SAMSUNG K4S510732B-TL1H

Preliminary
K4S510732B
CMOS SDRAM
Stacked 512Mbit SDRAM
16M x 8bit x 4 Banks
Synchronous DRAM
LVTTL
Revision 0.0
Feb. 2001
* Samsung Electronics reserves the right to change products or specification without
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
Revision 0.0 (Feb., 2001)
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
16M x 8Bit x 4 Banks Synchronous DRAM
FEATURES
GENERAL DESCRIPTION
• JEDEC standard 3.3V power supply
• LVTTL compatible with multiplexed address
• Four banks operation
• MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page)
-. Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system
clock.
• Burst read single-bit write operation
• DQM for masking
• Auto & self refresh
• 64ms refresh period (8K Cycle)
The K4S510732B is 536,870,912 bits synchronous high data rate
Dynamic RAM organized as 4 x 16,777,216 words by 8 bits, fabricated with SAMSUNG's high performance CMOS technology. Synchronous design allows precise cycle control with the use of
system clock I/O transactions are possible on every clock cycle.
Range of operating frequencies, programmable burst length and
programmable latencies allow the same device to be useful for a
variety of high bandwidth, high performance memory system applications.
ORDERING INFORMATION
Part No.
Max Freq.
K4S510732B-TC/L75
133MHz(CL=3)
K4S510732B-TC/L1H
100MHz(CL=2)
K4S510732B-TC/L1L
100MHz(CL=3)
Interface
Package
LVTTL
54pin
TSOP(II)
FUNCTIONAL BLOCK DIAGRAM
CLK,CAS,RAS
/WE,DQM
/CS1,CKE1
32Mx8
32Mx8
/CS0,CKE0
DQ0 ~ DQ7
A0~A12,BA0,BA1
* Samsung Electronics reserves the right to change products or specification without notice.
Staktek’s stacking technology is Samsung’s stacking technology of choice.
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
PIN CONFIGURATION (Top view)
VDD
DQ0
VDDQ
N.C
DQ1
VSSQ
N.C
DQ2
VDDQ
N.C
DQ3
VSSQ
N.C
VDD
CS1
WE
CAS
RAS
CS0
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
VSS
DQ7
VSSQ
N.C
DQ6
VDDQ
N.C
DQ5
VSSQ
N.C
DQ4
VDDQ
N.C
VSS
CKE1
DQM
CLK
CKE0
A12
A11
A9
A8
A7
A6
A5
A4
VSS
54Pin TSOP (II)
(400mil x 875mil)
(0.8 mm Pin pitcH)
PIN FUNCTION DESCRIPTION
Pin
Name
Input Function
CLK
System clock
Active on the positive going edge to sample all inputs.
CS0~1
Chip select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
CKE0~1
Clock enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A12
Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA12, Column address : CA 0 ~ CA9
BA0 ~ BA 1
Bank select address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS
Row address strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS
Column address strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE
Write enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
DQM
Data input/output mask
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when DQM active.
DQ0 ~7
Data input/output
Data inputs/outputs are multiplexed on the same pins.
VDD/VSS
Power supply/ground
Power and ground for the input buffers and the core logic.
VDDQ/VSSQ
Data output power/ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Voltage on any pin relative to Vss
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD supply relative to Vss
VDD, VDDQ
-1.0 ~ 4.6
V
TSTG
-55 ~ +150
°C
Power dissipation
PD
2
W
Short circuit current
IOS
50
mA
Storage temperature
Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70°C)
Parameter
Symbol
Min
Typ
Max
Unit
VDD, VDDQ
3.0
3.3
3.6
V
VIH
2.0
3.0
VDD+0.3
V
Input logic low voltage
VIL
-0.3
0
0.8
V
2
Output logic high voltage
VOH
2.4
-
-
V
IOH = -2mA
Output logic low voltage
VOL
-
-
0.4
V
IOL = 2mA
ILI
-10
-
10
uA
3
Supply voltage
Input logic high voltage
Input leakage current
Note
1
Notes : 1. VIH (max) = 5.6V AC. The overshoot voltage duration is ≤ 3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ VIN ≤ VDDQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
(VDD = 3.3V, TA = 23°C, f = 1MHz, VREF =1.4V ± 200 mV)
CAPACITANCE
Pin
Clock
RAS, CAS, WE, DQM
Symbol
Min
Max
Unit
CCLK
5.0
9.0
pF
CIN
5.0
10.0
pF
CADD
5.0
10.0
pF
CS#, CKE#
Ccs
2.5
6.5
pF
DQ0 ~ DQ8
COUT
8.0
14.0
pF
Address
Note
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)
Parameter
Operating current
(One bank active)
Precharge standby current in
power-down mode
Symbol
ICC1
ICC2P
ICC2PS
ICC2N
Precharge standby current in
non power-down mode
ICC2NS
Active Standby current
in power-down mode
Active standby current in
non power-down mode
(One bank active)
ICC3P
ICC3PS
ICC3N
ICC3NS
Version
Test Condition
Burst length = 1
tRC ≥ tRC(min)
IO = 0 mA
-75
-1H
-1L
135
125
125
CKE ≤ VIL(max), tCC = 10ns
4
CKE & CLK ≤ VIL(max), tCC = ∞
4
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
30
Unit
Note
mA
1
mA
mA
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
25
CKE ≤ VIL(max), tCC = 10ns
8
CKE & CLK ≤ VIL(max), tCC = ∞
8
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
45
mA
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
40
mA
mA
Operating current
(Burst mode)
ICC4
IO = 0 mA
Page burst
4banks activated.
tCCD = 2CLKs
170
145
145
mA
1
Refresh current
ICC5
tRC ≥ tRC(min)
235
225
225
mA
2
Self refresh current
ICC6
CKE ≤ 0.2V
C
6
mA
3
L
4
mA
4
Notes : 1. Measured with outputs open.
2. Refresh period is 64ms.
3. K4S510732B-TC**
4. K4S510732B-TL**
5. Unless otherwise noticed, input swing level is CMOS(VIH/VIL =VDDQ/VSSQ).
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C)
Parameter
AC input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Unit
2.4/0.4
V
1.4
V
tr/tf = 1/1
ns
1.4
V
Output timing measurement reference level
Output load condition
Value
See Fig. 2
3.3V
Vtt = 1.4V
1200Ω
50Ω
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
Output
Z0 = 50Ω
Output
50pF
870Ω
50pF
(Fig. 1) DC output load circuit
(Fig. 2) AC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Version
Symbol
-75
-1H
-1L
Unit
Note
Row active to row active delay
tRRD(min)
15
20
20
ns
1
RAS to CAS delay
tRCD(min)
20
20
20
ns
1
tRP(min)
20
20
20
ns
1
tRAS(min)
45
50
50
ns
1
Row precharge time
Row active time
tRAS (max)
100
Row cycle time
tRC(min)
ns
1
Last data in to row precharge
tRDL(min)
2
CLK
2,5
Last data in to Active delay
tDAL(min)
2 CLK + 20 ns
-
5
Last data in to new col. address delay
tCDL(min)
1
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
tCCD(min)
1
CLK
3
ea
4
Col. address to col. address delay
Number of valid output data
65
us
CAS latency=3
CAS latency=2
70
70
2
-
1
Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
5. For 1H/1L, tRDL=1CLK and tDAL=1CLK+20ns is also supported .
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + 20ns.
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
AC CHARACTERISTICS
(AC operating conditions unless otherwise noted)
Parameter
-75
Symbol
Min
CLK cycle time
CAS latency=3
tCC
CAS latency=2
CLK to valid
output delay
Output data
hold time
CAS latency=3
7.5
-1H
Max
1000
tSAC
tOH
CAS latency=2
10
Max
1000
10
Min
10
Unit
Note
ns
1
ns
1,2
ns
2
Max
1000
12
5.4
6
6
-
6
7
CAS latency=2
CAS latency=3
Min
-1L
3
3
3
-
3
3
CLK high pulse width
tCH
2.5
3
3
ns
3
CLK low pulse width
tCL
2.5
3
3
ns
3
Input setup time
tSS
1.5
2
2
ns
3
Input hold time
tSH
0.8
1
1
ns
3
CLK to output in Low-Z
tSLZ
1
1
1
ns
2
CLK to output
in Hi-Z
CAS latency=3
tSHZ
5.4
6
6
-
6
7
CAS latency=2
ns
Notes : 1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
Parameter
Symbol
Condition
Min
Output rise time
trh
Measure in linear
region : 1.2V ~1.8V
Output fall time
tfh
Output rise time
Output fall time
Typ
Max
Unit
Notes
1.37
4.37
Volts/ns
3
Measure in linear
region : 1.2V ~1.8V
1.30
3.8
Volts/ns
3
trh
Measure in linear
region : 1.2V ~1.8V
2.8
3.9
5.6
Volts/ns
1,2
tfh
Measure in linear
region : 1.2V ~1.8V
2.0
2.9
5.0
Volts/ns
1,2
Notes : 1. Rise time specification based on 0pF + 50 Ohms to VSS, use these values to design to.
2. Fall time specification based on 0pF + 50 Ohms to VDD, use these values to design to.
3. Measured into 50pF only, use these values to characterize to.
4. All measurements done with respect to VSS.
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
IBIS SPECIFICATION
66MHz, 100MHz and 133MHz Pull-up
0
IOH Characteristics (Pull-up)
(V)
3.45
3.3
3.0
2.6
2.4
2.0
1.8
1.65
1.5
1.4
1.0
0.0
100MHz/
133MHz
Min
I (mA)
0.0
-21.1
-34.1
-58.7
-67.3
-73.0
-77.9
-80.8
-88.6
-93.0
100MHz/
133MHz
Max
I (mA)
-2.4
-27.3
-74.1
-129.2
-153.3
-197.0
-226.2
-248.0
-269.7
-284.3
-344.5
-502.4
66MHz
Min
1
1.5
2
2.5
3
3.5
-100
I (mA)
-200
-0.7
-7.5
-13.3
-27.5
-35.5
-41.1
-47.9
-52.4
-72.5
-93.0
mA
Voltage
0.5
0
-300
-400
-500
-600
Voltage
IOH Min (100MHz/133MHz)
IOH Min (66MHz)
IOH Max (66 and 100MHz/133MHz)
66MHz, 100MHz and 133MHz Pull-down
IOL Characteristics (Pull-down)
(V)
0
0.4
0.65
0.85
1
1.4
1.5
1.65
1.8
1.95
3
3.45
100MHz/
133MHz
Max
I (mA)
0.0
70.2
107.5
133.8
151.2
187.7
194.4
202.5
208.6
212.0
219.6
222.6
250
66MHz
Min
I (mA)
0.0
17.7
26.9
33.3
37.6
46.6
48.0
49.5
50.7
51.5
54.2
54.9
200
150
mA
Voltage
100MHz/
133MHz
Min
I (mA)
0.0
27.5
41.8
51.6
58.0
70.7
72.9
75.4
77.0
77.6
80.3
81.4
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
Voltage
IOL Min (100MHz/133MHz)
IOL Min (66MHz)
IOL Max (100MHz/133MHz)
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
Minimum VDD clamp current
(Referenced to VDD)
VDD Clamp @ CLK, CKE, CS, DQM & DQ
I (mA)
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.23
1.34
3.02
5.06
7.35
9.83
12.48
15.30
18.31
20
15
mA
VDD (V)
0.0
0.2
0.4
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
10
5
0
0
1
2
3
Voltage
I (mA)
Minimum VSS clamp current
VSS Clamp @ CLK, CKE, CS, DQM & DQ
I (mA)
-57.23
-45.77
-38.26
-31.22
-24.58
-18.37
-12.56
-7.57
-3.37
-1.75
-0.58
-0.05
0.0
0.0
0.0
0.0
-3
-2
-1
0
0
-10
-20
mA
VSS (V)
-2.6
-2.4
-2.2
-2.0
-1.8
-1.6
-1.4
-1.2
-1.0
-0.9
-0.8
-0.7
-0.6
-0.4
-0.2
0.0
-30
-40
-50
-60
Voltage
I (mA)
Rev. 0.0 Feb.2001
Preliminary
K4S510732B
CMOS SDRAM
SIMPLIFIED TRUTH TABLE
Command
Register
Mode register set
Auto refresh
Refresh
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
H
X
L
L
L
L
X
OP code
L
L
L
H
X
X
H
Entry
Self
refresh
Exit
H
BA0,1
L
H
L
H
H
H
H
X
X
X
X
L
H
H
X
V
Read &
column address
H
X
L
H
L
H
X
V
Precharge
Auto precharge enable
H
X
L
H
L
L
X
H
X
L
H
H
L
X
Entry
H
X
L
L
H
L
X
H
L
Exit
L
H
Entry
H
L
Precharge power down mode
Exit
DQM
No operation command
L
Column
address
(A0 ~ A9)
V
L
Column
address
(A0 ~ A9)
H
All banks
Clock suspend or
active power down
L
H
H
X
X
X
L
V
V
V
X
X
X
X
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
XX
H
H
X
H
X
X
X
L
H
H
H
3
Row address
H
Auto precharge enable
Bank selection
3
3
L
Burst Stop
1,2
X
X
Auto precharge disable
Note
3
H
Write &
column address
A11,A12,
A9 ~ A 0
L
Bank active & row addr.
Auto precharge disable
A10/AP
X
V
L
X
H
4
4,5
4
4,5
6
X
X
X
X
X
X
X
V
X
X
X
7
(V=Valid, X=Don't care, H=Logic high)
Notes : 1. OP Code : Operand code
A0 ~ A12 & BA0 ~ BA1 : Program keys. (@ MRS)
2. MRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA0 ~ BA1 : Bank select addresses.
If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected.
If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected.
If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected.
If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0),
but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
Rev. 0.0 Feb.2001