Surface Mount Microwave Schottky Mixer Diodes Technical Data Features HSMS-8101 Single HSMS-8202 Series Pair HSMS-8207 Ring Quad HSMS-8209 Crossover Quad Plastic SOT-23 Package • Optimized for use at 10-14 GHz • Low Capacitance Package Lead Code Identification (Top View) SINGLE 3 • Low Conversion Loss SERIES 3 • Low RD • Low Cost Surface Mount Plastic Package • Lead-free Option Available 1 Plastic SOT-143 Package Description/Applications These low cost microwave Schottky diodes are specifically designed for use at X/Ku-bands and are ideal for DBS and VSAT downconverter applications. They are available in SOT-23 and SOT-143 standard package configurations. #1 2 RING QUAD 3 4 1 #7 2 1 #2 2 CROSS-OVER QUAD 3 4 1 #9 2 Note that Agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. Absolute Maximum Ratings [1], TA = +25°C Symbol Parameter PT PIV TJ TSTG, Top Total Device Dissipation[2] Peak Inverse Voltage Junction Temperature Storage and Operating Temperature Unit Min. Max. mW V °C °C — — — -65 75 4 +150 +150 ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to zero at 150°C per diode. 2 DC Electrical Specifications, TA = 25°C Symbol Parameters and Test Conditions HSMS-8101 Units Min. Max. HSMS-8209 Min. Max. Breakdown Voltage IR = 10 µA V CT Total Capacitance VR = 0 V, f = 1 MHz pF 0.26 0.26 0.26 0.26 ∆C T Capacitance Difference VR = 0 V, f = 1 MHz pF — 0.04 0.04 0.04 Dynamic Resistance IF = 5 mA Ω 14 14 14 14 Dynamic Resistance Difference IF = 5 mA Ω — 2 2 2 ∆RD VF ∆VF Forward Voltage IF = 1 mA mV Forward Voltage Difference IF = 1 mA mV Lead Code Package Marking Code in White where x is date code 4 HSMS-8207 Min. Max. VBR RD 4 HSMS-8202 Min. Max. 250 350 4 250 350 — 4 250 350 20 250 350 20 20 1 2 7 9 R1x 2Rx R7x R9x RF Electrical Parameters, TA = 25°C Symbol Parameter Units Typical Lc Conversion Loss at 12 GHz dB 6.3 Z IF IF Impedance Ω 150 SWR SWR at 12 GHz 1.2 Note: DC Load Resistance = 0 Ω; LO Power = 1 mW. SPICE Parameters IS = 4.6 E-8 RS = 6 N = 1.09 BV = 7.3 IBV = 10E-5 EG = 0.69 CJO = 0.18 E-12 PB (VJ) = 0.5 M = 0.5 FC = 0.5 Linear Equivalent Circuit TT = 0 0.08 pF 1.0 nH 1.3 nH 6Ω 0.17 pF Rj Self Bias Rj 1 mA 263 2.5 mA 142 3 1 TA = +125°C TA = +25°C TA = –55°C 0.1 0 0.2 0.4 0.6 0.8 IF (Left Scale) 10 10 ∆VF (Right Scale) 1 1 0.3 0.3 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 FORWARD VOLTAGE (V) 9 CONVERSION LOSS (dB) 10 0.01 30 30 IF - FORWARD CURRENT (mA) FORWARD CURRENT (mA) 100 ∆VF - FORWARD VOLTAGE DIFFERENCE (mV) Typical Performance, TC = 25°C 7 6 –7 –5 –3 –1 1 3 5 -BLK = Bulk -TR1 = 3K pc. Tape and Reel, Device Orientation Figures 4, 5 -TR2 = 10K pc. Tape and Reel, Device Orientation Figures 4, 5 Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” HSMS - 8101 - XXX Bulk or Tape and Reel Option Part Number Surface Mount Schottky Device Orientation REEL For lead-free option, the part number will have the character "G" at the end, eg. -TR2G for a 10K pc lead-free reel. CARRIER TAPE USER FEED DIRECTION COVER TAPE END VIEW TOP VIEW 4 mm ABC ABC END VIEW 4 mm ABC ABC Note: "AB" represents package marking code. "C" represents date code. Figure 4. Option -TR1/-TR2 for SOT-23 Packages. 11 13 Profile Option Descriptions Specify part number followed by option. For example: 8 mm 9 Figure 3. Typical Conversion Loss vs. Local Oscillator Power. Figure 2. Typical VF Match, HSMS820X Pairs and Quads. Ordering Information TOP VIEW 7 LOCAL OSCILLATOR POWER (dBm) V - FORWARD VOLTAGE (V) Figure 1. Typical Forward Current vs. Forward Voltage at Three Temperatures. 8 8 mm ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. Figure 5. Option -TR1/-TR2 for SOT-143 Packages. Package Characteristics Lead Material ...................................................................................... Alloy 42 Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260°C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) Package Dimensions Outline 23 (SOT-23) 1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE (XX) DATE CODE (X) 3 1.40 (0.055) 1.20 (0.047) XXX 2 1 0.60 (0.024) 0.45 (0.018) 2.65 (0.104) 2.10 (0.083) 2.04 (0.080) 1.78 (0.070) TOP VIEW 0.152 (0.006) 0.066 (0.003) 3.06 (0.120) 2.80 (0.110) 1.02 (0.041) 0.85 (0.033) 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) SIDE VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) Outline 143 (SOT-143) 0.92 (0.036) 0.78 (0.031) DATE CODE (X) 2 1 PACKAGE MARKING CODE (XX) 1.40 (0.055) 1.20 (0.047) XXX 4 2.65 (0.104) 2.10 (0.083) 3 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 0.54 (0.021) 0.37 (0.015) 3.06 (0.120) 2.80 (0.110) 0.15 (0.006) 0.09 (0.003) 1.04 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.69 (0.027) 0.45 (0.018) Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 Ko 9° MAX 13.5° MAX 8° MAX B0 A0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.229 ± 0.013 0.315 +0.012 –0.004 0.009 ± 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 For Outline SOT-143 P D P2 P0 E F W D1 www.agilent.com/semiconductors t1 For product information and a complete list of distributors, please go to our web site. K0 9° MAX 9° MAX A0 For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 B0 Europe: +49 (0) 6441 92460 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) China: 10800 650 0017 LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.19 ± 0.10 2.80 ± 0.10 1.31 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.126 ± 0.004 0.110 ± 0.004 0.052 ± 0.004 0.157 ± 0.004 0.039 + 0.010 Hong Kong: (65) 6756 2394 DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 Korea: (65) 6755 1989 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.254 ± 0.013 0.315+0.012 –0.004 0.0100 ± 0.0005 Taiwan: (65) 6755 1843 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 CAVITY PERFORATION India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-3328EN March 24, 2004 5989-0481EN