TECHNICAL DATA KK4069UB Hex Inverter High-Voltage Silicon-Gate CMOS The KK4069UB types consist of six inverter circuits. These devices are intended for all general-purpose inverter applications where the mediumpower TTL-drive and logic-level-conversion capabilities of circuits such as the IW4049UB Hex Inverter/Buffers are not required. Each of the six inverters is a single stage • Operating Voltage Range: 3.0 to 18 V • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C • Noise margin (over full package temperature range): 0.5 V min @ 5.0 V supply 1.0 V min @ 10.0 V supply 1.5 V min @ 15.0 V supply ORDERING INFORMATION KK4069UBN Plastic KK4069UBD SOIC TA = -55° to 125° C for all packages LOGIC DIAGRAM PIN ASSIGNMENT FUNCTION TABLE PIN 14 =VCC PIN 7 = GND Inputs Output A Y L H H L L – LOW voltage level H – HIGH voltage level 1 KK4069UB MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +20 V -0.5 to VCC +0.5 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) IIN DC Input Current, per Pin ±10 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 500 500 mW Ptot Power Dissipation per Output Transistor 100 mW Tstg Storage Temperature -65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 12 mW/°C from 100° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Min Max Unit 3.0 18 V 0 VCC V -55 +125 °C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK4069UB DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Guaranteed Limit V ≥-55°C 25°C ≤125 °C Unit VOUT=0.5V VOUT=1.0 V VOUT=1.5V 5.0 10 15 4.0 8.0 12.5 4.0 8.0 12.5 4.0 8.0 12.5 V Maximum Low Level Input Voltage VOUT= VCC - 0.5 V VOUT= VCC - 1 V VOUT= VCC - 1.5 V 5.0 10 15 1.0 2.0 2.5 1.0 2.0 2.5 1.0 2.0 2.5 V VOH Minimum High-Level Output Voltage VIN=GND 5.0 10 15 4.95 9.95 14.95 4.95 9.95 14.95 4.95 9.95 14.95 V VOL Maximum Low-Level Output Voltage VIN= VCC 5.0 10 15 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 V IIN Maximum Input Leakage Current VIN= GND or VCC 18 ±0.1 ±0.1 ±1.0 µA ICC Maximum Quiescent Supply Current (per Package) VIN= GND or VCC 5.0 10 15 20 0.25 0.5 1.0 5.0 0.25 0.5 1.0 5.0 7.5 15 30 150 µA IOL Minimum Output Low (Sink) Current VIN= GND or VCC UOL=0.4 V UOL=0.5 V UOL=1.5 V 5.0 10 15 0.64 1.6 4.2 0.51 1.3 3.4 0.36 0.9 2.4 Minimum Output VIN= GND or VCC High (Source) Current UOH=2.5 V UOH=4.6 V UOH=9.5 V UOH=13.5 V 5.0 5.0 10 15 -2.0 -0.64 -1.6 -4.2 -1.6 -0.51 -1.3 -3.4 -1.15 -0.36 -0.9 -2.4 Symbol Parameter VIH Minimum High-Level Input Voltage VIL IOH Test Conditions mA mA 3 KK4069UB AC ELECTRICAL CHARACTERISTICS (CL=50pF, RL=200kΩ, Input tr=tf=20 ns) Guaranteed Limit VCC Symbol Parameter V ≥-55°C 25°C ≤125°C Unit tPLH, tPHL Maximum Propagation Delay, Input A to Output Y (Figure 1) 5.0 10 15 110 60 50 110 60 50 110 80 80 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figure 1) 5.0 10 15 200 100 80 200 100 80 200 100 80 ns CIN Maximum Input Capacitance - 15 pF Figure 1. Switching Waveforms EXPANDED LOGIC DIAGRAM (1/6 of the Device) 4 KK4069UB N SUFFIX PLASTIC DIP (MS - 001AA) A Dimension, mm 8 14 B 7 1 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE N G M K J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AB) Dimension, mm A 14 8 H B 1 G P 7 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 8.55 8.75 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.27 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 5