IGBT High speed IGBT in Trench and Fieldstop technology recommended in combination with SiC Diode IDH15S120 IGW25N120H3 1200V high speed switching series third generation Data sheet Industrial & Multimarket IGW25N120H3 High speed switching series third generation High speed IGBT in Trench and Fieldstop technology recommended in combination with SiC Diode IDH15S120 C Features: TRENCHSTOPTM technology offering • best in class switching performance: less than 500µJ total switching losses achievable • very low VCEsat • low EMI • maximum junction temperature 175°C • qualified according to JEDEC for target applications • Pb-free lead plating; RoHS compliant • complete product spectrum and PSpice Models: http://www.infineon.com/igbt/ G E Applications: • solar inverters • uninterruptible power supplies • welding converters • converters with high switching frequency Key Performance and Package Parameters Type IGW25N120H3 V†Š I† V†ŠÙÈÚ, TÝÎ=25°C TÝÎÑÈà Marking Package 1200V 25A 2.05V 175°C G25N120H3 PG-TO247-3 2 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation Table of Contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 .3 Testing Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 .5 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 3 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation Maximum ratings Parameter Symbol Value Unit Collector-emitter voltage V†Š 1200 V DC collector current, limited by TÝÎÑÈà T† = 25°C T† = 100°C I† 50.0 25.0 A Pulsed collector current, tÔ limited by TÝÎÑÈà I†ÔÛÐÙ 100.0 A Turn off safe operating area V†Š ù 1200V, TÝÎ ù 175°C - 100.0 A Gate-emitter voltage V•Š ±20 V Short circuit withstand time V•Š = 15.0V, V†† ù 600V Allowed number of short circuits < 1000 Time between short circuits: ú 1.0s TÝÎ = 175°C t»† Power dissipation T† = 25°C Power dissipation T† = 100°C PÚÓÚ 326.0 156.0 W Operating junction temperature TÝÎ -40...+175 °C Storage temperature TÙÚà -55...+150 °C µs 10 Soldering temperature, wave soldering 1.6 mm (0.063 in.) from case for 10s °C 260 Mounting torque, M3 screw Maximum of mounting processes: 3 M 0.6 Nm Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, junction - case RÚÌñÎ-Êò 0.46 K/W Thermal resistance junction - ambient RÚÌñÎ-Èò 40 K/W Electrical Characteristic, at TÝÎ = 25°C, unless otherwise specified Parameter Symbol Conditions Value min. typ. max. 1200 - - - 2.05 2.50 2.70 2.40 6.5 Unit Static Characteristic Collector-emitter breakdown voltage Vñ…çò†Š» V•Š = 0V, I† = 0.50mA V Collector-emitter saturation voltage V†ŠÙÈÚ V•Š = 15.0V, I† = 25.0A TÝÎ = 25°C TÝÎ = 125°C TÝÎ = 175°C Gate-emitter threshold voltage V•ŠñÚÌò I† = 0.85mA, V†Š = V•Š 5.0 5.8 Zero gate voltage collector current I†Š» V†Š = 1200V, V•Š = 0V TÝÎ = 25°C TÝÎ = 175°C - - Gate-emitter leakage current I•Š» V†Š = 0V, V•Š = 20V - - 600 nA Transconductance gËÙ V†Š = 20V, I† = 25.0A - 13.0 - S 4 V V 250.0 µA 2500.0 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation Electrical Characteristic, at TÝÎ = 25°C, unless otherwise specified Parameter Symbol Conditions Value Unit min. typ. max. - 1430 - - 95 - - 75 - - 115.0 - nC - 13.0 - nH - A Dynamic Characteristic Input capacitance CÍþÙ Output capacitance CÓþÙ Reverse transfer capacitance CØþÙ Gate charge Q• V†Š = 25V, V•Š = 0V, f = 1MHz V†† = 960V, I† = 25.0A, V•Š = 15V Internal emitter inductance LŠ measured 5mm (0.197 in.) from case Short circuit collector current Max. 1000 short circuits Time between short circuits: ú 1.0s I†ñ»†ò V•Š = 15.0V, V†† ù 600V, t»† ù 10µs TÝÎ = 175°C - pF 87 Switching Characteristic, Inductive Load, at TÝÎ = 25°C Parameter Symbol Conditions Value Unit min. typ. max. - 27 - ns - 41 - ns - 277 - ns - 17 - ns - 1.80 - mJ - 0.85 - mJ - 2.65 - mJ - 0.08 - mJ - 0.27 - mJ - 0.35 - mJ IGBT Characteristic Turn-on delay time tÁñÓÒò Rise time tØ Turn-off delay time tÁñÓËËò Fall time tË Turn-on energy EÓÒ Turn-off energy EÓËË Total switching energy EÚÙ Turn-on energy EÓÒ Turn-off energy EÓËË Total switching energy EÚÙ TÝÎ = 25°C, V†† = 600V, I† = 25.0A, V•Š = 0.0/15.0V, r• = 23.0Â, Lÿ = 80nH, Cÿ = 67pF Lÿ, Cÿ from Fig. E Energy losses include “tail” and diode (IKW25N120H3) reverse recovery. TÝÎ = 25°C, V†† = 800V, I† = 10.0A, V•Š = 0.0/15.0V, r• = 3.0Â, Lÿ = 80nH, Cÿ = 67pF Lÿ, Cÿ from Fig. E Energy losses include “tail” and diode (IDH15S120) reverse recovery. 5 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation Switching Characteristic, Inductive Load, at at Tvj 175°C/ 125°C TÝÎ == 175°C Parameter Symbol Conditions Value Unit min. typ. max. - 26 - ns - 35 - ns - 347 - ns - 50 - ns - 2.60 - mJ - 1.70 - mJ - 4.30 - mJ - 0.10 - mJ - 0.62 - mJ - 0.72 - mJ IGBT Characteristic Turn-on delay time tÁñÓÒò Rise time tØ Turn-off delay time tÁñÓËËò Fall time tË Turn-on energy EÓÒ Turn-off energy EÓËË Total switching energy EÚÙ Turn-on energy EÓÒ Turn-off energy EÓËË Total switching energy EÚÙ TÝÎ = 175°C, V†† = 600V, I† = 25.0A, V•Š = 0.0/15.0V, r• = 23.0Â, Lÿ = 80nH, Cÿ = 67pF Lÿ, Cÿ from Fig. E Energy losses include “tail” and diode (IKW25N120H3) reverse recovery. TÝÎ = 175°C, 125°C V†† = 800V, I† = 10.0A, V•Š = 0.0/15.0V, r• = 3.0Â, Lÿ = 80nH, Cÿ = 67pF Lÿ, Cÿ from Fig. E Energy losses include “tail” and diode (IDH15S120) reverse recovery. 6 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation 110 100 100 I†, COLLECTOR CURRENT [A] I†, COLLECTOR CURRENT [A] 90 80 70 60 50 40 T†=80° triangle 30 tÔ=1µs 10µs 10 50µs 100µs 200µs 500µs DC 1 T†=110° triangle 20 T†=80° rectangle 10 0 T†=110° rectangle 1 10 100 0.1 1000 1 f, SWITCHING FREQUENCY [kHz] 10 100 1000 V†Š, COLLECTOR-EMITTER VOLTAGE [V] Figure 1. Collector current as a function of switching frequency (TÎù175°C, D=0.5, V†Š=600V, V•Š=15/0V, R•=23Â) Figure 2. Forward bias safe operating area (D=0, T†=25°C, TÎù175°C; V•Š=15V) 350 50 300 I†, COLLECTOR CURRENT [A] PÚÓÚ, POWER DISSIPATION [W] 40 250 200 150 100 30 20 10 50 0 25 50 75 100 125 150 0 175 T†, CASE TEMPERATURE [°C] 25 50 75 100 125 150 175 T†, CASE TEMPERATURE [°C] Figure 3. Power dissipation as a function of case temperature (TÎù175°C) Figure 4. Collector current as a function of case temperature (V•Šú15V, TÎù175°C) 7 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation 100 100 V•Š=20V 17V 80 15V 13V 11V 60 9V 7V 5V 40 20 0 17V 80 I†, COLLECTOR CURRENT [A] I†, COLLECTOR CURRENT [A] V•Š=20V 15V 13V 11V 60 9V 7V 5V 40 20 0 2 4 0 6 0 V†Š, COLLECTOR-EMITTER VOLTAGE [V] Figure 5. Typical output characteristic (TÎ=25°C) 6 8 5.0 V†ŠñÙÈÚò, COLLECTOR-EMITTER SATURATION [A] TÎ=25°C TÎ=175°C 60 I†, COLLECTOR CURRENT [A] 4 Figure 6. Typical output characteristic (TÎ=175°C) 75 45 30 15 0 2 V†Š, COLLECTOR-EMITTER VOLTAGE [V] 5 10 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 15 V•Š, GATE-EMITTER VOLTAGE [V] I†=12.5A I†=25A I†=50A 0 25 50 75 100 125 150 175 TÎ, JUNCTION TEMPERATURE [°C] Figure 7. Typical transfer characteristic (V†Š=20V) Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (V•Š=15V) 8 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation 1000 1000 tÁñÓËËò tË tÁñÓÒò tØ t, SWITCHING TIMES [ns] t, SWITCHING TIMES [ns] tÁñÓËËò tË tÁñÓÒò tØ 100 10 5 15 25 35 100 10 45 5 15 I†, COLLECTOR CURRENT [A] Figure 9. Typical switching times as a function of collector current (ind. load, TÎ=175°C, V†Š=600V, V•Š=15/0V, R•=23Â, test circuit in Fig. E) 45 55 65 7 V•ŠñÚÌò, GATE-EMITTER THRESHOLD VOLTAGE [V] tÁñÓËËò tË tÁñÓÒò tØ t, SWITCHING TIMES [ns] 35 Figure 10. Typical switching times as a function of gate resistor (ind. load, TÎ=175°C, V†Š=600V, V•Š=15/0V, I†=25A, test circuit in Fig. E) 1000 100 10 25 R•, GATE RESISTOR [Â] 0 25 50 75 100 125 150 typ. min. max. 6 5 4 3 2 175 TÎ, JUNCTION TEMPERATURE [°C] 0 25 50 75 100 125 150 175 TÎ, JUNCTION TEMPERATURE [°C] Figure 11. Typical switching times as a function of junction temperature (ind. load, V†Š=600V, V•Š=15/0V, I†=25A, R•=23Â, test circuit in Fig. E) Figure 12. Gate-emitter threshold voltage as a function of junction temperature (I†=0.85mA) 9 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation 12 7 8 6 4 2 0 EÓËË EÓÒ EÚÙ 6 10 E, SWITCHING ENERGY LOSSES [mJ] E, SWITCHING ENERGY LOSSES [mJ] EÓËË EÓÒ EÚÙ 5 4 3 2 1 5 15 25 35 0 45 5 15 I†, COLLECTOR CURRENT [A] 25 35 45 55 65 R•, GATE RESISTOR [Â] Figure 13. Typical switching energy losses as a function of collector current (ind. load, TÎ=175°C, V†Š=600V, V•Š=15/0V, R•=23Â, test circuit in Fig. E) Figure 14. Typical switching energy losses as a function of gate resistor (ind. load, TÎ=175°C, V†Š=600V, V•Š=15/0V, I†=25A, test circuit in Fig. E) 6 EÓËË EÓÒ EÚÙ E, SWITCHING ENERGY LOSSES [mJ] E, SWITCHING ENERGY LOSSES [mJ] 4 EÓËË EÓÒ EÚÙ 3 2 1 0 0 25 50 75 100 125 150 5 4 3 2 1 0 400 175 TÎ, JUNCTION TEMPERATURE [°C] 500 600 700 800 V†Š, COLLECTOR-EMITTER VOLTAGE [V] Figure 15. Typical switching energy losses as a function of junction temperature (ind load, V†Š=600V, V•Š=15/0V, I†=25A, R•=23Â, test circuit in Fig. E) Figure 16. Typical switching energy losses as a function of collector emitter voltage (ind. load, TÎ=175°C, V•Š=15/0V, I†=25A, R•=23Â, test circuit in Fig. E) 10 Rev. 1.1, 2011-01-25 : : :L]] :Lf : ) (& :(: &o d-EE:E m7gn :L]] :Lf : :< :; : : := :< : E' : E' ) (& :(: &o d-EE:E m7gn := :; : := :< :; : : : : -dd: b!#8 - l :( m+n !% 4 0<!1%9!"# " # 4200 0 0 58"%1!2" 25 %244 %12 %8 "1 P!"; 42 ; = C Y C *h /!2; /) E C &+ : :E E - mhn b!#8 Q := :L]] :Lf : ) (& :(: &o d-EE:E m7gn :1 :< :; : E' ) (& :(: &o d-EE:E m7gn Q := :L]] :Lf : : E' !% 4 0<!1%9!"# " # 4200 0 0 0!012 58"%1!2" 25 # 1 P!"; 42 ; = C Y + /!2; /) E : :< : :; : : : : gl( b!#8 : 1 * -( : $: + l : m !% 4 0<!1%9!"# " # 4200 0 0 18 58"%1!2" 25 M8"%1!2" 1 7 = C Y P!"; 42 ; C *h /!2; /) E Q ; < n -dd: b!#8 + 10a < . - : 1 : = -d +&: m n !% 4 0<!1%9!"# " # 4200 0 0 241 # 58"%1!2" 25 %244 %12 7!11 P!"; 42 ; C Y C *h /!2; /) E Q + IGW25N120H3 High speed switching series third generation 16 240V 960V 1000 12 C, CAPACITANCE [pF] V•Š, GATE-EMITTER VOLTAGE [V] 14 10 8 6 CÍÙÙ CÓÙÙ CØÙÙ 100 4 2 0 0 20 40 60 80 100 10 120 0 Q•Š, GATE CHARGE [nC] Figure 17. Typical gate charge (I†=25A) 30 50 160 t»†, SHORT CIRCUIT WITHSTAND TIME [µs] I†ñ»†ò, SHORT CIRCUIT COLLECTOR CURRENT [A] 20 Figure 18. Typical capacitance as a function of collector-emitter voltage (V•Š=0V, f=1MHz) 180 140 120 100 80 60 40 20 10 V†Š, COLLECTOR-EMITTER VOLTAGE [V] 10 12 14 16 40 30 20 10 0 18 V•Š, GATE-EMITTER VOLTAGE [V] 10 12 14 16 18 20 V•Š, GATE-EMITTER VOLTAGE [V] Figure 19. Typical short circuit collector current as a function of gate-emitter voltage (V†Šù600V, start atTÎ=25°C) Figure 20. Short circuit withstand time as a function of gate-emitter voltage (V†Šù600V, start at TÎù150°C) 11 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation ZÚÌœ†, TRANSIENT THERMAL IMPEDANCE [K/W] 1 D=0.5 0.2 0.1 0.1 0.05 0.02 0.01 single pulse 0.01 i: 1 2 3 4 5 rÍ[K/W]: 0.08133 0.09366 0.22305 0.05925 5.7E-3 2.6E-4 1.7E-3 0.01009673 0.0336145 0.2730749 τ Í[s]: 0.001 1E-6 1E-5 1E-4 0.001 0.01 0.1 1 tÔ, PULSE WIDTH [s] Figure 21. IGBT transient thermal impedance (D=tÔ/T) 12 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation PG-TO247-3 13 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation τ 14 Rev. 1.1, 2011-01-25 IGW25N120H3 High speed switching series third generation Revision History IGW25N120H3 Revision: 2011-01-25, Rev. 1.1 Previous Revision Revision Date Subjects (major changes since last revision) 1.1 - Preliminary data sheet We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all ? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Published by Infineon Technologies AG 81726 Munich, Germany 81726 München, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 15 Rev. 1.1, 2011-01-25