SAMSUNG K4D263238A-GC33

128M DDR SDRAM
K4D263238A-GC
128Mbit DDR SDRAM
1M x 32Bit x 4 Banks
Double Data Rate Synchronous DRAM
with Bi-directional Data Strobe and DLL
(144-Ball FBGA)
Revision 2.0
January 2003
Samsung Electronics reserves the right to change products or specification without notice.
- 1 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
Revision History
Revision 2.0 (January 16, 2002)
• Changed package ball height from 0.25mm to 0.35mm
• Typo corrected
Revision 1.9 (July 18, 2002)
• Changed power dissipation from 2.0W to 2.3W
Revision 1.8 (June 12, 2002)
• Supported both CL4 and CL3 for the K4D263238A-GC45 and the effective date of this change starts from WW23
Revision 1.6 (January 30, 2002)
• Changed tCK(max) of K4D263238A-GC40 from 7ns to 10ns.
• Changed tCK(max) of K4D263238A-GC33/36 from 5ns to 4ns. For all the CL5 operation, guaranteed tCK(max) is 4ns.
Revision 1.5 (December 14, 2001)
• Removed K4D26323RA-GC2A/33/36(VDD/VDDQ=2.8V) & K4D263238A-GC55/60 from the spec.
• Added K4D263238A-GC36(VDD/VDDQ=2.5V)
Revision 1.4 (November 14, 2001)
• Added K4D26323RA-GC36(VDD/VDDQ=2.8V)
Revision 1.3 (October 22, 2001)
• Corrected part number of K4D263238A-GC2A to K4D26323RA-GC2A
• Changed tCDLR of -GC2A and GC33 from 3tCK to 2tCK and applied since Sept 15, 2001.
• Defined x32 DDR for mobile PC graphics separately - K4D26323AA-GL** featured with VDDQ=1.8V,ICC6=1mA with
reduced operating current. Refer to the K4D26323AA-GL** spec for more detail information.
Revision 1.2 (September 13, 2001)
• Define DC spec value of K4D26323RA-GC33 and K4D263238A-GC2A
• Changed tCK(max) of -2A and -33 from 7ns to 5ns
Revision 1.1 (September 3, 2001)
• Added K4D26323RA-GC33(VDD/VDDQ=2.8V)
• Added K4D263238A-GC2A(350MHz)
Revision 1.0 (August 16, 2001)
• Changed tCDLR of K4D263238A-GC33 from 2tCK to 3tCK
• Removed VDDQ=1.8V from the spec.
• Added K4D263238A-GL as a low power part
• Defined DC spec.
Revision 0.1 (August 2, 2001) - Target Spec
• Changed tCK(max) of K4D263238A-GC45/-50/-55/-60 from 7ns to 10ns.
Revision 0.0 (June, 2001) - Target Spec
• Defined Target Specification
- 2 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
1M x 32Bit x 4 Banks Double Data Rate Synchronous DRAM
with Bi-directional Data Strobe and DLL
FEATURES
• 2.5V + 5% power supply for device operation
• 4 DQS’s ( 1DQS / Byte )
• 2.5V + 5% power supply for I/O interface
• Data I/O transactions on both edges of Data strobe
• SSTL_2 compatible inputs/outputs
• DLL aligns DQ and DQS transitions with Clock transition
• 4 banks operation
• Edge aligned data & data strobe output
• MRS cycle with address key programs
• Center aligned data & data strobe input
-. Read latency 3,4,5 (clock)
• DM for write masking only
-. Burst length (2, 4, 8 and Full page)
• Auto & Self refresh
-. Burst type (sequential & interleave)
• 32ms refresh period (4K cycle)
• Full page burst length for sequential burst type only
• 144-Ball FBGA
• Start address of the full page burst should be even
• Maximum clock frequency up to 300MHz
• All inputs except data & DM are sampled at the positive
• Maximum data rate up to 600Mbps/pin
going edge of the system clock
• Differential clock input
• No Wrtie-Interrupted by Read Function
ORDERING INFORMATION
Part NO.
Max Freq.
Max Data Rate
K4D263238A-GC33
300MHz
600Mbps/pin
K4D263238A-GC36
275MHz
550Mbps/pin
K4D263238A-GC40
250MHz
500Mbps/pin
K4D263238A-GC45
222MHz
444Mbps/pin
K4D263238A-GC50
200MHz
400Mbps/pin
Interface
Package
SSTL_2
(VDD/VDDQ=2.5V)
144-Ball FBGA
GENERAL DESCRIPTION
FOR 1M x 32Bit x 4 Bank DDR SDRAM
The K4D263238A is 134,217,728 bits of hyper synchronous data rate Dynamic RAM organized as 4 x1,048,576 words by
32 bits, fabricated with SAMSUNG’s high performance CMOS technology. Synchronous features with Data Strobe allow
extremely high performance up to 2.4GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of
operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety
of high performance memory system applications.
- 3 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
PIN CONFIGURATION (Top View)
2
3
4
5
6
7
8
9
10
11
12
13
B
DQS0
DM0
VSSQ
DQ3
DQ2
DQ0
DQ31
DQ29
DQ28
VSSQ
DM3
DQS3
C
DQ4
VDDQ
NC
VDDQ
DQ1
VDDQ
VDDQ
DQ30
VDDQ
NC
VDDQ
DQ27
D
DQ6
DQ5
VSSQ
VSSQ
VSSQ
VDD
VDD
VSSQ
VSSQ
VSSQ
DQ26
DQ25
E
DQ7
VDDQ
VDD
VSS
VSSQ
VSS
VSS
VSSQ
VSS
VDD
VDDQ
DQ24
F
DQ17
DQ16
VDDQ
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
VDDQ
DQ15
DQ14
G
DQ19
DQ18
VDDQ
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
VDDQ
DQ13
DQ12
H
DQS2
DM2
NC
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
NC
DM1
DQS1
J
DQ21
DQ20
VDDQ
VSSQ
VSS
VSS
Thermal Thermal
VSS
VSS
Thermal Thermal
VSSQ
VDDQ
DQ11
DQ10
K
DQ22
DQ23
VDDQ
VSSQ
VSS
VSS
VSS
VSS
VSSQ
VDDQ
DQ9
DQ8
L
CAS
WE
VDD
VSS
A10
VDD
VDD
RFU1
VSS
VDD
NC
NC
M
RAS
NC
NC
BA1
A2
A11
A9
A5
RFU2
CK
CK
MCL
N
CS
NC
BA0
A0
A1
A3
A4
A6
A7
A8/AP
CKE
VREF
NOTE:
1. RFU1 is reserved for A12
2. RFU2 is reserved for BA2
3. VSS Thermal balls are optional
PIN DESCRIPTION
CK,CK
Differential Clock Input
BA0, BA1
Bank Select Address
CKE
Clock Enable
A0 ~A11
Address Input
CS
Chip Select
DQ0 ~ DQ31
Data Input/Output
RAS
Row Address Strobe
VDD
Power
CAS
Column Address Strobe
VSS
Ground
WE
Write Enable
VDDQ
Power for DQ’s
DQS
Data Strobe
VSSQ
Ground for DQ’s
DM
Data Mask
NC
No Connection
RFU
Reserved for Future Use
MCL
Must Connect Low
- 4 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
INPUT/OUTPUT FUNCTIONAL DESCRIPTION
Symbol
Type
Function
CK, CK*1
Input
The differential system clock Input.
All of the inputs are sampled on the rising edge of the clock except
DQ’s and DM’s that are sampled on both edges of the DQS.
CKE
Input
Activates the CK signal when high and deactivates the CK signal
when low. By deactivating the clock, CKE low indicates the Power
down mode or Self refresh mode.
CS
Input
CS enables the command decoder when low and disabled the command decoder when high. When the command decoder is disabled,
new commands are ignored but previous operations continue.
RAS
Input
Latches row addresses on the positive going edge of the CK with
RAS low. Enables row access & precharge.
CAS
Input
Latches column addresses on the positive going edge of the CK with
CAS low. Enables column access.
WE
Input
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
Input/Output
Data input and output are synchronized with both edge of DQS.
DQS0 for DQ0 ~ DQ7, DQS1 for DQ8 ~ DQ15, DQS2 for DQ16 ~ DQ23,
DQS3 for DQ24 ~ DQ31.
DM0 ~ DM3
Input
Data In mask. Data In is masked by DM Latency=0 when DM is high
in burst write. DM0 for DQ0 ~ DQ7, DM1 for DQ8 ~ DQ15, DM2 for
DQ16 ~ DQ23, DM3 for DQ24 ~ DQ31.
DQ0 ~ DQ31
Input/Output
Data inputs/Outputs are multiplexed on the same pins.
BA0, BA1
Input
Selects which bank is to be active.
A0 ~ A11
Input
Row/Column addresses are multiplexed on the same pins.
Row addresses : RA0 ~ RA11, Column addresses : CA0 ~ CA7.
Column address CA8 is used for auto precharge.
VDD/VSS
Power Supply
Power and ground for the input buffers and core logic.
VDDQ/VSSQ
Power Supply
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
VREF
Power Supply
Reference voltage for inputs, used for SSTL interface.
No connection/
Reserved for future use
This pin is recommended to be left "No connection" on the device
Must Connect Low
Must connect low
DQS0 ~ DQS3
NC/RFU
MCL
*1 : The timing reference point for the differential clocking is the cross point of CK and CK.
For any applications using the single ended clocking, apply VREF to CK pin.
- 5 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
BLOCK DIAGRAM (1Mbit x 32I/O x 4 Bank)
32
Intput Buffer
I/O Control
CK, CK
Data Input Register
Serial to parallel
Bank Select
LWE
LDMi
64
1Mx32
32
Output Buffer
1Mx32
64
2-bit prefetch
Sense AMP
Row Decoder
Refresh Counter
Row Buffer
ADDR
Address Register
CK,CK
1Mx32
x32
DQi
1Mx32
Column Decoder
Col. Buffer
LCBR
LRAS
Latency & Burst Length
LRAS LCBR
Strobe
Gen.
Programming Register
LCKE
Data Strobe
(DQS0~DQS3)
DLL
LWE
LCAS
LWCBR
CK,CK
LDMi
Timing Register
CK,CK
CKE
CS
RAS
CAS
WE
- 6 -
DMi
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
FUNCTIONAL DESCRIPTION
• Power-Up Sequence
DDR SDRAMs must be powered up and initialized in a predefined manner to prevent undefined operations.
1. Apply power and keep CKE at low state (All other inputs may be undefined)
- Apply VDD before VDDQ .
- Apply VDDQ before VREF & VTT
2. Start clock and maintain stable condition for minimum 200us.
3. The minimum of 200us after stable power and clock(CK,CK ), apply NOP and take CKE to be high .
4. Issue precharge command for all banks of the device.
5. Issue a EMRS command to enable DLL
*1
6. Issue a MRS command to reset DLL. The additional 200 clock cycles are required to lock the DLL.
*1,2 7. Issue precharge command for all banks of the device.
8. Issue at least 2 or more auto-refresh commands.
9. Issue a mode register set command with A8 to low to initialize the mode register.
*1 The additional 200cycles of clock input is required to lock the DLL after enabling DLL.
*2 Sequence of 6&7 is regardless of the order.
Power up & Initialization Sequence
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
~
precharge
ALL Banks
EMRS
MRS
DLL Reset
1st Auto
Refresh
precharge
ALL Banks
~
tRP
tRFC
tRFC
200 Clock min.
Inputs must be
stable for 200us
2nd Auto
Refresh
~ ~
~
2 Clock min.
2 Clock min.
Mode
Register Set
Any
Command
~
~
2 Clock min.
~
~ ~
tRP
Command
~
~
CK,CK
* When the operating frequency is changed, DLL reset should be required again.
After DLL reset again, the minimum 200 cycles of clock input is needed to lock the DLL.
- 7 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
MODE REGISTER SET(MRS)
The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency,
addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for
variety of different applications. The default value of the mode register is not defined, therefore the mode register must be
written after EMRS setting for proper operation. The mode register is written by asserting low on CS, RAS, CAS and
WE(The DDR SDRAM should be in active mode with CKE already high prior to writing into the mode register). The state of
address pins A0 ~ A11 and BA0, BA1 in the same cycle as CS, RAS, CAS and WE going low is written in the mode register.
Minimum two clock cycles are requested to complete the write operation in the mode register. The mode register contents
can be changed using the same command and clock cycle requirements during operation as long as all banks are in the
idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0 ~ A2,
addressing mode uses A3, CAS latency(read latency from column address) uses A4 ~ A6. A7 is used for test mode. A8 is
used for DLL reset. A7,A8, BA0 and BA1 must be set to low for normal MRS operation. Refer to the table for specific codes
for various burst length, addressing modes and CAS latencies.
BA1
BA0
RFU
0
A11
A10
A9
RFU
DLL
A8
A8
A7
DLL
TM
A6
A5
A3
CAS Latency
A2
BT
A1
A0
Burst Length
Address Bus
Mode Register
Burst Type
Test Mode
DLL Reset
A4
A7
mode
A3
Type
0
No
0
Normal
0
Sequential
1
Yes
1
Test
1
Interleave
0
Burst Length
CAS Latency
BA0
A1
A0
Sequential
Interleave
Reserved
0
0
0
Reserve
Reserve
Reserved
0
0
1
2
2
1
0
4
4
A6
A5
A4
Latency
0
MRS
0
0
0
1
EMRS
0
0
1
* RFU(Reserved for future use)
should stay "0" during MRS
cycle.
Burst Type
A2
An ~ A0
0
1
0
Reserved
0
0
1
1
3
0
1
1
8
8
1
0
0
4
1
0
0
Reserve
Reserve
1
0
1
5
1
0
1
Reserve
Reserve
1
1
0
Reserved
1
1
0
Reserve
Reserve
Reserved
1
1
1
Full page
Reserve
1
1
1
MRS Cycle
0
1
2
3
4
5
6
7
8
CK, CK
Command
NOP
Precharge
All Banks
NOP
NOP
MRS
NOP
Any
Command
NOP
NOP
tMRD=2 tCK
tRP
*1 : MRS can be issued only at all banks precharge state.
*2 : Minimum tRP is required to issue MRS command.
- 8 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
EXTENDED MODE REGISTER SET(EMRS)
The extended mode register stores the data for enabling or disabling DLL and selecting output driver
strength. The default value of the extended mode register is not defined, therefore the extened mode register
must be written after power up for enabling or disabling DLL. The extended mode register is written by asserting low on CS, RAS, CAS, WE and high on BA0(The DDR SDRAM should be in all bank precharge with CKE
already high prior to writing into the extended mode register). The state of address pins A0, A2 ~ A5, A7 ~ A11
and BA1 in the same cycle as CS, RAS, CAS and WE going low are written in the extended mode register. A1
and A6 are used for setting driver strength to normal, weak or matched impedance. Two clock cycles are
required to complete the write operation in the extended mode register. The mode register contents can be
changed using the same command and clock cycle requirements during operation as long as all banks are in
the idle state. A0 is used for DLL enable or disable. "High" on BA0 is used for EMRS. All the other address
pins except A0,A1,A6 and BA0 must be set to low for proper EMRS operation. Refer to the table for specific
codes.
BA1
BA0
RFU
1
BA0
A11
A10
A9
A8
A7
RFU
A6
A5
D.I.C
An ~ A0
A6
A1
0
MRS
0
0
1
EMRS
A4
A3
A2
RFU
Output Driver Impedence Control
N/A
A1
A0
D.I.C
DLL
A0
Address Bus
Extended
Mode Register
DLL Enable
Do not use
0
Enable
1
Disable
0
1
Weak
60%
1
0
N/A
Do not use
1
1
N/A
Do not use
*1 : RFU(Reserved for future use) should stay "0" during EMRS cycle.
Figure 7. Extended Mode Register set
- 9 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD supply relative to Vss
VDD
-1.0 ~ 3.6
V
Voltage on VDD supply relative to Vss
VDDQ
-0.5 ~ 3.6
V
Storage temperature
TSTG
-55 ~ +150
°C
Power dissipation
PD
2.3
W
Short circuit current
IOS
50
mA
Voltage on any pin relative to Vss
Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
POWER & DC OPERATING CONDITIONS(SSTL_2 In/Out)
Recommended operating conditions(Voltage referenced to VSS=0V, TA=0 to 65°C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Device Supply voltage
VDD
2.375
2.50
2.625
V
1,7
Output Supply voltage
VDDQ
2.375
2.50
2.625
V
1,7
Reference voltage
VREF
0.49*VDDQ
-
0.51*VDDQ
V
2
Termination voltage
Vtt
VREF-0.04
VREF
VREF+0.04
V
3
Input logic high voltage
VIH(DC)
VREF+0.15
-
VDDQ+0.30
V
4
Input logic low voltage
VIL(DC)
-0.30
-
VREF-0.15
V
5
Output logic high voltage
VOH
Vtt+0.76
-
-
V
IOH=-15.2mA
Output logic low voltage
VOL
-
-
Vtt-0.76
V
IOL=+15.2mA
Input leakage current
IIL
-5
-
5
uA
6
Output leakage current
IOL
-5
-
5
uA
6
Note : 1. Under all conditions VDDQ must be less than or equal to VDD.
2. VREF is expected to equal 0.50*VDDQ of the transmitting device and to track variations in the DC level of the same. Peak to
peak noise on the VREF may not exceed + 2% of the DC value.
3. Vtt of the transmitting device must track VREF of the receiving device.
4. VIH(max.)= VDDQ +1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate.
5. VIL(mim.)= -1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate.
6. For any pin under test input of 0V < VIN < VDD is acceptable. For all other pins that are not under test VIN=0V.
7. For K4D263238A-GC33/36/40/45/50, VDD/VDDQ=2.5V + 5%
- 10 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
DC CHARACTERISTICS
Recommended operating conditions Unless Otherwise Noted, TA=0 to 65°C)
Version
Parameter
Symbol
Test Condition
Unit Note
-33
-36
-40
-45
-50
Operating Current
(One Bank Active)
ICC1
Burst Lenth=2 tRC ≥ tRC(min)
IOL=0mA, tCC= tCC(min)
430
410
380
370
350
mA
Precharge Standby Current
in Power-down mode
ICC2P
CKE ≤ VIL(max), tCC= tCC(min)
75
70
65
65
65
mA
120
115
110
100
100
mA
120
110
100
100
100
mA
310
280
240
230
230
mA
Precharge Standby Current
ICC2N
in Non Power-down mode
Active Standby Current
power-down mode
ICC3P
Active Standby Current in
in Non Power-down mode
ICC3N
CKE ≥ VIH(min), CS ≥ VIH(min),
tCC= tCC(min)
CKE ≤ VIL(max), tCC= tCC(min)
CKE ≥ VIH(min), CS ≥ VIH(min),
tCC= tCC(min)
Operating Current
( Burst Mode)
ICC4
IOL=0mA ,tCC= tCC(min),
Page Burst, All Banks activated.
740
690
640
610
570
mA
Refresh Current
ICC5
tRC ≥ tRFC(min)
300
290
280
270
260
mA
Self Refresh Current
ICC6
CKE ≤ 0.2V
Operating Current
(4Bank interleaving)
ICC7
4
Burst Length=4 tRC ≥ tRC(min)
IOL=0mA, tCC= tCC(min)
960
900
1
2
mA
830
750
690
mA
Note : 1. Measured with outputs open.
2. Refresh period is 32ms.
AC INPUT OPERATING CONDITIONS
Recommended operating conditions(Voltage referenced to VSS=0V, VDD=2.5V+ 5%, VDDQ=2.5V+ 5%,TA=0 to 65°C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Input High (Logic 1) Voltage; DQ
VIH
VREF+0.35
-
-
V
Input Low (Logic 0) Voltage; DQ
VIL
-
-
VREF-0.35
V
Clock Input Differential Voltage; CK and CK
VID
0.7
-
VDDQ+0.6
V
1
Clock Input Crossing Point Voltage; CK and CK
VIX
0.5*VDDQ-0.2
-
0.5*VDDQ+0.2
V
2
Note : 1. VID is the magnitude of the difference between the input level on CK and the input level on CK
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same
- 11 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
AC OPERATING TEST CONDITIONS (VDD=2.5V±5%, TA= 0 to 65°C)
Parameter
Value
Unit
Input reference voltage for CK(for single ended)
0.50*VDDQ
V
1.5
V
CK and CK signal maximum peak swing
CK signal minimum slew rate
Input Levels(VIH/VIL)
1.0
V/ns
VREF+0.35/VREF-0.35
V
VREF
V
Vtt
V
Input timing measurement reference level
Output timing measurement reference level
Output load condition
Note
See Fig.1
Vtt=0.5*VDDQ
RT=50Ω
Output
Z0=50Ω
VREF
=0.5*VDDQ
CLOAD=30pF
(Fig. 1) Output Load Circuit
CAPACITANCE (VDD=2.5V, TA= 25°C, f=1MHz)
Parameter
Symbol
Min
Max
Unit
Input capacitance( CK, CK )
CIN1
1.0
5.0
pF
Input capacitance(A0~A11, BA0~BA1)
CIN2
1.0
4.0
pF
Input capacitance
( CKE, CS, RAS,CAS, WE )
CIN3
1.0
4.0
pF
Data & DQS input/output capacitance(DQ0~DQ31)
COUT
1.0
6.5
pF
Input capacitance(DM0 ~ DM3)
CIN4
1.0
6.5
pF
DECOUPLING CAPACITANCE GUIDE LINE
Recommended decoupling capacitance added to power line at board.
Symbol
Value
Unit
Decoupling Capacitance between VDD and VSS
Parameter
CDC1
0.1 + 0.01
uF
Decoupling Capacitance between VDDQ and VSSQ
CDC2
0.1 + 0.01
uF
Note : 1. VDD and VDDQ pins are separated each other.
All VDD pins are connected in chip. All VDDQ pins are connected in chip.
2. VSS and VSSQ pins are separated each other
All VSS pins are connected in chip. All VSSQ pins are connected in chip.
- 12 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
AC CHARACTERISTICS
Symbol
Parameter
CL=3
CL=4
CL=5
CK cycle time
tCK
DQ and DM hold time to DQS
tCH
tCL
tDQSCK
tAC
tDQSQ
tRPRE
tRPST
tDQSS
tWPRES
tWPREH
tWPST
tDQSH
tDQSL
tIS
tIH
tDS
tDH
Clock half period
tHP
CK high level width
CK low level width
DQS out access time from CK
Output access time from CK
Data strobe edge to Dout edge
Read preamble
Read postamble
CK to valid DQS-in
DQS-In setup time
DQS-in hold time
DQS write postamble
DQS-In high level width
DQS-In low level width
Address and Control input setup
Address and Control input hold
DQ and DM setup time to DQS
Data output hold time from DQS tQH
-33
-36
Min
3.3
Max
0.45
0.45
-40
Min
3.6
Max
0.55
0.45
0.55
0.45
-0.6
0.6
-0.6
-45
Min
4.0
-
Max
0.55
0.45
0.55
0.45
-0.6
0.6
0.6
-0.6
-
0.35
0.9
1.1
4
-50
Min
4.5
4.5
-
Max
0.55
0.45
0.55
0.45
-0.6
0.6
0.6
-0.6
-
0.40
0.9
1.1
4
Unit
Min
5.0
-
Max
10
ns
ns
ns
0.55
0.45
0.55
tCK
0.55
0.45
0.55
tCK
-0.7
0.7
-0.7
0.7
ns
0.6
-0.7
0.7
-0.7
0.7
ns
-
0.4
-
0.45
-
0.45
ns
0.9
1.1
0.9
1.1
0.9
1.1
tCK
10
10
Note
1
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
0.85
1.15
0.85
1.15
0.85
1.15
0.8
1.2
0.8
1.2
tCK
0
-
0
-
0
-
0
-
0
-
ns
0.35
-
0.35
-
0.35
-
0.3
-
0.3
-
tCK
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
0.9
-
0.9
-
0.9
-
1.0
-
1.0
-
ns
0.9
-
0.9
-
0.9
-
1.0
-
1.0
-
ns
0.35
-
0.40
-
0.4
-
0.45
-
0.45
-
ns
0.35
tCLmin
or
tCHmin
tHP0.35
-
0.40
tCLmin
or
tCHmin
tHP0.4
-
0.4
tCLmin
or
tCHmin
tHP0.4
-
0.45
tCLmin
or
tCHmin
tHP0.45
-
0.45
tCLmin
or
tCHmin
tHP0.45
-
ns
-
ns
1
-
ns
1
-
-
-
-
Simplified Timing @ BL=2, CL=4
tCH
tCL
tCK
0
1
2
3
5
4
6
8
7
CK, CK
tIS
CS
tIH
tDQSCK
tDQSS
DQS
tRPST
tRPRE
tWPRES
tDQSQ
tDQSH
tDQSL
tWPREH
tDS tDH
tAC
DQ
Qa1
Db0
Qa2
Db1
DM
WRITEB
COMMAND READA
- 13 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
Note 1 :
- The JEDEC DDR specification currently defines the output data valid window(tDV) as the time period when the data
strobe and all data associated with that data strobe are coincidentally valid.
- The previously used definition of tDV(=0.35tCK) artificially penalizes system timing budgets by assuming the worst case
output vaild window even then the clock duty cycle applied to the device is better than 45/55%
- A new AC timing term, tQH which stands for data output hold time from DQS is difined to account for clock duty cycle
variation and replaces tDV
- tQHmin = tHP-X where
. tHP=Minimum half clock period for any given cycle and is defined by clock high or clock low time(tCH,tCL)
. X=A frequency dependent timing allowance account for tDQSQmax
tQH Timing (CL4, BL2)
tHP
0
1
3
2
4
5
CK, CK
CS
DQS
tDQSQ(max)
tQH
tDQSQ(max)
Qa0
DQ
COMMAND
Qa1
READA
- 14 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
AC CHARACTERISTICS (I)
Parameter
Symbol
-33
-36
-40
-45
-50
Unit Note
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
17
-
16
-
15
-
13
-
12
-
19
-
18
-
17
-
15
-
14
-
tCK
12
100K
11
100K
10
100K
9
100K
8
100K
tCK
RAS to CAS delay for Read
tRC
tRFC
tRAS
tRCDR
6
-
5
-
5
-
4
-
RAS to CAS delay for Write
tRCDW
4
Row precharge time
tRP
tRRD
5
-
5
-
5
-
4
3
-
3
-
3
-
2
tWR
3
-
3
-
3
-
tWR_A
3
-
3
-
3
tCDLR
tCCD
tMRD
2
-
2
-
1
-
1
-
2
-
2
tDAL
8
-
8
Row cycle time
Refresh row cycle time
Row active time
Row active to Row active
Last data in to Row precharge
@Normal Precharge
Last data in to Row precharge
@Auto Precharge
Last data in to Read command
Col. address to Col. address
Mode register set cycle time
Auto precharge write recovery
+ Precharge
Exit self refresh to read comPower down exit time
Refresh interval time
200
tXSR
1tCK+tIS
tPDEX
7.8
tREF
tCK
4
-
tCK
2
-
tCK
-
4
-
tCK
-
2
-
tCK
3
-
2
-
tCK
1
-
3
-
3
-
tCK
1
2
-
2
-
2
-
tCK
1
1
-
1
-
1
-
tCK
-
2
-
2
-
2
-
tCK
-
8
-
7
-
7
-
tCK
tCK
3
3
2
-
200
-
200
-
200
-
200
-
-
1tCK+tIS
-
1tCK+tIS
-
1tCK+tIS
-
1tCK+tIS
-
ns
-
7.8
-
7.8
-
7.8
-
7.8
-
us
Note : 1. For normal write operation, even numbers of Din are to be written inside DRAM
(Unit : Number of Clock)
AC CHARACTERISTICS (II)
K4D263238A-GC33
Frequency
Cas Latency
300MHz ( 3.3ns )
5
275MHz ( 3.6ns )
5
250MHz ( 4.0ns )
4
222MHz ( 4.5ns )
4
200MHz ( 5.0ns )
3
tRC
17
16
15
13
12
tRFC
19
18
17
15
14
tRAS
12
11
10
9
8
tRCDRD tRCDWR
6
4
5
3
5
3
4
2
4
2
tRP
5
5
5
4
4
tRRD
3
3
3
2
2
tDAL
8
8
8
7
7
Unit
K4D263238A-GC36
Frequency
Cas Latency
275MHz ( 3.6ns )
5
250MHz ( 4.0ns )
4
222MHz ( 4.5ns )
4
200MHz ( 5.0ns )
3
tRC
16
15
13
12
tRFC
18
17
15
14
tRAS
11
10
9
8
tRCDRD tRCDWR
5
3
5
3
4
2
4
2
tRP
5
5
4
4
tRRD
3
3
2
2
tDAL
8
8
7
7
Unit
- 15 -
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
K4D263238A-GC40
Frequency
Cas Latency
250MHz ( 4.0ns )
4
222MHz ( 4.5ns )
4
200MHz ( 5.0ns )
3
tRC
15
13
12
tRFC
17
15
14
tRAS
10
9
8
tRCDRD tRCDWR
5
3
4
2
4
2
tRP
5
4
4
tRRD
3
2
2
tDAL
8
7
7
Unit
K4D263238A-GC45
Frequency
Cas Latency
222MHz ( 4.5ns )
4/3
200MHz ( 5.0ns )
3
tRC
13
12
tRFC
15
14
tRAS
9
8
tRCDRD tRCDWR
4
2
4
2
tRP
4
4
tRRD
2
2
tDAL
7
7
Unit
K4D263238A-GC50
Frequency
Cas Latency
200MHz ( 5.0ns )
3
tRC
12
tRFC
14
tRAS
8
tRCDRD tRCDWR
4
2
tRP
4
tRRD
2
tDAL
7
Unit
tCK
tCK
tCK
tCK
tCK
tCK
Simplified Timing(2) @ BL=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
BAa
BAb
BAa
BAb
Ra
Rb
Ra
Rb
Ca
Cb
17
18
19
20
21
22
CK, CK
BA[1:0] BAa
BAa
BAa
Ra
A8/AP Ra
ADDR
(A0~A7, Ra
A9,A10)
Ca
WE
DQS
DQ
Da0 Da1 Da2 Da3 Db0 Db1 Db2 Db3
Da0 Da1 Da2 Da3
DM
COMMAND
ACTIVEA
PRECH
WRITEA
ACTIVEA
ACTIVEB WRITEA
WRITEB
tRCD
tRAS
tRP
tRC
Normal Write Burst
(@ BL=4)
tRRD
Multi Bank Interleaving Write Burst
(@ BL=4)
- 16 -
Rev. 2.0 (Jan. 2003)
128M DDR SDRAM
K4D263238A-GC
PACKAGE DIMENSIONS (144-Ball FBGA)
A1 INDEX MARK
12.0
12.0
<Top View>
0.8x11=8.8
A1 INDEX MARK
0.10 Max
0.8
B
C
D
E
F
G
H
J
K
L
M
N
0.40
0.8x11=8.8
0.45 ± 0.05
0.8
13 12 11 10 9 8 7 6 5 4 3 2
0.25 ± 0.05
0.40
1.40 Max
<Bottom View>
Unit : mm
- 17 -
Rev. 2.0 (Jan. 2003)