SAMTEC LTH-010-01-G-D-A

LSH–030–01–G–D–A
F-213
LSH–050–01–G–D–A
LSH–010–01–G–D–A
LTH–010–01–G–D–A
(0,50 mm) .0197"
LTH–030–01–G–D–A
LTH–050–01–G–D–A
LTH, LSH SERIES
LOW PROFILE BLADE AND BEAM
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?LTH or
www.samtec.com?LSH
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Contact Material:
BeCu
Plating:
Au over 50µ" (1,27 µm) Ni
Current Rating:
1.5A per contact
@ 80°C ambient
Operating Temp Range:
-55°C to +125°C
RoHS Compliant:
Yes
NO. OF POSITIONS
PER ROW
LTH
01
PLATING
OPTION
D
OTHER
OPTION
A
Mates with: LSH
–K
–G
–010, –020, –030, –040, –050
= (5,50 mm) .217" DIA
Polyimide Film
Pick & Place Pad
= 10µ" (0,25 µm)
Gold
(No. of positions per row +2)
x (0,50) .01969 + (2,79) .110
(1,91)
.075
–TR
(0,76)
.030
01
= Tape and Reel
(1,27)
.050
(4,80)
.189
02
Processing:
Lead-Free Solderable:
No
SMT Lead Coplanarity:
(0,10 mm) .004" max
Board Stacking:
For applications requiring more
than two connectors per board,
contact [email protected]
(0,50)
.01969
(0,20)
.008
(0,76)
.030
(1,68)
.066
(1,55)
.061
(0,76)
.030
DIA
(No. of positions per row +2)
x (0,50) .01969 + (1,27) .050
(5,05)
.199
MATED HEIGHT
LEAD
STYLE
MATED
HEIGHT*
–01
(2,31) .091
*Processing conditions will
affect mated height.
NO. OF POSITIONS
PER ROW
LSH
01
PLATING
OPTION
D
A
OTHER
OPTION
Mates with: LTH
–G
–010, –020, –030, –040, –050
= 10µ" (0,25 µm)
Gold
(No. of positions per row + 2)
x (0,50) .01969 + (4,06) .160
(0,74)
.029
02
–TR
= Tape and Reel
(1,22)
.048
(6,50)
.256
01
Note: Samtec recommends
right-side-up, single-pass
63/37 Tin/Lead reflow
soldering for these connectors.
This product is not compatible
with lead-free reflow soldering.
Note: Some lengths,
styles and options are
non-standard, non-returnable.
(0,50)
.01969
(0,15)
.006
(1,91)
.075
(0,76)
.030
(No. of positions per row + 2)
x (0,50) .01969 + (1,91) .075
–K
= (7,50 mm) .295" DIA
Polyimide Film Pick &
Place Pad
(0,76)
.030
DIA
WWW.SAMTEC.COM
(6,73)
.265