K4S281632C-TI(P) CMOS SDRAM 128Mbit SDRAM 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 June 2001 * Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM Revision History Revision 0.0 (November 18, 2000) • First generation. Revision 0.1 (June 20, 2001) • Final Specification. Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM 2M x 16Bit x 4 Banks Synchronous DRAM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply The K4S281632C is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 2,097,152 words by 16 • LVTTL compatible with multiplexed address bits, fabricated with SAMSUNG′s high performance CMOS technology. Synchronous design allows precise cycle control • Four banks operation • MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) • All inputs are sampled at the positive going edge of the system with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programma- clock. • Burst read single-bit write operation mance memory system applications. • DQM for masking ORDERING INFORMATION • Auto & self refresh ble burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high perfor- • 64ms refresh period (4K cycle) Part No. • Industrial Temperature Operation (- 40 to 85 °C) Max Freq. Interface Package K4S281632C-TI/P75 133MHz(CL=3) K4S281632C-TI/P1H 100MHz(CL=2) K4S281632C-TI/P1L 100MHz(CL=3) LVTTL 54 TSOP(II) FUNCTIONAL BLOCK DIAGRAM I/O Control Data Input Register LWE LDQM Bank Select Output Buffer Sense AMP Row Decoder ADD Row Buffer Refresh Counter 2M x 16 2M x 16 2M x 16 DQi Column Decoder Col. Buffer LCBR LRAS Address Register CLK 2M x 16 Latency & Burst Length LCKE Programming Register LRAS LCBR LWE LCAS LWCBR LDQM Timing Register CLK CKE CS RAS CAS WE LDQM UDQM * Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM PIN CONFIGURATION (Top view) V DD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 V DD LDQM WE CAS RAS CS BA0 BA1 A10/AP A0 A1 A2 A3 V DD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 V SS DQ15 V SSQ DQ14 DQ13 V DDQ DQ12 DQ11 V SSQ DQ10 DQ9 V DDQ DQ8 V SS N.C/RFU UDQM CLK CKE N.C A11 A9 A8 A7 A6 A5 A4 V SS 54Pin TSOP (II) (400mil x 875mil) (0.8 mm Pin pitch) PIN FUNCTION DESCRIPTION Pin Name Input Function CLK System clock Active on the positive going edge to sample all inputs. CS Chip select Disables or enables device operation by masking or enabling all inputs except CLK, CKE and DQM CKE Clock enable Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby. A 0 ~ A11 Address Row/column addresses are multiplexed on the same pins. Row address : RA 0 ~ RA 11, Column address : CA0 ~ CA 8 BA 0 ~ BA1 Bank select address Selects bank to be activated during row address latch time. Selects bank for read/write during column address latch time. RAS Row address strobe Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge. CAS Column address strobe Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access. WE Write enable Enables write operation and row precharge. Latches data in starting from CAS, WE active. L(U)DQM Data input/output mask Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when L(U)DQM active. DQ0 ~ 15 Data input/output Data inputs/outputs are multiplexed on the same pins. V D D/V SS Power supply/ground Power and ground for the input buffers and the core logic. V DDQ /V SSQ Data output power/ground Isolated power supply and ground for the output buffers to provide improved noise immunity. N.C/RFU No connection /reserved for future use This pin is recommended to be left No Connection on the device. Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage on any pin relative to Vss VI N, V OUT -1.0 ~ 4.6 V Voltage on VDD supply relative to Vss V DD , VDDQ -1.0 ~ 4.6 V TS T G -55 ~ +150 °C Power dissipation PD 1 W Short circuit current I OS 50 mA Storage temperature Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. DC OPERATING CONDITIONS Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -40 to 85 °C ) Parameter Symbol Min Typ Max Unit V D D, V DDQ 3.0 3.3 3.6 V Input logic high voltage VI H 2.0 3.0 VDD +0.3 V 1 Input logic low voltage VIL -0.3 0 0.8 V 2 Output logic high voltage VO H 2.4 - - V I O H = -2mA Output logic low voltage V OL - - 0.4 V IOL = 2mA ILI -10 - 10 uA 3 Supply voltage Input leakage current Note Notes : 1. V I H (max) = 5.6V AC.The overshoot voltage duration is ≤ 3ns. 2. V IL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns. 3. Any input 0V ≤ V IN ≤ V DDQ , Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. CAPACITANCE (VDD = 3.3V, TA = 23°C, f = 1MHz, V REF =1.4V ± 200 mV) Pin Symbol Min Max Unit Note CCLK 2.5 4.0 pF 1 CIN 2.5 5.0 pF 2 Address CADD 2.5 5.0 pF 2 D Q0 ~ DQ15 COUT 4.0 6.5 pF 3 Clock RAS, CAS, WE, CS, CKE, DQM Notes : 1. -75 only specify a maximum value of 3.5pF 2. -75 only specify a maximum value of 3.8pF 3. -75 only specify a maximum value of 6.0pF Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, TA = -40 to 85 °C) Parameter Operating current (One bank active) Precharge standby current in power-down mode Symbol ICC1 ICC2P Precharge standby current in non power-down mode I CC2NS Active standby current in non power-down mode (One bank active) Burst length = 1 tRC ≥ t R C(min) IO = 0 mA -75 -1H -1L 150 140 140 CKE ≤ V IL (max), t CC = 10ns 1 ICC2 PS CKE & CLK ≤ V IL (max), tCC = ∞ ICC2 N Active standby current in power-down mode Version Test Condition ICC3P I CC3NS Note mA 1 mA 1 CKE ≥ V IH (min), CS ≥ V I H(min), tCC = 10ns Input signals are changed one time during 20ns 20 mA CKE ≥ V IH (min), CLK ≤ V IL (max), tCC = ∞ Input signals are stable 7 CKE ≤ V IL (max), t CC = 10ns 5 ICC3 PS CKE & CLK ≤ V IL (max), tCC = ∞ ICC3 N Unit mA 5 CKE ≥ V IH (min), CS ≥ V I H(min), tCC = 10ns Input signals are changed one time during 20ns 30 mA CKE ≥ V IH (min), CLK ≤ V IL (max), tCC = ∞ Input signals are stable 20 mA IO = 0 mA Page burst 4Banks Activated tC C D = 2CLKs Operating current (Burst mode) ICC4 Refresh current ICC5 tRC ≥ tR C(min) Self refresh current ICC6 CKE ≤ 0.2V 180 145 145 mA 1 220 210 210 mA 2 C 1.5 mA 3 L 800 uA 4 Notes : 1. Measured with outputs open. 2. Refresh period is 64ms. 3. K4S281632C-TI** 4. K4S281632C-TP** 5. Unless otherwise noted, input swing IeveI is CMOS(VIH /V IL =V DDQ /V SSQ) Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM AC OPERATING TEST CONDITIONS (V DD = 3.3V ± 0.3V, TA = -40 to 85 °C) Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition Value Unit 2.4/0.4 V 1.4 V tr/tf = 1/1 ns 1.4 V See Fig. 2 3.3V Vtt = 1.4V 1200 Ω 50Ω VOH (DC) = 2.4V, I OH = -2mA VOL (DC) = 0.4V, IOL = 2mA Output 870Ω Z0 = 50 Ω Output 50pF 50pF (Fig. 1) DC output load circuit (Fig. 2) AC output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter Version Symbol - 75 - 1H -1L Unit Note Row active to row active delay tR R D(min) 15 20 20 ns 1 RAS to CAS delay tR C D(min) 20 20 20 ns 1 Row precharge time t R P(min) 20 20 20 ns 1 t R A S(min) 45 50 50 ns 1 Row active time tRAS (max) Row cycle time tRC (min) Last data in to row precharge tRDL (min) Last data in to Active delay 100 ns 1 2 CLK 2 tDAL (min) 2 CLK + tRP - Last data in to new col. address delay tCDL (min) 1 CLK 2 Last data in to burst stop tBDL (min) 1 CLK 2 Col. address to col. address delay tC C D(min) 1 CLK 3 ea 4 Number of valid output data 65 us 70 CAS latency=3 CAS latency=2 70 2 - 1 Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next higher integer. 2. Minimum delay is required to complete write. 3. All parts allow every cycle column address change. 4. In case of row precharge interrupt, auto precharge and read burst stop. Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM AC CHARACTERISTICS (AC operating conditions unless otherwise noted) Parameter - 75 Symbol Min CLK cycle time CAS latency=3 tCC 7.5 CAS latency=2 CLK to valid output delay CAS latency=3 Output data hold time CAS latency=3 - 1H Max 1000 tSAC CAS latency=2 Min Max 10 1000 10 Min 10 Unit Note ns 1 ns 1,2 ns 2 Max 1000 12 5.4 6 6 - 6 7 CAS latency=2 tOH - 1L 3 3 3 - 3 3 CLK high pulse width tCH 2.5 3 3 ns 3 CLK low pulse width tC L 2.5 3 3 ns 3 Input setup time tSS 1.5 2 2 ns 3 Input hold time tSH 0.8 1 1 ns 3 CLK to output in Low-Z tSLZ 1 1 1 ns 2 CLK to output in Hi-Z CAS latency=3 tSHZ 5.4 6 6 - 6 7 CAS latency=2 ns Notes : 1. Parameters depend on programmed CAS latency. 2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter. 3. Assumed input rise and fall time (tr & tf) = 1ns. If tr & tf is longer than 1ns, transient time compensation should be considered, i.e., [(tr + tf)/2-1]ns should be added to the parameter. DQ BUFFER OUTPUT DRIVE CHARACTERISTICS Parameter Symbol Condition Min Output rise time trh Measure in linear region : 1.2V ~ 1.8V Output fall time tfh Output rise time Output fall time Typ Max Unit Notes 1.37 4.37 Volts/ns 3 Measure in linear region : 1.2V ~ 1.8V 1.30 3.8 Volts/ns 3 trh Measure in linear region : 1.2V ~ 1.8V 2.8 3.9 5.6 Volts/ns 1,2 tfh Measure in linear region : 1.2V ~ 1.8V 2.0 2.9 5.0 Volts/ns 1,2 Notes : 1. Rise time specification based on 0pF + 50 Ω to V SS , use these values to design to. 2. Fall time specification based on 0pF + 50 Ω to VD D, use these values to design to. 3. Measured into 50pF only, use these values to characterize to. 4. All measurements done with respect to V SS . Rev. 0.1 Jun. 2001 K4S281632C-TI(P) CMOS SDRAM SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Refresh CKEn-1 CKEn CS RAS CAS WE DQM H X L L L L X OP code L L L H X X H Entry Self fefresh Exit H BA0,1 L H L H H H H X X X X L H H X V Read & column address Auto precharge disable H X L H L H X V Write & column address Auto precharge disable Auto precharge enable X L H L L X H X L H H L X H X L L H L X H L Exit L H Entry H L Precharge power down mode Exit L Column address (A 0 ~ A 8) V L Column address (A 0 ~ A 8) H All banks Entry L DQM H No operation command H H H X X X L V V V X X X X H X X X L H H H H X X X L V V V X X H X X X L H H H 3 Row address H Auto precharge enable Clock suspend or active power down 3 3 L Bank selection 1,2 X X H Note 3 H Precharge A11, A9 ~ A 0 L Bank active & row addr. Burst stop A 1 0/AP X V L X H 4 4,5 4 4,5 6 X X X X X X X V X X X 7 (V=Valid, X=Don′t care, H=Logic high, L=Logic low) Notes : 1. OP Code : Operand code A 0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS) 2. MRS can be issued only at all banks precharge state. A new command can be issued after 2 CLK cycles of MRS. 3. Auto refresh functions are as same as CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. 4. BA 0 ~ BA 1 : Bank select addresses. If both BA 0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If both BA 0 is "Low" and BA 1 is "High" at read, write, row active and precharge, bank B is selected. If both BA 0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank C is selected. If both BA 0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. If A 10 /AP is "High" at row precharge, BA0 and BA 1 is ignored and all banks are selected. 5. During burst read or write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at t R P after the end of burst. 6. Burst stop command is valid at every burst length. 7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0), but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2) Rev. 0.1 Jun. 2001