05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ 200W LOW CAPACITANCE flip chip tvs array Description The LC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the LC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. Features applications • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Available in Voltages Ranging from 3.3V to 36V • 200 Watts Peak Pulse Power per Line (tp = 8/20µs) • Bidirectional and Monolithic Structure • Low Clamping Voltage • Low Capacitance • Low Leakage Current • Protection for 1 Line • RoHS Compliant • REACH Compliant • SMART Phones • Portable Electronics • SMART Cards Mechanical characteristics • Standard EIA Chip Size: 0402 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Solder Reflow Temperature: • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C • Flammability Rating UL 94V-0 • 8mm Tape per EIA Standard 481 • Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION 05139.R8 2/11 Page 1 www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ typical device characteristics MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SYMBOL VALUE UNITS PPP 200 Watts TA -55 to 150 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ IP = 1A VC VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. 2) V WM VOLTS @ 1mA V(BR) VOLTS LC0402FC3.3C 3.3 4.0 7.0 12.5V @ 16A 75* 70 LC0402FC05C 5.9 6.0 11.0 13.0V @ 15A 10** 35 LC0402FC08C 8.0 8.5 13.2 18.0V @ 11A 1 32 LC0402FC12C 12.0 13.3 19.8 26.9V @ 7.4A 1 30 LC0402FC15C 15.0 16.7 25.4 34.5V @ 5.8A 1 25 LC0402FC24C 24.0 26.7 37.2 50.6V @ 4A 1 20 LC0402FC36C 36.0 40.0 70.0 80.0V @ 2.5A 1 18 @ 8/20µs VC @ IPP MAXIMUM LEAKAGE CURRENT (Note 2) @V WM ID µA TYPICAL CAPACITANCE @0V, 1MHz C pF notes 1. All devices are bidirectional. Electrical characteristics apply in both directions. 2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. 05139.R8 2/11 Page 2 www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ typical device characteristics figure 1 peak pulse power vs pulse time PPP - Peak Pulse Power - Watts 10,000 1,000 200W, 8/20µs Waveform 100 10 0.1 10 100 td - Pulse Duration - µs Peak Value IPP 80 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs e-t 60 40 10,000 figure 3 power derating curve Peak Pulse Power 8/20µs 80 % Of Rated Power tf 100 td = t/(IPP/2) 60 40 20 20 0 1,000 figure 2 pulse wave form 120 IPP - Peak Pulse Current - % of IPP 1 0 05139.R8 2/11 5 10 15 t - Time - µs 20 25 0 30 Page 3 Average Power 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ typical device characteristics figure 4 overshoot & clamping voltage for LC0402fc05c 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) figure 5 typical clamping voltage vs peak pulse current LC0402fc05c VC - Clamping Voltage - Volts 12 8 4 0 0 05139.R8 2/11 5 10 IPP - Peak Pulse Current - Amps Page 4 15 20 www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ spice model figure 1 spice model for I/O ABD ABD GND ABD - Avalanche Breakdown Diode (TVS) table 1 - spice parameters PART NUMBER 05139.R8 2/11 parameter unit abd(tvs) BV V See Table 2 IBV µA 1 Cjo pF See Table 2 IS A See Table 2 Vj V 0.6 M - 0.33 N - 1 RS - See Table 2 TT s 1E-8 EG eV 1.11 table 2 - abd specific spice parameters i s (amps) bv(volts) cjo(pF) rs(ohms) LC0402FC3.3C 4.0 70 1E-11 0.20 LC0402FC05C 6.0 35 1E-11 0.16 LC0402FC08C 8.5 32 1E-13 0.33 LC0402FC12C 13.3 30 1E-13 0.51 LC0402FC15C 16.7 25 1E-13 0.53 LC0402FC24C 26.7 20 1E-13 0.63 LC0402FC36C 40.2 18 1E-13 0.73 Page 5 www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ SOLDER REFLOW INFORMATION printed circuit board recommendations parameter value Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C Requirements recommended non-solder mask defined pad illustration Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Solder Melt (Maximum Temp) Temperature - °C Ramp-Up Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds 05139.R8 2/11 Ramp-Up 15 seconds (Minimize) Page 6 Solder-Time 15-20 seconds Ramp-Down www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ 0402 package information outline dimensions max inches min max A 0.46 0.018 B 0.86 0.034 C 0.98 1.02 0.038 D 0.10 0.004 E 0.35 0.014 F 0.458 G H 0.508 0.018 0.20 0.076 I TOP 0.040 A B C 0.020 0.008 0.127 0.003 0.406 0.005 D 0.016 E F Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Maximum chip size: 1.02mm (0.040”) by 0.51mm (0.020”). END H I layout dimensions inches nominal nominal A 0.23 0.009 B 0.48 0.019 C 0.69 0.027 D 0.46 0.018 E 0.99 0.039 F 0.20 0.008 G 0.20 0.008 H 0.66 0.026 I 0.13 0.005 C B D A SOLDER PAD millimeters dim SIDE millimeters min G dim DIE SOLDER BUMP F H E I Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 05139.R8 2/11 SOLDER PRINT DIAMETER 0.010” - 0.012” Page 7 G www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ TAPE AND REEL information P0 D T 10 Pitches Cumulative Tolerance on tape ± 0.2 E P2 Top Cover Tape F A0 K0 W B0 P User Direction of Feed specifications Reel Dia. Tape Width 178(7”) 8 A0 B0 K0 D E F P0 P2 P tmax 0.70 ± 0.05 1.15 ± 0.10 0.56 ± 0.05 1.55 ± 0.05 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 Notes 1. 2. 3. 4. 5. 6. W 0.25 tape & reel orientation Dimensions in millimeters. Top view of tape. Metal contacts are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000 (pocket under hole skipped) or 10,000 pieces per reel. Marking on Reel - part number, date code and lot number. Single Die - 0402 Package outline, pad layout and tape specifications per document number 06001.R5 8/10. ORDERING INFORMATION base PART NUMBER (xx = voltage) LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE qty LC0402FCxxC -LF -T75-1 5,000 7” n/a LC0402FCxxC -LF -T710-1 10,000 7” n/a 05139.R8 2/11 Page 8 www.protekdevices.com 05139 LC0402FC3.3C - LC0402FC36C Only One Name Means ProTek’Tion™ company information COMPANY PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] Web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05139.R8 2/11 Page 9 www.protekdevices.com