by design.
VOLTAGE DOUBLER
C1+
S1
VOLTAGE INVERTER
S2
V+ = 2VCC
S5
C2+
S6
VCC
GND
+
-
+
C1
-
+
C3
VCC
GND
C1-
S3
S4
GND
S7
C2-
+
C2
-
C4
V- = -(V+)
S8
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
Detailed Description
The HIN232 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN239), feature low power consumption, and
meet all ElA RS-232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter, and
receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the voltage
doubler and the voltage inverter. Each section is driven by a
two phase, internally generated clock to generate +10V and
-10V. The nominal clock frequency is 16kHz. During phase
one of the clock, capacitor C1 is charged to VCC . During
phase two, the voltage on C1 is added to VCC , producing a
signal across C3 equal to twice VCC . During phase one, C2 is
also charged to 2VCC , and then during phase two, it is
inverted with respect to ground to produce a signal across C4
equal to -2VCC . The charge pump accepts input voltages up
9
to 5.5V. The output impedance of the voltage doubler section
(V+) is approximately 200Ω, and the output impedance of the
voltage inverter section (V-) is approximately 450Ω. A typical
application uses 1µF capacitors for C1-C4, however, the value
is not critical. Increasing the values of C1 and C2 will lower the
output impedance of the voltage doubler and inverter,
increasing the values of the reservoir capacitors, C3 and C4,
lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN236, HIN240 and HIN241),
SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to VCC , V- is pulled up to GND,
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Transmitters
Receivers
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic threshold
is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1 at the
input results in a voltage of between -5V and V- at the output,
and a logic 0 results in a voltage between +5V and (V+ -0.6V).
Each transmitter input has an internal 400kΩ pullup resistor so
any unused input can be left unconnected and its output
remains in its low state. The output voltage swing meets the
RS-232C specifications of ±5V minimum with the worst case
conditions of: all transmitters driving 3kΩ minimum load
impedance, VCC = 4.5V, and maximum allowable operating
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300Ω with
±2V applied to the outputs and VCC = 0V.
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC . The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN236, 239, 240, and 241)
disables the receiver outputs, placing them in the high
impedance mode. The receiver outputs are also placed in
the high impedance state when in shutdown mode.
VCC
RXIN
-30V < RXIN < +30V
V+
ROUT
5kΩ
GND < VROUT < VCC
GND
VCC
400kΩ
300Ω
TXIN
TOUT
GND < TXIN < VCC
V- < VTOUT < V+
FIGURE 3. RECEIVER
V-
FIGURE 2. TRANSMITTER
TIN
OR
RIN
TOUT
OR
ROUT
VOL
VOL
tPHL
Average Propagation Delay =
tPLH
tPHL + tPLH
2
FIGURE 4. PROPAGATION DELAY DEFINITION
10
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Typical Performance Curves
TA = 25oC
12
12
SUPPLY VOLTAGE (|V|)
V- SUPPLY VOLTAGE
1µF
10
0.47µF
8
0.10µF
6
4
TRANSMITTER OUTPUTS
OPEN CIRCUIT
10
V+ (VCC = 5V)
8
6
V+ (VCC = 4.5V)
V- (VCC = 4.5V)
4
V- (VCC = 5V)
2
2
0
0
3.0
4.0
3.5
4.5
VCC
5.0
5.5
6.0
FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING
CAPACITORS
0
5
10
15
20
|ILOAD| (mA)
25
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
Test Circuits (HIN232)
+4.5V TO
+5.5V INPUT
-
1µF
C3
1µF
C1
+
+
-
1µF +
C2 -
-
+
3kΩ
1µF C4
1 C1+
VCC 16
2 V+
GND 15
T1OUT 14
4 C2+
R1IN 13
RS-232 ±30V INPUT
5 C2-
R1OUT 12
TTL/CMOS OUTPUT
T1 OUTPUT
6 V-
T1IN 11
TTL/CMOS INPUT
7 T2OUT
T2IN 10
TTL/CMOS INPUT
8 R2IN
R2OUT 9
1 C1+
VCC 16
2 V+
GND 15
3 C1-
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
3kΩ
3 C1-
TTL/CMOS OUTPUT
6 V-
T1IN 11
7 T2OUT
T2IN 10
8 R2IN
R2OUT 9
ROUT = VIN/1 T2OUT
T2
OUTPUT
T1OUT
VIN = ±2V
RS-232
±30V INPUT
FIGURE 7. GENERAL TEST CIRCUIT
11
30
A
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
35
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Applications
+5V
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
TD
TTL/CMOS
INPUTS AND
OUTPUTS
RTS
6
5
11
-
RS-232
INPUTS AND OUTPUTS
+
T1
14
T2
10
TTL/CMOS RTS
INPUTS AND
12
RD
OUTPUTS
R2
9
CTS
7
13
R1
8
15
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
-
14
T2
10
+ C2
1µF
5
T1
11
12
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
RD
9
HIN232
4
HIN232
3
CTS
3
C2 +
1µF TD
DTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
SELECT
2
4
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
1
16
1
C1 +
1µF -
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
C1 +
1µF -
+
R2
R1
8
CTS (5) CLEAR TO SEND
15
16
2
-
C3
+
+
C4
6
V- V+
2µF
6
-
2µF
2
16
+5V
RS-232
INPUTS AND OUTPUTS
HIN232
C1 +
1µF DTR
TTL/CMOS
INPUTS AND
OUTPUTS
DSRS
1
4
3
5
T1
11
14
T2
10
12
7
13
DCD
R1
9
R2
R1
15
8
+ C2
1µF
-
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
12
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Die Characteristics
DIE DIMENSIONS
PASSIVATION
160 mils x 140 mils
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
METALLIZATION
Type: Al
Thickness: 10kÅ ±1kÅ
TRANSISTOR COUNT
238
SUBSTRATE POTENTIAL
PROCESS
V+
CMOS Metal Gate
Metallization Mask Layout
HIN240
T2OUT T1OUT
T3OUT T4OUT
R3OUT
R3IN
T5IN
R2IN
SHUTDOWN
R2OUT
EN
T2IN
T5OUT
T1IN
R4IN
R1OUT
R4OUT
R1IN
T4IN
GND
T3IN
R5OUT
VCC
R5IN
C1+
13
V+
C1-
C2+
C2-
V-
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AE
D
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
C
D
0.735
0.775
18.66
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.005
-
0.13
-
5
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
eB
-
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
L
0.115
N
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
14
5
E
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
0.355
19.68
D1
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
0.204
16
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
10.92
3.81
16
6
7
4
9
Rev. 0 12/93
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
E24.3 (JEDEC MS-001-AF ISSUE D)
N
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
E1
INDEX
AREA
1 2 3
N/2
INCHES
-B-
SYMBOL
-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
MILLIMETERS
MIN
MAX
MIN
MAX
NOTES
-
5.33
4
-
4
A
-
0.210
A1
0.015
-
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8
C
0.008
0.014
0.204
0.355
-
D
1.230
1.280
31.24
D1
0.005
-
0.13
-
5
0.39
32.51
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
L
0.115
0.150
N
24
2.93
24
10.92
7
3.81
4
9
Rev. 0 12/93
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
INDEX
AREA
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
H
0.25(0.010) M
B M
INCHES
E
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
α
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
16
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
16
0°
16
8°
0°
7
8°
Rev. 1 6/05
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
µα
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
17
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
N
α
NOTES:
MILLIMETERS
24
0o
1.27
24
8o
0o
6
7
8o
Rev. 0 12/93
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
18
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
α
NOTES:
MILLIMETERS
MAX
A1
e
µα
MIN
28
0o
28
7
8o
Rev. 0 12/93
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
INDEX
AREA
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
H
0.25(0.010) M
2
GAUGE
PLANE
3
0.25
0.010
SEATING PLANE
-A-
INCHES
E
-B-
1
B M
A
D
-C-
α
e
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
A2
A1
B
0.25(0.010) M
L
B S
NOTES:
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
19
0.026 BSC
H
0.292
L
0.022
N
α
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
MILLIMETERS
0.65 BSC
0.322
7.40
0.037
0.55
28
0°
-
0.95
6
28
8°
0°
-
8.20
7
8°
Rev. 2 6/05
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Metric Plastic Quad Flatpack Packages (MQFP)
Q44.10x10 (JEDEC MS-022AB ISSUE B)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
D
D1
-D-
INCHES
-A-
-B-
E E1
e
PIN 1
SEATING
A PLANE
-H-
0.076
0.003
-C-
12o-16o
0.40
0.016 MIN
0.20
M
0.008
C A-B S
0o MIN
A2 A1
0o-7o
L
MIN
MAX
MIN
MAX
NOTES
A
-
0.096
-
2.45
-
A1
0.004
0.010
0.10
0.25
-
A2
0.077
0.083
1.95
2.10
-
b
0.012
0.018
0.30
0.45
6
b1
0.012
0.016
0.30
0.40
-
D
0.515
0.524
13.08
13.32
3
D1
0.389
0.399
9.88
10.12
4, 5
E
0.516
0.523
13.10
13.30
3
E1
0.390
0.398
9.90
10.10
4, 5
L
0.029
0.040
0.73
1.03
N
44
44
e
0.032 BSC
0.80 BSC
7
Rev. 2 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
b
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
b1
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
BASE METAL
WITH PLATING
SYMBOL
D S
0.13/0.17
0.005/0.007
12o-16o
MILLIMETERS
0.13/0.23
0.005/0.009
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20