K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM 36Mb NtRAMTM Specification 100 TQFP with Pb / Pb-Free (RoHS compliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM Document Title 1Mx36 & 2Mx18-Bit Flow Through NtRAMTM Revision History Rev. No. History Draft Date Remark 0.0 1. Initial document. Jan. 26. 2006 Advance 0.1 1. Add the overshoot timing Feb. 16 2006 Preliminary 0.2 1. Change ordering information Apr. 04. 2006 Preliminary 1.0 1. Finalize the datasheet July.14. 2006 Final 1.1 1. Change Access time 7.5ns to 6.5ns June. 10. 2007 Final -2- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM 36Mb NtRAM (Flow Through) Ordering Information Org. VDD (V) Speed (ns) Access Time (ns) Part Number 2Mx18 3.3/2.5 8.5 6.5 K7M321835C-P(Q) C(I) 65 √ 1Mx36 3.3/2.5 8.5 6.5 K7M323635C-P(Q)1C(I)265 √ 1 RoHS Avail. 2 Note 1. P(Q) [Package type] : P-Pb Free, Q-Pb 2. C(I) [Operating Temperature] : C-Commercial, I-Industrial -3- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM 1Mx36 & 2Mx18-Bit Flow Through NtRAMTM FEATURES GENERAL DESCRIPTION • VDD= 2.5 or 3.3V +/- 5% Power Supply. • Byte Writable Function. • Enable clock and suspend operation. • Single READ/WRITE control pin. • Self-Timed Write Cycle. • Three Chip Enable for simple depth expansion with no data contention . • A interleaved burst or a linear burst mode. • Asynchronous output enable control. • Power Down mode. • TTL-Level Three-State Outputs. • 100-TQFP-1420A (Lead and Lead free package) • Operating in commeical and industrial temperature range. The K7M323635C and K7M321835C are 37,748,736-bits Synchronous Static SRAMs. The NtRAMTM, or No Turnaround Random Access Memory utilizes all bandwidth in any combination of operating cycles. Address, data inputs, and all control signals except output enable and linear burst order are synchronized to input clock. Burst order control must be tied "High or Low". Asynchronous inputs include the sleep mode enable(ZZ). Output Enable controls the outputs at any given time. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation and provides increased timing flexibility for incoming signals. For read cycles, Flow-Through SRAM allows output data to simply flow freely from the memory array. The K7M323635C and K7M321835C are implemented with SAMSUNG′s high performance CMOS technology and is available in 100pin TQFP packages. Multiple power and ground pins minimize ground bounce. FAST ACCESS TIMES Parameter Sym. -65 Unit tCYC 7.5 ns Clock Access Time tCD 6.5 ns Output Enable Access tOE 3.5 ns Cycle Time LOGIC BLOCK DIAGRAM LBO A [0:19]or A [0:20] CKE ADDRESS REGISTER A2~A19 or A2~A20 CONTROL LOGIC CLK A0~A1 ADV WE BWx (x=a,b,c,d or a,b) A′0~A′1 1Mx36 , 2Mx18 MEMORY ARRAY WRITE ADDRESS REGISTER K K CONTROL REGISTER CS1 CS2 CS2 BURST ADDRESS COUNTER DATA-IN REGISTER CONTROL LOGIC BUFFER OE ZZ 36 or 18 DQa0 ~ DQd7 or DQa0 ~ DQb8 DQPa ~ DQPd NtRAMTM and No Turnaround Random Access Memory are trademarks of Samsung. -4- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM VDD VSS CLK WE CKE OE ADV A18 A17 A8 A9 90 89 88 87 86 85 84 83 82 81 BWb 94 91 BWc 95 BWa BWd 96 CS2 CS2 97 92 CS1 98 93 A6 A7 99 100 Pin TQFP (20mm x 14mm) 44 45 46 47 48 49 50 A10 A11 A12 A13 A14 A15 A16 39 N.C. 43 38 N.C. A19 37 A0 42 36 A1 N.C. 35 A2 41 34 A3 40 33 A4 VSS 32 VDD 31 K7M323635C (1Mx36) A5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 LBO DQPc DQc0 DQc1 VDDQ VSSQ DQc2 DQc3 DQc4 DQc5 VSSQ VDDQ DQc6 DQc7 Vss VDD VDD VSS DQd0 DQd1 VDDQ VSSQ DQd2 DQd3 DQd4 DQd5 VSSQ VDDQ DQd6 DQd7 DQPd 100 PIN CONFIGURATION(TOP VIEW) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 DQPb DQb7 DQb6 VDDQ VSSQ DQb5 DQb4 DQb3 DQb2 VSSQ VDDQ DQb1 DQb0 VSS VSS VDD ZZ DQa7 DQa6 VDDQ VSSQ DQa5 DQa4 DQa3 DQa2 VSSQ VDDQ DQa1 DQa0 DQPa PIN NAME SYMBOL A0 - A19 PIN NAME TQFP PIN NO. SYMBOL Address Inputs 32,33,34,35,36,37,43 4445,46,47,48,49,50, 81,82,83,84,99,100 Address Advance/Load 85 ADV Read/Write Control Input 88 WE Clock CLK 89 Clock Enable CKE 87 CS1 Chip Select 98 CS2 Chip Select 97 CS2 Chip Select 92 BWx(x=a,b,c,d) Byte Write Inputs 93,94,95,96 OE Output Enable 86 ZZ Power Sleep Mode 64 LBO Burst Mode Control 31 PIN NAME TQFP PIN NO. VSS Power Supply(+3.3V) 15,16,41,65,91 Ground 14,17,40,66,67,90 N.C. No Connect 38,39,42 DQa0~a7 DQb0~b7 DQc0~c7 DQd0~d7 DQPa~Pd Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs 52,53,56,57,58,59,62,63 68,69,72,73,74,75,78,79 2,3,6,7,8,9,12,13 18,19,22,23,24,25,28,29 51,80,1,30 VDDQ Output Power Supply 4,11,20,27,54,61,70,77 (2.5V or 3.3V) Output Ground 5,10,21,26,55,60,71,76 VDD VSSQ Notes : 1. A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired. -5- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM BWa VDD VSS CLK WE CKE OE ADV A19 A18 A8 A9 91 90 89 88 87 86 85 84 83 82 81 BWb 94 CS2 N.C. 95 92 CS2 N.C. 97 93 CS1 98 96 A6 A7 99 100 Pin TQFP (20mm x 14mm) 38 39 40 41 42 43 44 45 46 47 48 49 50 N.C. N.C. VSS VDD N.C. A20 A11 A12 A13 A14 A15 A16 A17 35 A2 37 34 A3 36 33 A4 A1 32 A0 31 K7M321835C (2Mx18) A5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 LBO N.C. N.C. N.C. VDDQ VSSQ N.C. N.C. DQb8 DQb7 VSSQ VDDQ DQb6 DQb5 VSS VDD VDD VSS DQb4 DQb3 VDDQ VSSQ DQb2 DQb1 DQb0 N.C. VSSQ VDDQ N.C. N.C. N.C. 100 PIN CONFIGURATION(TOP VIEW) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A10 N.C. N.C. VDDQ VSSQ N.C. DQa0 DQa1 DQa2 VSSQ VDDQ DQa3 DQa4 VSS VSS VDD ZZ DQa5 DQa6 VDDQ VSSQ DQa7 DQa8 N.C. N.C. VSSQ VDDQ N.C. N.C. N.C. PIN NAME SYMBOL A0 - A20 PIN NAME Address Inputs TQFP PIN NO. 32,33,34,35,36,37,43 44,45,46,47,48,49,50, 80,81,82,83,84,99,100 Address Advance/Load 85 ADV Read/Write Control Input 88 WE Clock CLK 89 Clock Enable CKE 87 CS1 Chip Select 98 CS2 Chip Select 97 CS2 Chip Select 92 BWx(x=a,b) Byte Write Inputs 93,94 OE Output Enable 86 ZZ Power Sleep Mode 64 LBO Burst Mode Control 31 SYMBOL PIN NAME TQFP PIN NO. VDD VSS Power Supply(+3.3V) Ground 15,16,41,65,91 14,17,40,66,67,90 N.C. No Connect 1,2,3,6,7,25,28,29,30, 38,39,42,51,52,53, 56,57,75,78,79,95,96 DQa0~a8 DQb0~b8 Data Inputs/Outputs Data Inputs/Outputs 58,59,62,63,68,69,72,73,74 8,9,12,13,18,19,22,23,24 VDDQ Output Power Supply (2.5V or 3.3V) Output Ground 4,11,20,27,54,61,70,77 VSSQ 5,10,21,26,55,60,71,76 Notes : 1. A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired. -6- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM FUNCTION DESCRIPTION The K7M323635C and K7M321835C are NtRAMTM designed to sustain 100% bus bandwidth by eliminating turnaround cycle when there is transition from Read to Write, or vice versa. All inputs (with the exception of OE, LBO and ZZ) are synchronized to rising clock edges. All read, write and deselect cycles are initiated by the ADV input. Subsequent burst addresses can be internally generated by the burst advance pin (ADV). ADV should be driven to Low once the device has been deselected in order to load a new address for next operation. Clock Enable(CKE) pin allows the operation of the chip to be suspended as long as necessary. When CKE is high, all synchronous inputs are ignored and the internal device registers will hold their previous values. NtRAMTM latches external address and initiates a cycle, when CKE, ADV are driven to low and all three chip enables(CS1, CS2, CS2) are active. Output Enable(OE) can be used to disable the output at any given time. Read operation is initiated when at the rising edge of the clock, the address presented to the address inputs are latched in the address register, CKE is driven low, all three chip enables(CS1, CS2, CS2) are active, the write enable input signals WE are driven high, and ADV driven low. Data appears at the outputs within the same clock cycle as the address for the data. Also during read operation OE must be driven low for the device to drive out the requested data. Write operation occurs when WE is driven low at the rising edge of the clock. BW[d:a] can be used for byte write operation. The Flow Through NtRAMTM uses a late write cycle to utilize 100% of the bandwidth. At the first rising edge of the clock, WE and address are registered, and the data associated with that address is required one cycle later. Subsequent addresses are generated by ADV High for the burst access as shown below. The starting point of the burst seguence is provided by the external address. The burst address counter wraps around to its initial state upon completion. The burst sequence is determined by the state of the LBO pin. When this pin is low, linear burst sequence is selected. And when this pin is high, Interleaved burst sequence is selected. During normal operation, ZZ must be driven low. When ZZ is driven high, the SRAM will enter a Power Sleep Mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM normally operates after 2 cycles of wake up time. BURST SEQUENCE TABLE LBO PIN HIGH First Address Fourth Address (Interleaved Burst, LBO=High) Case 1 A1 0 0 1 1 Case 2 A0 0 1 0 1 A1 0 0 1 1 Case 3 A0 1 0 1 0 A1 1 1 0 0 BQ TABLE LBO PIN Case 4 A0 0 1 0 1 A1 1 1 0 0 A0 1 0 1 0 (Linear Burst, LBO=Low) LOW First Address Fourth Address Case 1 A1 0 0 1 1 Case 2 A0 0 1 0 1 A1 0 1 1 0 Case 3 A0 1 0 1 0 A1 1 1 0 0 Case 4 A0 0 1 0 1 A1 1 0 0 1 A0 1 0 1 0 Note : 1. LBO pin must be tied to High or Low, and Floating State must not be allowed. -7- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM STATE DIAGRAM FOR NtRAMTM WRITE READ READ BEGIN READ BEGIN WRITE ITE WR DS RE AD DS ST B UR ST BURST R W D R EA IT E DS BURST READ BURST WRITE COMMAND READ WRI TE DESELECT DS DS BUR D RE A DS BURST WRITE BURST ACTION DESELECT BEGIN READ WRITE BEGIN WRITE BURST BEGIN READ BEGIN WRITE CONTINUE DESELECT Notes : 1. An IGNORE CLOCK EDGE cycle is not shown is the above diagram. This is because CKE HIGH only blocks the clock(CLK) input and does not change the state of the device. 2. States change on the rising edge of the clock(CLK) -8- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM TRUTH TABLES SYNCHRONOUS TRUTH TABLE CS1 CS2 CS2 ADV WE BWx OE CKE CLK ADDRESS ACCESSED OPERATION H X X L X X X L X L X X X L ↑ N/A Not Selected X L ↑ N/A X X H L X X X Not Selected L ↑ N/A Not Selected X X X H X X X L ↑ N/A Not Selected Continue L H L L H X L L ↑ External Address Begin Burst Read Cycle X X X H X X L L ↑ Next Address Continue Burst Read Cycle L H L L H X H L ↑ External Address NOP/Dummy Read X X X H X X H L ↑ Next Address Dummy Read L H L L L L X L ↑ External Address Begin Burst Write Cycle X X X H X L X L ↑ Next Address Continue Burst Write Cycle L H L L L H X L ↑ N/A NOP/Write Abort X X X H X H X L ↑ Next Address Write Abort X X X X X X X H ↑ Current Address Ignore Clock Notes : 1. X means "Don′t Care". 2. The rising edge of clock is symbolized by (↑). 3. A continue deselect cycle can only be enterd if a deselect cycle is executed first. 4. WRITE = L means Write operation in WRITE TRUTH TABLE. WRITE = H means Read operation in WRITE TRUTH TABLE. 5. Operation finally depends on status of asynchronous input pins(ZZ and OE). WRITE TRUTH TABLE( x36) WE BWa BWb BWc BWd H X X X X OPERATION READ L L H H H WRITE BYTE a WRITE BYTE b L H L H H L H H L H WRITE BYTE c L H H H L WRITE BYTE d L L L L L WRITE ALL BYTEs L H H H H WRITE ABORT/NOP Notes : 1. X means "Don′t Care". 2. All inputs in this table must meet setup and hold time around the rising edge of CLK(↑). WRITE TRUTH TABLE(x18) WE BWa BWb H X X OPERATION READ L L H WRITE BYTE a L H L WRITE BYTE b L L L WRITE ALL BYTEs L H H WRITE ABORT/NOP Notes : 1. X means "Don′t Care". 2. All inputs in this table must meet setup and hold time around the rising edge of CLK(↑). -9- Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM ASYNCHRONOUS TRUTH TABLE Operation ZZ OE I/O STATUS Sleep Mode H X High-Z Read L L DQ L H High-Z Write L X Din, High-Z Deselected L X High-Z Notes 1. X means "Don′t Care". 2. Sleep Mode means power Sleep Mode of which stand-by current does not depend on cycle time. 3. Deselected means power Sleep Mode of which stand-by current depends on cycle time. ABSOLUTE MAXIMUM RATINGS* PARAMETER SYMBOL RATING UNIT Voltage on VDD Supply Relative to VSS VDD -0.3 to 4.6 V Voltage on Any Other Pin Relative to VSS VIN -0.3 to VDD+0.3 V Power Dissipation PD 1.6 W TSTG -65 to 150 °C Commercial TOPR 0 to 70 °C Industrial TOPR -40 to 85 °C TBIAS -10 to 85 °C Storage Temperature Operating Temperature Storage Temperature Range Under Bias *Notes : Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. OPERATING CONDITIONS PARAMETER Supply Voltage SYMBOL MIN Typ. MAX UNIT VDD1 2.375 2.5 2.625 V VDDQ1 2.375 2.5 2.625 V VDD2 3.135 3.3 3.465 V VDDQ2 3.135 3.3 3.465 V VSS 0 0 0 V Ground Notes: 1. The above parameters are also guaranteed at industrial temperature range. 2. It should be VDDQ ≤ VDD CAPACITANCE*(TA=25°C, f=1MHz) PARAMETER SYMBOL TEST CONDITION MIN MAX UNIT CIN VIN=0V - 5 pF COUT VOUT=0V - 7 pF Input Capacitance Output Capacitance *Note : Sampled not 100% tested. Overshoot Timing Undershoot Timing 20% tCYC(MIN) VIH VDDQ+1.0V VDDQ+0.5V VSS VDDQ VSS-0.5V VSS-1.0V 20% tCYC(MIN) VIL - 10 - Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM DC ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNIT NOTES Input Leakage Current(except ZZ) IIL VDD=Max ; VIN=VSS to VDD -2 +2 µA Output Leakage Current IOL Output Disabled, -2 +2 µA Operating Current ICC - 310 mA - 140 mA - 110 mA - 100 mA ISB Standby Current ISB1 ISB2 Device Selected, IOUT=0mA, ZZ≤VIL , Cycle Time ≥ tCYC Min Device deselected, IOUT=0mA, ZZ≤VIL, f=Max, All Inputs≤0.2V or ≥ VDD-0.2V Device deselected, IOUT=0mA, ZZ≤0.2V, f=0, All Inputs=fixed (VDD-0.2V or 0.2V) Device deselected, IOUT=0mA, ZZ≥VDD-0.2V, f=Max, All Inputs≤VIL or ≥VIH Output Low Voltage(3.3V I/O) VOL IOL=8.0mA - 0.4 V Output High Voltage(3.3V I/O) VOH IOH=-4.0mA 2.4 - V Output Low Voltage(2.5V I/O) VOL IOL=1.0mA - 0.4 V Output High Voltage(2.5V I/O) VOH IOH=-1.0mA 2.0 - V Input Low Voltage(3.3V I/O) VIL -0.3* 0.8 V Input High Voltage(3.3V I/O) VIH 2.0 VDD+0.3** V Input Low Voltage(2.5V I/O) VIL -0.3* 0.7 V Input High Voltage(2.5V I/O) VIH 1.7 VDD+0.3** V 1,2 3 3 Notes : 1. The above parameters are also guaranteed at industrial temperature range. 2. Reference AC Operating Conditions and Characteristics for input and timing. 3. Data states are all zero. 4. In Case of I/O Pins, the Max. VIH=VDDQ+0.3V. TEST CONDITIONS PARAMETER Input Pulse Level(for 3.3V I/O) Input Pulse Level(for 2.5V I/O) Input Rise and Fall Time(Measured at 20% to 80% for 3.3/2.5V I/O) Input and Output Timing Reference Levels for 3.3V I/O Input and Output Timing Reference Levels for 2.5V I/O Output Load VALUE 0 to 3.0V 0 to 2.5V 1.0V/ns 1.5V VDDQ/2 See Fig. 1 * The above parameters are also guaranteed at industrial temperature range. Output Load(B), (for tLZC, tLZOE, tHZOE & tHZC) Output Load(A) +3.3V for 3.3V I/O /+2.5V for 2.5V I/O RL=50Ω Dout Zo=50Ω 30pF* VL=1.5V for 3.3V I/O VDDQ/2 for 2.5V I/O Dout 353Ω / 1538Ω 319Ω / 1667Ω 5pF* * Including Scope and Jig Capacitance Fig. 1 - 11 - Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM AC TIMING CHARACTERISTICS PARAMETER SYMBOL -75 MIN MAX UNIT Cycle Time tCYC 7.5 - ns Clock Access Time tCD - 6.5 ns Output Enable to Data Valid tOE - 3.5 ns Clock High to Output Low-Z tLZC 2.5 - ns Output Hold from Clock High tOH 2.5 - ns Output Enable Low to Output Low-Z tLZOE 0 - ns Output Enable High to Output High-Z tHZOE - 3.5 ns Clock High to Output High-Z tHZC - 3.8 ns Clock High Pulse Width tCH 2.5 - ns Clock Low Pulse Width tCL 2.5 - ns Address Setup to Clock High tAS 1.5 - ns CKE Setup to Clock High tCES 1.5 - ns Data Setup to Clock High tDS 1.5 - ns Write Setup to Clock High (WE, BWX) tWS 1.5 - ns Address Advance Setup to Clock High tADVS 1.5 - ns Chip Select Setup to Clock High tCSS 1.5 - ns Address Hold from Clock High tAH 0.5 - ns CKE Hold from Clock High tCEH 0.5 - ns Data Hold from Clock High tDH 0.5 - ns Write Hold from Clock High (WE, BWX) tWH 0.5 - ns Address Advance Hold from Clock High tADVH 0.5 - ns Chip Select Hold from Clock High tCSH 0.5 - ns ZZ High to Power Down tPDS 2 - cycle ZZ Low to Power Up tPUS 2 - cycle Notes : 1. The above parameters are also guaranteed at industrial temperature range. 2. All address inputs must meet the specified setup and hold times for all rising clock(CLK) edges when ADV is sampled low and CS is sampled low. All other synchronous inputs must meet the specified setup and hold times whenever this device is chip selected. 3. Chip selects must be valid at each rising edge of CLK(when ADV is Low) to remain enabled. 4. A write cycle is defined by WE low having been registerd into the device at ADV Low, A Read cycle is defined by WE High with ADV Low, Both cases must meet setup and hold times. 5. To avoid bus contention, At a given vlotage and temperature tLZC is more than tHZC. The soecs as shown do not imply bus contention because tLZC is a Min. parameter that is worst case at totally different test conditions (0°C,3.465V) than tHZC, which is a Max. parameter(worst case at 70°C,3.135V) It is not possible for two SRAMs on the same board to be at such different voltage and temperatue. - 12 - Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM SLEEP MODE SLEEP MODE is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of SLEEP MODE is dictated by the length of time the ZZ is in a High state. After entering SLEEP MODE, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter SLEEP MODE. When the ZZ pin becomes a logic High, ISB2 is guaranteed after the time tZZI is met. Any operation pending when entering SLEEP MODE is not guaranteed to successful complete. Therefore, SLEEP MODE (READ or WRITE) must not be initiated until valid pending operations are completed. similarly, when exiting SLEEP MODE during tPUS, only a DESELECT or READ cycle should be given while the SRAM is transitioning out of SLEEP MODE. SLEEP MODE ELECTRICAL CHARACTERISTICS DESCRIPTION Current during SLEEP MODE CONDITIONS SYMBOL ZZ ≥ VIH ISB2 MIN ZZ active to input ignored tPDS 2 ZZ inactive to input sampled tPUS 2 ZZ active to SLEEP current tZZI ZZ inactive to exit SLEEP current tRZZI MAX UNITS TBD mA cycle cycle 2 cycle 0 SLEEP MODE WAVEFORM K tPDS ZZ setup cycle tPUS ZZ recovery cycle ZZ tZZI Isupply ISB2 tRZZI All inputs (except ZZ) Deselect or Read Only Deselect or Read Only Normal operation cycle Outputs (Q) High-Z DON′T CARE - 13 - Rev. 1.1 June 2007 - 14 - Data Out OE ADV CS WRITE Address CKE Clock A1 tLZOE tOE tADVH tCSH tWH tAH Q1-1 tHZOE A2 tCEH Q2-1 tCD tOH Q2-2 Q2-3 NOTES : WRITE = L means WE = L, and BWx = L CS = L means CS1 = L, CS2 = H and CS2 = L CS = H means CS1 = H, or CS1 = L and CS2 = H, or CS1 = L, and CS2 = L tADVS tCSS tWS tAS tCES tCL tCYC tCH Q2-4 A3 TIMING WAVEFORM OF READ CYCLE Q3-1 Q3-2 Q3-3 Q3-4 tHZC Undefined Don′t Care K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM Rev. 1.1 June 2007 - 15 - Data Out Data In OE ADV CS WRITE Address CKE Clock tHZOE D1-1 A2 tCYC D2-1 tCL D2-2 NOTES : WRITE = L means WE = L, and BWx = L CS = L means CS1 = L, CS2 = H and CS2 = L CS = H means CS1 = H, or CS1 = L and CS2 = H, or CS1 = L, and CS2 = L Q0-4 A1 tCES tCEH tCH D2-3 D2-4 A3 TIMING WAVEFORM OF WRTE CYCLE D3-1 tDS D3-2 tDH D3-3 D3-4 Undefined Don′t Care K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM Rev. 1.1 June 2007 - 16 - Data In Data Out OE ADV CS WRITE Address CKE Clock Q1 A2 tDS D2 A3 tDH Q3 A4 NOTES : WRITE = L means WE = L, and BWx = L CS = L means CS1 = L, CS2 = H and CS2 = L CS = H means CS1 = H, or CS1 = L and CS2 = H, or CS1 = L, and CS2 = L tOE tLZOE A1 tCES tCEH Q4 A5 D5 A6 Q6 A7 TIMING WAVEFORM OF SINGLE READ/WRITE tCH Q7 tCYC tCL Undefined Don′t Care K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM Rev. 1.1 June 2007 - 17 - Data In tCD tLZC A1 tCES tCEH Q1 A2 tHZC tDS D2 A3 tDH NOTES : WRITE = L means WE = L, and BWx = L CS = L means CS1 = L, CS2 = H and CS2 = L CS = H means CS1 = H, or CS1 = L and CS2 = H, or CS1 = L, and CS2 = L Data Out OE ADV CS WRITE Address CKE Clock Q3 A4 TIMING WAVEFORM OF CKE OPERATION tCH Q4 tCYC tCL A5 Undefined Don′t Care K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM Rev. 1.1 June 2007 - 18 - Data In Data Out OE ADV CS WRITE Address CKE Clock tLZOE tOE A1 tCEH Q1 A2 Q2 tHZC A3 D3 tDS tDH NOTES : WRITE = L means WE = L, and BWx = L CS = L means CS1 = L, CS2 = H and CS2 = L CS = H means CS1 = H, or CS1 = L and CS2 = H, or CS1 = L, and CS2 = L tCES tCD tLZC A4 Q4 TIMING WAVEFORM OF CS OPERATION A5 D5 tCH tCYC tCL Undefined Don′t Care K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM Rev. 1.1 June 2007 K7M323635C K7M321835C 1Mx36 & 2Mx18 Flow-Through NtRAMTM PACKAGE DIMENSIONS 100-TQFP-1420A (Lead and Lead-Free) Units ; millimeters/Inches 0~8° 22.00 ±0.30 0.127 +- 0.10 0.05 20.00 ±0.20 16.00 ±0.30 14.00 ±0.20 0.10 MAX (0.83) 0.50 ±0.10 #1 0.65 (0.58) 0.30 ±0.10 0.10 MAX 1.40 ±0.10 1.60 MAX 0.50 ±0.10 - 19 - 0.05 MIN Rev. 1.1 June 2007