LP621024D-I Series Preliminary 128K X 8 BIT CMOS SRAM Document Title 128K X 8 BIT CMOS SRAM Revision History Rev. No. 0.0 PRELIMINARY History Issue Date Remark Initial issue August 9, 2002 Preliminary (August, 2002, Version 0.0) 1 AMIC Technology, Inc. LP621024D-I Series Preliminary 128K X 8 BIT CMOS SRAM Features General Description n Single +5V power supply n Access times: 55/70 ns (max.) n Current: Very low power version: Operating: 70mA (max.) Standby: 50µA (max.) n Full static operation, no clock or refreshing required n All inputs and outputs are directly TTL-compatible n Common I/O using three-state output n Output enable and two chip enable inputs for easy application n Data retention voltage: 2V (min.) n Available in 32-pin DIP, SOP TSOP and TSSOP (8 X 13.4mm) packages The LP621024D-I is a low operating current 1,048,576-bit static random access memory organized as 131,072 words by 8 bits and operates on a single 5V power supply. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Two chip enable inputs are provided for POWER-DOWN and device enable and an output enable input is included for easy interfacing. Data retention is guaranteed at a power supply voltage as low as 2V. Product Family Power Dissipation Product Family Operating Temperature VCC Range Speed Data Retention (ICCDR, Typ.) Standby (ISB1, Typ.) Operating (ICC2, Typ.) LP62S1024D -40°C ~ +85°C 4.5V~5.5V 55ns / 70ns 0.5µA 2µA 10mA Package Type 32L DIP/ SOP/TSOP/ TSSOP 1. Typical values are measured at VCC = 5.0V, TA = 25°C and not 100% tested. 2. Data retention current VCC = 2.0V. Pin Configurations n DIP n SOP n TSOP/(TSSOP) VCC NC 1 32 VCC 31 A15 A16 2 31 A15 A14 3 30 CE2 A14 3 30 CE2 A12 4 29 WE A12 4 29 WE A7 5 28 A13 A7 5 28 A13 A6 6 27 A8 A6 6 27 A8 A5 7 26 A9 A5 7 26 A9 A4 8 25 A11 A4 8 A3 9 24 OE A3 9 A2 10 23 A10 A2 10 A1 11 22 CE1 A1 11 25 A11 24 OE 23 A10 22 CE1 A0 12 21 I/O8 A0 12 21 I/O8 I/O1 13 20 I/O7 I/O1 13 20 I/O7 I/O2 14 19 I/O6 I/O2 14 19 I/O6 I/O3 15 18 I/O5 I/O3 15 18 I/O5 GND 16 17 I/O4 GND 16 17 I/O4 16 (August, 2002, Version 0.0) 32 17 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name A11 A9 A8 A13 WE CE2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 Pin No. 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 I/O2 I/O3 GND I/O4 I/O5 I/O6 I/O7 I/O8 CE1 A10 OE Pin Name PRELIMINARY 1 LP621024DV-I (LP621024DX-I) 32 2 LP621024DM-I 1 LP621024D-I NC A16 A3 2 A2 A1 A0 I/O1 AMIC Technology, Inc. LP621024D-I Series Block Diagram A0 VCC GND ROW 512 X 2048 DECODER MEMORY ARRAY INPUT DATA CIRCUIT COLUMN I/O A14 A15 A16 I/O1 I/O8 CE2 CE1 CONTROL CIRCUIT OE WE Pin Description - TSOP/TSSOP Pin Descriptions - DIP/SOP Pin No. Symbol No Connection 1 - 4, 7, 10 - 20, 31 A0 - A16 A0 - A16 Address Inputs 5 WE Write Enable 13 - 15, 17 - 21 I/O1 - I/O8 Data Input/Outputs 6 CE2 Chip Enable 16 GND Ground 8 VCC Power Supply 22 Chip Enable 9 NC No Connection CE1 24 OE Output Enable 21 - 23, 25 - 29 I/O1 - I/O8 29 WE Write Enable 24 GND Ground 30 CE2 Chip Enable 30 CE1 Chip Enable 32 VCC Power Supply (+5V) 32 OE Output Enable Pin No. Symbol 1 NC 2 - 12, 23, 25 - 28, 31 PRELIMINARY Description (August, 2002, Version 0.0) 3 Description Address Inputs Data Input/Outputs AMIC Technology, Inc. LP621024D-I Series Recommended DC Operating Conditions (TA = -40°C to + 85°C) Symbol Parameter Supply Voltage GND Ground Min. Typ. Max. Unit 4.5 5.0 5.5 V 0 0 0 V VIH Input High Voltage 2.2 3.5 VCC + 0.3 V VIL Input Low Voltage -0.3 0 +0.8 V CL Output Load - - 30 pF TTL Output Load - - 1 - Absolute Maximum Ratings* *Comments VCC to GND ............................................. -0.5V to + 7.0V IN, IN/OUT Volt to GND ....................-0.5V to VCC + 0.5V Operating Temperature, Topr .................. -40°C to + 85°C Storage Temperature, Tstg.................... -55°C to + 125°C Temperature Under Bias, Tbias............... -10°C to + 85°C Power Dissipation, PT ....................................................................... 0.7W Soldering Temp. & Time .............................260°C, 10 sec Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics Symbol Parameter (TA = -40°C to + 85°C, VCC = 5V ± 10%, GND = 0V) LP621024D-55LLI LP621024D-70LLI Min. Max. Min. Max. Unit Conditions ILI Input Leakage Current - 1 - 1 µA VIN = GND to VCC ILO Output Leakage Current - 1 - 1 µA CE1 = VIH or CE2 = VIL or OE = VIH or WE = VIL VI/O = GND to VCC ICC Active Power Supply Current - 15 - 15 mA CE1 = VIL, CE2 = VIH II/O = 0mA ICC1 Dynamic Operating Current ICC2 PRELIMINARY - 70 - 70 mA Min. Cycle, Duty = 100% CE1 = VIL, CE2 = VIH II/O = 0mA - 15 - 15 mA CE1 = VIL, CE2 = VIH VIH = VCC, VIL = 0V f = 1MHZ, II/O = 0mA (August, 2002, Version 0.0) 4 AMIC Technology, Inc. LP621024D-I Series DC Electrical Characteristics (continued) Symbol LP621024D-55LLI Parameter Unit Conditions Min. Max. Min. Max. - 2 - 2 mA CE1 = VIH or CE2 =VIL - 50 - 50 µA CE1 ≥ VCC - 0.2V CE2 ≥ VCC - 0.2V VIN ≥ 0V - 50 - 50 µA CE2 ≤ 0.2V VIN ≥ 0V ISB ISB1 LP621024D-70LLI Standby Power Supply Current ISB2 VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1mA VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0mA Truth Table Mode CE1 CE2 OE WE I/O Operation H X X X High Z ISB, ISB1 X L X X High Z ISB, ISB2 Output Disable L H H H High Z ICC, ICC1, ICC2 Read L H L H DOUT ICC, ICC1, ICC2 Write L H X L DIN ICC, ICC1, ICC2 Min. Max. Unit Standby Supply Current Note: X = H or L Capacitance (TA = 25°C, f = 1.0MHz) Symbol Parameter Conditions CIN* Input Capacitance 6 pF VIN = 0V CI/O* Input/Output Capacitance 8 pF VI/O = 0V * These parameters are sampled and not 100% tested. PRELIMINARY (August, 2002, Version 0.0) 5 AMIC Technology, Inc. LP621024D-I Series AC Characteristics (TA = -40°C to + 85°C, VCC = 5V ± 10%) Symbol LP621024D-55LLI LP621024D-70LLI Min. Max. Min. Max. 55 - 70 - ns - 55 - 70 ns CE1 - 55 - 70 ns CE2 - 55 - 70 ns - 30 - 35 ns CE1 10 - 10 - ns CE2 10 - 10 - ns 5 - 5 - ns CE1 0 20 0 25 ns CE2 0 20 0 25 ns Parameter Unit Read Cycle tRC Read Cycle Time tAA Address Access Time tACE1 Chip Enable Access Time tACE2 tOE tCLZ1 Output Enable to Output Valid Chip Enable to Output in Low Z tCLZ2 tOLZ tCHZ1 Output Enable to Output in Low Z Chip Disable to Output in High Z tCHZ2 tOHZ Output Disable to Output in High Z 0 20 0 25 ns tOH Output Hold from Address Change 5 - 5 - ns tWC Write Cycle Time 55 - 70 - ns tCW Chip Enable to End of Write 50 - 60 - ns tAS Address Setup Time 0 - 0 - ns tAW Address Valid to End of Write 50 - 60 - ns tWP Write Pulse Width 40 - 50 - ns tWR Write Recovery Time 0 - 0 - ns tWHZ Write to Output in High Z 0 25 0 30 ns tDW Data to Write Time Overlap 25 - 30 - ns tDH Data Hold from Write Time 0 - 0 - ns tOW Output Active from End of Write 5 - 5 - ns Write Cycle Notes: tCHZ1, tCHZ2, tOHZ, and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. PRELIMINARY (August, 2002, Version 0.0) 6 AMIC Technology, Inc. LP621024D-I Series Timing Waveforms (1, 2, 4) Read Cycle 1 tRC Address tAA tOH tOH DOUT Read Cycle 2 (1, 3, 4, 6) CE1 tACE1 tCLZ15 tCHZ15 DOUT Read Cycle 3 (1, 4, 7, 8) CE2 tACE2 tCHZ25 tCLZ25 DOUT PRELIMINARY (August, 2002, Version 0.0) 7 AMIC Technology, Inc. LP621024D-I Series Timing Waveforms (continued) Read Cycle 4 (1) tRC Address tAA OE tOE tOH tOLZ5 CE1 tACE1 tCHZ15 tCLZ15 CE2 tACE2 tOHZ 5 tCHZ25 tCLZ25 DOUT Notes: 1. 2. 3. 4. 5. 6. 7. 8. WE is high for Read Cycle. Device is continuously enabled CE1 = VIL and CE2 = VIH. Address valid prior to or coincident with CE1 transition low. OE = VIL. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. CE2 is high. CE1 is low. Address valid prior to or coincident with CE2 transition high. PRELIMINARY (August, 2002, Version 0.0) 8 AMIC Technology, Inc. LP621024D-I Series Timing Waveforms (continued) (6) Write Cycle 1 (Write Enable Controlled) tWC Address tAW tWR3 tCW CE1 (4) CE2 (4) 5 tAS1 tWP2 WE tDW tDH DIN tWHZ tOW DOUT PRELIMINARY (August, 2002, Version 0.0) 9 AMIC Technology, Inc. LP621024D-I Series Timing Waveforms (continued) Write Cycle 2 (Chip Enable Controlled) tWC Address tWR3 tAW tCW5 CE1 tAS1 CE2 (4) (4) tCW5 tWP2 WE tDW tDH DIN tWHZ7 DOUT Notes: 1. 2. 3. 4. tAS is measured from the address valid to the beginning of Write. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE . tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after the WE transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write. 6. OE is continuously low. ( OE = VIL) 7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. PRELIMINARY (August, 2002, Version 0.0) 10 AMIC Technology, Inc. LP621024D-I Series AC Test Conditions Input Pulse Levels 0V to 3.0V Input Rise and Fall Time 5 ns Input and Output Timing Reference Levels 1.5V Output Load See Figures 1 and 2 +5V +5V 1800Ω 1800Ω I/O I/O 30pF* 990Ω 5pF* 990Ω * Including scope and jig. * Including scope and jig. Figure 1. Output Load Figure 2. Output Load for tCLZ1, tCLZ2, tOHZ, tOLZ, tCHZ1, tCHZ2, tWHZ, and tOW Data Retention Characteristics (TA = -40°C to 85°C) Symbol Parameter VDR1 VDR2 VCC for Data Retention Min. Max. Unit 2.0 5.5 V CE1 ≥ VCC - 0.2V 2.0 5.5 V CE2 ≤ 0.2V CE1 ≥ VCC - 0.2V or CE1 ≤ 0.2V LL-Version - 20** µA VCC = 2.0V, CE1 ≥ VCC - 0.2V CE2 ≥ VCC - 0.2V VIN ≥ 0V LL-Version - 20** µA VCC = 2.0V CE2 ≤ 0.2V VIN ≥ 0V Chip Disable to Data Retention Time 0 - ns See Retention Waveform Operation Recovery Time 5 - ms ICCDR1 Data Retention Current ICCDR2 tCDR tR Conditions ** LP621024D-55LLI/70LLI PRELIMINARY ICCDR: Max. (August, 2002, Version 0.0) 2µA at TA = 0°C to + 40 °C 11 AMIC Technology, Inc. LP621024D-I Series Low VCC Data Retention Waveform (1) ( CE1 Controlled) DATA RETENTION MODE VCC 4.5V tCDR CE1 4.5V tR VDR ≥ 2V VIH VIH CE1 ≥ VDR - 0.2V Low VCC Data Retention Waveform (2) (CE2 Controlled) DATA RETENTION MODE VCC 4.5V tCDR CE2 4.5V tR VDR ≥ 2V VIL VIL CE2 < 0.2V PRELIMINARY (August, 2002, Version 0.0) 12 AMIC Technology, Inc. LP621024D-I Series Ordering Information Operating Current Max. (mA) Standby Current Max. (µ µA) 70 50 32L DIP 70 50 32L SOP LP621024DV-55LLI 70 50 32L TSOP LP621024DX-55LLI 70 50 32L TSSOP LP621024D-70LLI 70 50 32L DIP 70 50 32L SOP LP621024DV-70LLI 70 50 32L TSOP LP621024DX-70LLI 70 50 32L TSSOP Part No. Access Time (ns) LP621024D-55LLI LP621024DM-55LLI LP621024DM-70LLI PRELIMINARY 55 70 (August, 2002, Version 0.0) 13 Package AMIC Technology, Inc. LP621024D-I Series Package Information P-DIP 32L Outline Dimensions unit: inches/mm D 17 E1 32 1 16 E A1 A2 Base Plane Seating Plane L A C S B α e1 B1 Symbol Dimensions in inches Dimensions in mm A 0.210 Max. 5.33 Max. eA A1 0.010 Min. 0.25 Min. A2 0.155±0.010 3.94±0.25 B 0.018 +0.004 -0.002 0.46 +0.10 -0.05 B1 0.050 +0.004 -0.002 1.27 +0.10 -0.05 C 0.010 +0.004 -0.002 0.25 +0.11 -0.05 D 1.650 Typ. (1.670 Max.) 41.91 Typ. (42.42 Max.) E 0.600±0.010 15.24±0.25 E1 0.550 Typ. (0.562 Max.) 13.97 Typ. (14.27 Max.) e1 0.100±0.010 2.54±0.25 L 0.130±0.010 3.30±0.25 α 0° ~ 15° 0° ~ 15° eA 0.655±0.035 16.64±0.89 S 0.090 Max. 2.29 Max. Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E1 does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (August, 2002, Version 0.0) 14 AMIC Technology, Inc. LP621024D-I Series Package Information SOP (W.B.) 32L Outline Dimensions 32 unit: inches/mm 17 e1 E HE ~ L 1 b 16 Detail F e1 D Seating Plane LE A1 e s A A2 c D y See Detail F Symbol Dimensions in inches Dimensions in mm A 0.118 Max. 3.00 Max. A1 0.004 Min. 0.10 Min. A2 0.106±0.005 2.69±0.13 b 0.016 +0.004 0.41 +0.10 -0.002 -0.05 0.008 +0.004 0.20 +0.10 c -0.002 D -0.05 0.805 Typ. (0.820 Max.) 20.45 Typ. (20.83 Max.) E 0.445±0.010 11.30±0.25 e 0.050 ±0.006 1.27±0.15 e1 0.525 NOM. 13.34 NOM. HE 0.556±0.010 14.12±0.25 L 0.031±0.008 0.79±0.20 LE 0.055±0.008 1.40±0.20 S 0.044 Max. 1.12 Max. y 0.004 Max. 0.10 Max. θ 0° ~ 10° 0° ~ 10° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. PRELIMINARY (August, 2002, Version 0.0) 15 AMIC Technology, Inc. LP621024D-I Series Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm e D A c E A2 12.0° A1 GAUGE PLANE 0.25 BSC θ L LE HD Detail "A" D Detail "A" y S Symbol Dimensions in inches Dimensions in mm A 0.047 Max. 1.20 Max. A1 0.004±0.002 0.10±0.05 A2 0.039±0.002 1.00±0.05 b 0.008±0.001 0.20±0.03 c 0.006±0.001 0.15±0.02 D 0.724±0.004 18.40±0.10 E 0.315±0.004 8.00±0.10 e 0.020 TYP. 0.50 TYP. HD 0.787±0.007 20.00±0.20 L 0.020±0.004 0.50±0.10 LE 0.031 TYP. 0.80 TYP. S 0.0167 TYP. 0.425 TYP. Y 0.004 Max. 0.10 Max. θ 0° ~ 6° 0° ~ 6° b 0.10(0.004) M Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. PRELIMINARY (August, 2002, Version 0.0) 16 AMIC Technology, Inc. LP621024D-I Series Package Information TSSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions e unit: inches/mm A c E A2 12.0° A1 GAUGE PLANE 0.25 BSC θ L LE D1 D Detail "A" D Detail "A" 0.10MM S b SEATING PLANE Symbol Dimensions in inches Dimensions in mm A 0.049 Max. 1.25 Max. A1 0.002 Min. 0.05 Min. A2 0.039±0.002 1.00±0.05 b 0.008±0.001 0.20±0.03 c 0.006±0.0003 0.15±0.008 E 0.315±0.004 8.00±0.10 e 0.020 TYP. 0.50 TYP. D 0.528±0.008 13.40±0.20 D1 0.465±0.004 11.80±0.10 L 0.02±0.008 0.50±0.20 LE 0.0266 Min. 0.675 Min. S 0.0109 TYP. 0.278 TYP. y 0.004 Max. 0.10 Max. θ 0° ~ 6° 0° ~ 6° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. PRELIMINARY (August, 2002, Version 0.0) 17 AMIC Technology, Inc.