IXD_602 2-Ampere Dual Low-Side Ultrafast MOSFET Drivers Features Description • 2A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V • Matched Rise and Fall Times • Low Propagation Delay Time • Low 10μA Supply Current • Low Output Impedance The IXDF602/IXDI602/IXDN602 dual high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each of the two outputs can source and sink 2A of peak current while producing voltage rise and fall times of less than 10ns. The input of each driver is CMOS compatible, and is virtually immune to latch up. Proprietary circuitry eliminates cross conduction and current “shoot-through.” Low propagation delay and fast, matched rise and fall times make the IXD_602 family ideal for high-frequency and high-power applications. Applications • • • • • • Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver Pb e3 RoHS 2002/95/EC The IXDN602 is configured as a dual non-inverting driver, the IXDI602 is configured as a dual inverting driver, and the IXDF602 has one inverting and one non-inverting driver. The IXD_602 family is available in a standard 8-pin DIP (PI), an 8-pin SOIC (SIA), an 8-pin Power SOIC with an exposed metal back (SI), and an 8-pin DFN (D2) package. Ordering Information Part Number IXDF602D2TR IXDF602PI IXDF602SI IXDF602SITR IXDF602SIA IXDF602SIATR IXDI602D2TR IXDI602PI IXDI602SI IXDI602SITR IXDI602SIA IXDI602SIATR IXDN602D2TR IXDN602PI IXDN602SI IXDN602SITR IXDN602SIA IXDN602SIATR DS-IXD_602 - R02 Logic Configuration INA A OUTA INB B OUTB INA A OUTA INB B OUTB INA A OUTA INB B OUTB Package Type Packing Method Quantity 8-Pin DFN 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DFN 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DFN 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel 2000 50 100 2000 100 2000 2000 50 100 2000 100 2000 2000 50 100 2000 100 2000 www.clare.com 1 IXD_602 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 4 5 2. IXD_602 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDI602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDF602. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDN602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . R02 www.clare.com 10 10 10 10 11 2 IXD_602 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDF602 NC 1 INA 2 GND 3 INB 4 A B Pin Name NC 7 OUTA INA Channel A Logic Input 6 VCC INB Channel B Logic Input 5 OUTB IXDI602 NC 1 INA 2 GND 3 INB 4 A B Description 8 8 NC 7 OUTA 6 VCC 5 OUTB 8 NC 7 OUTA 6 VCC 5 OUTB OUTA OUTA Channel A Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUTB OUTB Channel B Output - Sources or sinks current to turn on or turn off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDN602 NC 1 INA 2 GND 3 INB 4 A B 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Supply Voltage VCC -0.3 40 V Input Voltage VIN -5.0 VCC+0.3 V Output Current IOUT - ±2 A Junction Temperature TJ -55 +150 °C Storage Temperature TSTG -65 +150 °C Unless otherwise specified, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range R02 Symbol Minimum Maximum Units VCC 4.5 35 V TA -40 +125 °C www.clare.com 3 IXD_602 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 0V < VIN < VCC IIN - - ±10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 2.5 4 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - 1.5 3 IDC - - ±1 tr Input Current Units V μA V Ω Rise Time Limited by package power dissipation VCC=18V, CLOAD=1000pF - 7.5 15 Fall Time VCC=18V, CLOAD=1000pF tf - 6.5 15 On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly - 35 60 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly - 38 60 - 1 3 mA - <1 10 - <1 10 μA Output Current, Continuous Power Supply Current VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC ICC A ns 1.6 Electrical Characteristics: TA = - 40°C to +125°C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted). Parameter Conditions Symbol Minimum Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65 0V < VIN < VCC IIN -10 10 Output Voltage, High - VOH VCC-0.025 - Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 6 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - 5 IDC - ±1 tr Input Current Units V μA V Ω Rise Time Limited by package power dissipation VCC=18V, CLOAD=1000pF - 18 Fall Time VCC=18V, CLOAD=1000pF tf - 18 On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly - 75 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly - 75 - 3.5 mA - 150 - 150 μA Output Current, Continuous Power Supply Current 4 VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC www.clare.com ICC A ns R02 IXD_602 1.7 Thermal Characteristics Package Parameter Symbol Rating IXDD602D2 (8-Pin DFN) Units 35 IXD_602PI (8-Pin DIP) 125 θJA Thermal Resistance, Junction-to-Ambient IXD_602SI (8-Pin Power SOIC) °C/W 85 IXD_602SIA (8-Pin SOIC) 120 IXD_602SI (8-Pin Power SOIC) θJC Thermal Resistance, Junction-to-Case 10 °C/W 2 IXD_602 Performance 2.1 Timing Diagrams VIH INx VIH INx VIL tondly VIL toffdly toffdly tondly 90% OUTx OUTx 10% 90% 10% tf tr tr tf Non-Inverting Driver Waveforms Inverting Driver Waveforms 2.2 Characteristics Test Diagram VCC + 0.1μF 10μF VCC - INA OUTA INB OUTB CLOAD GND Tektronix Current Probe 6302 VIN CLOAD R02 www.clare.com Tektronix Current Probe 6302 5 IXD_602 3 Block Diagrams & Truth Tables 3.1 IXDI602 3.3 IXDN602 VCC VCC OUTA INA OUTA INA GND GND VCC VCC OUTB INB OUTB INB INX OUTX INX OUTX 0 1 0 0 1 0 1 1 3.2 IXDF602 VCC OUTA INA GND VCC OUTB INB 6 INA OUTA 0 1 1 0 INB OUTB 0 0 1 1 www.clare.com R02 IXD_602 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) 120 Fall Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25ºC) 120 12 Rise & Fall Time vs. Temperature (VIN=0-5V, VCC=18V, CL=1nF) 11 100 Fall Time (ns) 80 CL=4.7nF CL=1nF CL=470pF 60 40 10 80 CL=4.7nF CL=1nF CL=470pF 60 40 20 5 10 15 20 25 30 Supply Voltage (V) 35 40 5 10 15 20 25 30 Supply Voltage (V) VCC=4.5V VCC=8V VCC=12V 80 VCC=18V VCC=25V 60 VCC=30V VCC=35V 40 0 Rise Time (ns) Fall Time (ns) 1000 2000 3000 4000 0 1000 2000 3000 4000 Load Capacitance (pF) 100 toffdly tondly 0 60 50 toffdly 40 30 tondly 40 0 5 10 15 Input Voltage (V) Input Threshold vs. Temperature (VCC=18V, CL=1nF) Propagation Delay vs. Temperature (VCC=18V, CL=1nF) toffdly 50 45 tondly 40 35 30 25 2.6 Min VIH 2.4 2.2 Max VIL 2.0 20 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 140 Input Threshold vs. Supply Voltage 3.5 Input Threshold (V) Input Threshold (V) 35 5000 20 20 15 20 25 30 Supply Voltage (V) 55 Propagation Delay (ns) 150 2.8 100 120 140 0 5000 Propagation Delay vs. Input Voltage (VCC=18V, CL=1nF) 70 Propagation Delay (ns) Propagation Delay (ns) Propagation Delay vs. Supply Voltage (VIN=0-5V, CL=1nF, f=1kHz) 10 20 40 60 80 Temperature (ºC) VCC=4.5V VCC=8V 100 VCC=12V 80 VCC=18V VCC=25V 60 VCC=30V VCC=35V 40 Load Capacitance (pF) 5 0 20 20 0 -40 -20 40 120 100 3.0 2.5 Min VIH 2.0 Max VIL 1.5 1.0 1.8 -40 -20 R02 35 Fall Time vs. Load Capacitance Rise Time vs. Load Capacitance 50 tf 7 4 0 120 0 8 5 0 0 tr 9 6 20 0 200 Time (ns) Rise Time (ns) 100 0 20 40 60 80 Temperature (ºC) 100 120 140 0 www.clare.com 5 10 15 20 25 30 Supply Voltage (V) 35 40 7 IXD_602 50 0 100 Supply Current (mA) 350 300 250 200 150 250 200 150 100 50 0 100 10000 Supply Current vs. Load Capacitance Both Outputs Active (VCC=35V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 100 1000 Load Capacitance (pF) 200 Supply Current vs. Load Capacitance Both Outputs Active (VCC=18V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 150 100 50 0 100 10000 Supply Current vs. Frequency Both Outputs Active (VCC=8V) 1000 10 1 0.1 100 1000 Load Capacitance (pF) 10000 Supply Current vs. Frequency Both Outputs Active (VCC=12V) 1000 CL=4.7nF CL=1nF 100 CL=470pF Supply Current (mA) 400 1000 Load Capacitance (pF) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Supply Current (mA) 100 300 Supply Current vs. Load Capacitance Both Outputs Active (VCC=12V) Supply Current (mA) 150 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Supply Current (mA) Supply Current (mA) 200 Supply Current vs. Load Capacitance Both Outputs Active (VCC=8V) CL=4.7nF CL=1nF CL=470pF 10 1 0.1 50 1 0.1 1000 0.1 10000 1 10 1 0.1 10 100 Frequency (kHz) 1000 10000 Quiescent Supply Current vs. Temperature (VCC=18V) 3.0 CL=4.7nF CL=1nF 100 CL=470pF VIN=3.5V 2.5 2.0 VIN=5V 1.5 VIN=10V 1.0 0.5 VIN=0V & 18V 0.0 0.01 1 10 100 Frequency (kHz) 1000 10000 0.1 Dynamic Supply Current vs. Temperature (VIN=0-5V, VCC=18V, CL=1nF, f=1kHz) 1.0 0.9 0.8 0.7 10 100 Frequency (kHz) 1000 7 -6 6 -5 -4 -3 -2 0 20 40 60 80 Temperature (ºC) 100 120 140 20 40 60 80 Temperature (ºC) 100 120 140 5 4 3 2 1 0 0 -40 -20 0 Output Sink Current vs. Supply Voltage (CL=27nF) 8 -7 -1 0.6 -40 -20 10000 Output Source Current vs. Supply Voltage (CL=27nF) -8 Source Current (A) 1.1 1 Sink Current (A) 0.1 Supply Current (mA) 10 100 Frequency (kHz) Supply Current (mA) 10 1 Supply Current vs. Frequency Both Outputs Active (VCC=35V) 1000 CL=4.7nF CL=1nF 100 CL=470pF 0.01 8 0.1 10000 Supply Current (mA) Supply Current (mA) 1000 Load Capacitance (pF) Supply Current vs. Frequency Both Outputs Active (VCC=18V) 1000 1.2 0.01 0.01 0 100 0 5 10 15 20 25 30 Supply Voltage (V) www.clare.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 R02 IXD_602 Output Source Current vs. Temperature (VCC=18V, CL=27nF) 5.0 -4.5 4.5 -4.0 4.0 Sink Current (A) Source Current (A) -5.0 -3.5 -3.0 -2.5 -2.0 3.0 2.5 2.0 1.0 -1.0 -40 -20 0 20 40 60 80 Temperature (ºC) -40 -20 100 120 140 High-State Output Resistance vs. Supply Voltage (IOUT= -10mA) 8 6 4 2 0 20 40 60 80 Temperature (ºC) 100 120 140 Low State Output Resistance vs. Supply Voltage (IOUT= +10mA) 10 Output Resistance (Ω) 10 Output Resistance (Ω) 3.5 1.5 -1.5 8 6 4 2 0 0 0 R02 Output Sink Current vs. Temperature (VCC=18V, CL=27nF) 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 www.clare.com 5 10 15 20 25 30 Supply Voltage (V) 35 40 9 IXD_602 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IXD_602SI / IXD_602SIA / IXD_602PI IXD_602D2 MSL 1 MSL 3 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Pb 10 RoHS 2002/95/EC Device Maximum Temperature x Time IXD_602SI / IXD_602SIA / IXD_602D2 IXD_602PI 260°C for 30 seconds 250°C for 30 seconds e3 www.clare.com R02 IXD_602 5.4 Mechanical Dimensions 5.4.1 SIA (8-Pin SOIC) 0.10 / 0.25 (0.004 / 0.010) 1.27 (0.050) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 5.40 (0.213) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45º (0.010 / 0.020 x45º) 0.60 (0.024) 0º / 8º 4.80 / 5.00 (0.190 / 0.197) 0.10 / 0.25 (0.004 / 0.010) Recommended PCB Land Pattern Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.30 / 1.75 (0.051 / 0.069) NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation AA. 5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back) 3.80 (0.150) 0.10 / 0.25 (0.004 / 0.010) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 5.40 2.75 (0.209) (0.108) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45º (0.010 / 0.020 x45º) 1.27 (0.050) 0º / 8º 4.80 / 5.00 (0.190 / 0.197) Recommended PCB Land Pattern 0.03 / 0.10 (0.001 / 0.004) 1.30 / 1.75 (0.051 / 0.069) 2.29 / 2.79 (0.090 / 0.110) 0.60 (0.024) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) NOTES: 1. Molded package conforms to JEDEC standard configuration MS-012 variation BA. 2. The exposed metal pad on the back of the SI package may be left floating or connected to GND. It is not suitable for carrying current. 3.30 / 3.81 (0.130 / 0.150) R02 www.clare.com 11 IXD_602 5.4.3 Tape & Reel Information for SI and SIA Packages 330.2 DIA. (13.00 DIA.) 0.30 ± 0.05 B R0.50 TYP ∅1.55 ± 0.05 4.00 ± 0.10 See Note #2 2.00 ± 0.10 1.75 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 5.50 ± 0.10 (3.40) B0=5.20 ± 0.10 A Embossed Carrier 1.80 ± 0.10 K0=2.30 ± 0.10 SECTION B-B Embossment 12.00 ± 0.30 A B A0=6.40 ± 0.10 ∅1.50 (MIN) 8.00 ± 0.10 (4.70) (1.20) (70º) SECTION A-A NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ± 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. 5.4.4 PI (8-Pin DIP) 9.02 / 10.16 (0.355 / 0.400) 0.20 / 0.38 (0.008 / 0.015) 6.10 / 6.86 (0.240 / 0.270) 7.62 BSC (0.300 BSC) 2.540 BSC (0.100 BSC) 0.38 / 1.02 (0.015 / 0.040) 7.37 / 8.26 (0.290 / 0.325) 3.05 / 3.81 (0.120 / 0.150) 7.62 / 10.92 (0.300 / 0.430) 8-0.900 DIA. (8-0.035 DIA.) 2.540 (0.100) 7.50 (0.295) 1.40 (0.055) PC Board Pattern 3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023) 12 3.18 / 3.81 (0.125 / 0.150) NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA. www.clare.com R02 IXD_602 5.4.5 D2 (8-Pin DFN) 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.158 BSC) 0.35 x 45º (0.014 x 45º) 0.95 (0.037) 4.50 (0.177) 3.05 (0.120) 0.45 (0.018) 0.00 / 0.05 (0.000 / 0.002) 2.55 (0.100) 1.20 (0.047) 0.76 / 0.81 (0.030 / 0.032) Recommended PCB Land Pattern 3.04 / 3.09 (0.120 / 0.122) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 Pin 8 2.54 / 2.59 (0.100 / 0.102) 0.35 / 0.45 x 45º (0.014 / 0.018 x 45º) NOTE: The exposed metal pad on the back of the D2 package may be left floating or connected to ground. It is not suitable for carrying current. 5.4.6 Tape & Reel Information for D2 Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) ∅1.55 ± 0.05 4.00 ± 0.10 See Note #2 2.00 ± 0.05 R0.75 TYP 1.75 ± 0.10 (0.05) 5º MAX 5.50 ± 0.05 (0.05) B0=5.40 ± 0.10 12.00 ± 0.30 Embossed Carrier K0=1.90 ± 0.10 ∅1.50 (MIN) 8.00 ± 0.10 5º MAX A0=4.25 ± 0.10 Embossment 0.30 ± 0.05 NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ± 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_602-R02 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 2/3/2011 R02 www.clare.com 13