Series NP437 BGA / CSP 0.40mm Pitch (CMT - Open Top) SMT Devices Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Actuation Force: 1,000MΩ min. at 100V DC 100V AC for 1 minute 100mΩ max. at 10mA/20mV max. –40°C to +150°C 58.8mN (6gf) per pin approx. 29.6N (3kg) Please Contact Yamaichi Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features Open top socket for BGA / LGA / CSP packages with 0.4mm pitch. 22 x 22 maximum grid size and 11 x 11 maximum body size Depopulation versions available Compression mount 0.4 to 0.6mm fan-out type Outline Socket Dimensions Socket closed Socket open Typical IC Grid Size 22 x 22 (max.) Typical PCB Layout Top View from Socket Detail of Fan-out type 48 Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER