IC264 Series (Open Top) Ball Grid Array (BGA, 1.50mm Pitch) Specifications Part Number (Details) 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 W max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C 10,000 insertions min. Mating Cycles: 225 contact pins Pin Count: 25g to 35g per individual Contact Force: contact pin IC264 - 225 01 - 1 - ** - MF Series No. No. of Contact Pins Design Number NN: Without Positioning Pin #1, #2 NP: Without Positioning Pin #1, With Positioning Pin #2 PN: With Positioning Pin #1, Without Positioning Pin #2 Blank: With Positioning Pin #1, #2 Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel MF = Flanged Unmarked = Not Flanged Outline Socket Dimensions 13.0±0.1 (1.5±0.1)x14=21.0±0.15 57.0 37.6±0.1 4-R 3.0 25.0 56.0±0.1 50.0 4- Æ2.8 Recommended PC Board Layout Matching IC Dimensions Top View from Socket IC264-22501-1-**-** 56.0±0.05 27.00 ±0.2 +0.1 0 28.0±0.05 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER 2- Æ1.5 +0.1 0 28.0±0.05 25.4±0.05 1.5±0.05 225- Æ0.6 Test & Burn-In +0.1 0 32.5±0.05 13.0±0.05 1.50x14=21.00 4- Æ2.0 +0.1 0 2- 1.5x14=21.0±0.1 1.50±0.1 37.6±0.05 Æ0.75±0.1 1.30~1.80 0.60±0.1 4- Æ2.8