INTERSIL ISL7119RHQF

ISL7119RH
®
Data Sheet
October 8, 2008
Radiation Hardened High Speed Dual
Voltage Comparator
FN6607.2
Features
• Electrically Screened to DSCC SMD # 5962-07215
The ISL7119RH is a radiation hardened high speed dual
voltage comparator fabricated on a single monolithic chip. It
is designed to operate over a wide dual supply voltage range
as well as a single 5V logic supply and ground. The open
collector output stage facilitates interfacing with a variety of
logic devices and has the ability to drive relays and lamps at
output currents up to 25mA.
The ISL7119RH is fabricated on our dielectrically isolated
Rad-hard Silicon Gate (RSG) process, which provides
immunity to Single Event Latch-up (SEL) and highly reliable
performance in the natural space environment.
• QML Qualified Per MIL-PRF-38535 Requirements
• Radiation Environment
- Total Dose. . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si)
- SEL/SEB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Immune
• Input Offset Voltage (VIO). . . . . . . . . . . . . . . . . 8mV (Max)
• Input Bias Current (IBIAS) . . . . . . . . . . . . . .1000nA (Max)
• Input Offset Current (IIO) . . . . . . . . . . . . . . . .150nA (Max)
• Saturation Voltage @ ISINK = 3.2mA (VSAT) . 0.65V (Max)
• Saturation Voltage @ ISINK = 25mA (VSAT) . . 1.8V (Max)
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
• Response Time (tPD) . . . . . . . . . . . . . . . . . . . 160ns (Max)
Detailed Electrical Specifications for the ISL7119RH are
contained in SMD 5962-07215. A “hot-link” is provided
on our website for downloading.
• Window Detector
Applications
• Level Shifter
• Relay Driver
Pinouts
• Lamp Driver
ISL7119RH
(10 LD FLATPACK GDFP1-F10 OR CDFP2-F10)
TOP VIEW
s
OUT 1
1
10
+VS
GND 1
2
9
-IN 2
+IN 1
3
8
+IN 2
-IN 1
4
7
GND 2
-VS
5
6
OUT 2
Ordering Information
ORDERING
NUMBER
INTERNAL
MKT. NUMBER
PART MARKING
TEMP. RANGE
(°C)
PACKAGE
PKG. DWG. #
5962F0721501QXC ISL7119RHQF
Q 5962F07 21501QXC
-55 to +125
10 Ld Flatpack
K10.A
5962F0721501VXC
ISL7119RHVF
Q 5962F07 21501VXC
-55 to +125
10 Ld Flatpack
K10.A
5962F0721501V9A
ISL7119RHVX
-55 to +125
10 Ld Flatpack
K10.A
ISL7119RH/Proto
ISL7119RHF/Proto
-55 to +125
10 Ld Flatpack
K10.A
1
ISL7 119RHF /Proto
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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ISL7119RH
Die Characteristics
DIE DIMENSIONS:
Backside Finish:
2030µm x 2030µm (~80 mils x 80 mils)
Thickness: 483µm ± 25.4µm (19 mils ± 1 mil)
INTERFACE MATERIALS:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Glassivation:
Unbiased (DI)
Type: PSG (Phosphorous Silicon Glass)
Thickness: 8.0kÅ ± 1.0kÅ
ADDITIONAL INFORMATION:
Worst Case Current Density:
Top Metallization:
<2.0 x 105 A/cm2
Type: AlSiCu
Thickness: 16.0kÅ ± 2kÅ
Transistor Count:
66
Substrate:
Radiation Hardened Silicon Gate, Dielectric Isolation
Metallization Mask Layout
ISL7119RH
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reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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2
FN6607.2
October 8, 2008