24AA64F/24LC64F/24FC64F
64K I2C™ Serial EEPROM with Quarter-Array Write-Protect
Device Selection Table
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA64F
1.7-5.5
400 kHz(1)
I
24LC64F
2.5-5.5
400 kHz
I, E
24FC64F
1.7-5.5
1 MHz(2)
I
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24AA64F/24LC64F/
24FC64F (24XX64F*) is a 64 Kbit Electrically Erasable
PROM. The device is organized as a single block of
8K x 8-bit memory with a 2-wire serial interface. Lowvoltage design permits operation down to 1.7V, with
standby and read currents of only 1 A and 400 A,
respectively. It has been developed for advanced, lowpower applications such as personal communications
or data acquisition. The 24XX64F also has a page
write capability for up to 32 bytes of data. Functional
address lines allow up to eight devices on the same
bus, for up to 512 Kbits address space. The 24XX64F
is available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, TDFN and MSOP packages. The
24XX64F is also available in the 5-lead SOT-23
package.
100 kHz for VCC <2.5V.
400 kHz for VCC <2.5V.
Note 1:
2:
Features:
• Single-Supply with Operation down to 1.7V for
24AA64F/24FC64F Devices, 2.5V for 24LC64F
Devices
• Low-Power CMOS Technology:
- Read current 400 A, max.
- Standby current 1 A, max. (I-temp)
• 2-Wire Serial Interface, I2C™ Compatible
• Packages with Three Address Pins are
Cascadable up to Eight Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• 1 MHz Clock for FC Versions
• Page Write Time 5 ms, typical
• Self-timed Erase/Write Cycle
• 32-Byte Page Write Buffer
• Hardware Write-Protect for 1/4 Array
(1800h-1FFFh)
• ESD Protection > 4,000V
• More than One Million Erase/Write Cycles
• Data Retention > 200 Years
• Factory Programming Available
• Packages include 8-Lead PDIP, SOIC, TSSOP,
MSOP, TDFN, 5-Lead SOT-23
• Pb-Free and RoHS Compliant
Block Diagram
HV
Generator
A0 A1 A2 WP
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SCL
YDEC
SDA
VCC
VSS
Sense Amp.
R/W Control
Package Types
PDIP/MSOP/SOIC/TSSOP
A0
1
8
VCC
A1
2
7
WP
A2
3
6
SCL
SCL
VSS
SDA
VSS
4
5
TDFN
SOT-23
1
5
WP
A1 2
2
3
A0 1
4
VCC
A2 3
VSS 4
8 VCC
7 WP
6 SCL
5 SDA
SDA
*24XX64F is used in this document as a generic part number for the 24AA64F/24LC64F/24FC64F devices.
2009-2012 Microchip Technology Inc.
DS22154B-page 1
24AA64F/24LC64F/24FC64F
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Min.
Typ.
Max.
Units
Conditions
—
—
—
—
—
—
A0, A1, A2, WP, SCL
and SDA pins
D1
VIH
High-level input voltage
0.7 VCC
—
—
V
—
D2
VIL
Low-level input voltage
—
—
0.3 VCC
0.2 VCC
V
V
VCC 2.5V
VCC 2.5V
D3
VHYS
Hysteresis of Schmitt
Trigger inputs (SDA,
SCL pins)
0.05 VCC
—
—
V
VCC 2.5V (Note 1)
D4
VOL
Low-level output voltage
—
—
0.40
V
IOL = 3.0 mA @ VCC = 4.5V
IOL = 2.1 mA @ VCC = 2.5V
D5
ILI
Input leakage current
—
—
±1
A
VIN = VSS or VCC
D6
ILO
Output leakage current
—
—
±1
A
VOUT = VSS or VCC
D7
CIN,
COUT
Pin capacitance
(all inputs/outputs)
—
—
10
pF
VCC = 5.0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Operating current
—
0.1
3
mA
VCC = 5.5V, SCL = 400 kHz
—
0.05
400
A
—
—
.01
—
1
5
A
A
D9
ICC read
D10
ICCS
Note 1:
2:
Standby current
Industrial
Automotive
SDA = SCL = VCC
A0, A1, A2, WP = VSS
This parameter is periodically sampled and not 100% tested.
Typical measurements taken at room temperature.
DS22154B-page 2
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
TABLE 1-2:
AC CHARACTERISTICS
Electrical Characteristics:
Industrial (I):
VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
AC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Min.
Max.
Units
Conditions
1
FCLK
Clock frequency
—
—
—
—
100
400
400
1000
kHz
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
2
THIGH
Clock high time
4000
600
600
500
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
3
TLOW
Clock low time
4700
1300
1300
500
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
4
TR
SDA and SCL rise time
(Note 1)
—
—
—
1000
300
300
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC64F
5
TF
SDA and SCL fall time
(Note 1)
—
—
300
100
ns
All except, 24FC64F
1.7V VCC 5.5V 24FC64F
6
THD:STA Start condition hold time
4000
600
600
250
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
7
TSU:STA
4700
600
600
250
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
Start condition setup time
8
THD:DAT Data input hold time
0
—
ns
(Note 2)
9
TSU:DAT Data input setup time
250
100
100
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC64F
10
TSU:STO Stop condition setup time
4000
600
600
250
—
—
—
—
ns
1.7 V VCC 2.5V
2.5 V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5 V VCC 5.5V 24FC64F
11
TSU:WP
WP setup time
4000
600
600
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC64F
12
THD:WP
WP hold time
4700
1300
1300
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC64F
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site
at www.microchip.com.
2009-2012 Microchip Technology Inc.
DS22154B-page 3
24AA64F/24LC64F/24FC64F
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Electrical Characteristics:
Industrial (I):
VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C
AC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Min.
Max.
Units
Conditions
—
—
—
—
3500
900
900
400
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
4700
1300
1300
500
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC64F
2.5V VCC 5.5V 24FC64F
10 + 0.1CB
250
250
ns
All except, 24FC64F (Note 1)
24FC64F (Note 1)
13
TAA
Output valid from clock
(Note 2)
14
TBUF
Bus free time: Time the bus
must be free before a new
transmission can start
15
TOF
Output fall time from VIH
minimum to VIL maximum
CB 100 pF
16
TSP
Input filter spike suppression
(SDA and SCL pins)
—
50
ns
All except, 24FC64F (Notes 1
and 3)
17
TWC
Write cycle time (byte or
page)
—
5
ms
—
1,000,000
—
18
—
Endurance
Note 1: Not 100% tested.
CB
cycles Page Mode 25°C, 5.5V (Note 4)
= total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site
at www.microchip.com.
FIGURE 1-3:
BUS TIMING DATA
5
SCL
SDA
IN
7
3
4
D3
2
8
10
9
6
16
14
13
SDA
OUT
WP
DS22154B-page 4
(protected)
(unprotected)
11
12
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
2.0
PIN DESCRIPTIONS
TABLE 2-1:
The descriptions of the pins are listed in Table 2-1.
PIN FUNCTION TABLE
Name
PDIP
SOIC
TSSOP
TDFN
MSOP
SOT-23
A0
1
1
1
1
1
—
Chip Address Input
A1
2
2
2
2
2
—
Chip Address Input
2.1
A2
3
3
3
3
3
—
Chip Address Input
VSS
4
4
4
4
4
2
Ground
SDA
5
5
5
5
5
3
Serial Address/Data I/O
SCL
6
6
6
6
6
1
Serial Clock
WP
7
7
7
7
7
5
Write-Protect Input
VCC
8
8
8
8
8
4
+1.7V to 5.5V Power Supply
A0, A1, A2 Chip Address Inputs
The A0, A1 and A2 inputs are used by the 24XX64F for
multiple device operation. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the compare is true.
Up to eight devices may be connected to the same bus
by using different Chip Select bit combinations. These
inputs must be connected to either VCC or VSS.
In most applications, the chip address inputs A0, A1
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed. Address
pins are not available in the SOT-23 package.
2.2
Description
Serial Data (SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 k for 100 kHz, 2 kfor 400 kHz).
2.3
Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
from and to the device.
2.4
Write-Protect (WP)
This pin must be connected to either VSS or VCC. If tied
to VSS, write operations are enabled. If tied to VCC,
write operations are inhibited for upper 1/4 of the array
(1800h-1FFFh), but read operations are not affected.
3.0
FUNCTIONAL DESCRIPTION
The 24XX64F supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX64F works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2009-2012 Microchip Technology Inc.
DS22154B-page 5
24AA64F/24LC64F/24FC64F
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last thirty two will be stored
when doing a write operation). When an overwrite does
occur, it will replace data in a first-in first-out (FIFO)
fashion.
4.1
4.5
Bus Not Busy (A)
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
(A)
Acknowledge
Note:
The 24XX64F does not generate any
Acknowledge bits
if an internal
programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX64F) will leave the data
line high to enable the master to generate the Stop
condition.
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(D)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SCL
SDA
DS22154B-page 6
Data
Allowed
to Change
Stop
Condition
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
5.0
DEVICE ADDRESSING
FIGURE 5-1:
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24XX64F, this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the Chip Select bits (A2, A1, A0). The Chip Select
bits allow the use of up to eight 24XX64F devices on
the same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond. These bits
are, in effect, the three Most Significant bits of the word
address.
For the SOT-23 package, the address pins are not
available. During device addressing, the A2, A1 and A0
Chip Select bits (Figure 5-2) should be set to ‘0’.
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’, a read operation is
selected. When set to a ‘0’, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 5-2). Because
only A12...A0 are used, the upper-three address bits
are “don’t care” bits. The upper-address bits are
transferred first, followed by the Less Significant bits.
CONTROL BYTE FORMAT
Read/Write Bit
Chip Select
Bits
Control Code
S
1
0
1
0
A2
A1
A0 R/W ACK
Slave Address
Start Bit
5.1
Acknowledge Bit
Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 512K
bits by adding up to eight 24XX64F devices on the
same bus. In this case, software can use A0 of the control byte as address bit A13; A1 as address bit A14; and
A2 as address bit A15. It is not possible to sequentially
read across device boundaries.
The SOT-23 package does not support multiple device
addressing on the same bus.
Following the Start condition, the 24XX64F monitors
the SDA bus, checking the device-type identifier being
transmitted. Upon receiving a ‘1010’ code and appropriate device-select bits, the slave device outputs an
Acknowledge signal on the SDA line. Depending on the
state of the R/W bit, the 24XX64F will select a read or
write operation.
FIGURE 5-2:
ADDRESS SEQUENCE BIT ASSIGNMENTS
Control Byte
1
0
1
Control
Code
0
A
2
A
1
Address High Byte
A
0 R/W
Chip
Select
bits
2009-2012 Microchip Technology Inc.
x
x
x
A A A
12 11 10
Address Low Byte
A
9
A
8
A
7
•
•
•
•
•
•
A
0
x = “don’t care” bit
DS22154B-page 7
24AA64F/24LC64F/24FC64F
6.0
WRITE OPERATIONS
6.1
Byte Write
Following the Start condition from the master, the
control code (four bits), the Chip Select (three bits) and
the R/W bit (which is a logic low) are clocked onto the
bus by the master transmitter. This indicates to the
addressed slave receiver that the address high byte will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmitted by the master is the high-order byte of the word
address and will be written into the Address Pointer of
the 24XX64F. The next byte is the Least Significant
Address Byte. After receiving another Acknowledge
signal from the 24XX64F, the master device will transmit the data word to be written into the addressed memory location. The 24XX64F acknowledges again and
the master generates a Stop condition. This initiates
the internal write cycle and, during this time, the
24XX64F will not generate Acknowledge signals
(Figure 6-1). If an attempt is made to write to the array
with the WP pin held high, the device will acknowledge
the command, but no write cycle will occur, no data will
be written and the device will immediately accept a new
command. After a byte Write command, the internal
address counter will point to the address location following the one that was just written.
6.2
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX64F in the same way
as in a byte write. However, instead of generating a
Stop condition, the master transmits up to 31 additional
bytes which are temporarily stored in the on-chip page
buffer and will be written into memory once the master
has transmitted a Stop condition. Upon receipt of each
word, the five lower Address Pointer bits are internally
incremented by one. If the master should transmit more
than 32 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2). If an attempt is
made to write to the array with the WP pin held high, the
device will acknowledge the command, but no write
cycle will occur, no data will be written, and the device
will immediately accept a new command.
Note:
6.3
Page write operations are limited to writing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page size’) and end at addresses that
are integer multiples of [page size – 1]. If
a Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
Write Protection
The WP pin allows the user to write-protect 1/4 of the
array (1800h-1FFFh) when the pin is tied to VCC. If tied
to VSS the write protection is disabled. The WP pin is
sampled at the Stop bit for every Write command
(Figure 4-1). Toggling the WP pin after the Stop bit will
have no effect on the execution of the write cycle.
DS22154B-page 8
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
FIGURE 6-1:
BYTE WRITE
S
T
A
R
T
Bus Activity
Master
Control
Byte
Address
High Byte
AA
S1 01 0A
2 10 0
SDA Line
S
T
O
P
Data
xxx
P
A
C
K
Bus Activity
Address
Low Byte
A
C
K
A
C
K
A
C
K
x = “don’t care” bit
FIGURE 6-2:
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
AA
S 10 10A
2 1 0 0
Control
Byte
Bus Activity
Address
High Byte
Address
Low Byte
Data Byte 0
S
T
O
P
Data Byte 31
P
xxx
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
x = “don’t care” bit
2009-2012 Microchip Technology Inc.
DS22154B-page 9
24AA64F/24LC64F/24FC64F
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, the Start bit and control byte must
be re-sent. If the cycle is complete, the device will
return the ACK and the master can then proceed with
the next Read or Write command. See Figure 7-1 for a
flow diagram of this operation.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS22154B-page 10
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
8.0
READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
control byte is set to one. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24XX64F contains an address counter that maintains the address of the last word accessed, internally
incremented by one. Therefore, if the previous read
access was to address ‘n’ (n is any legal address), the
next current address read operation would access data
from address n + 1.
Upon receipt of the control byte with R/W bit set to one,
the 24XX64F issues an acknowledge and transmits the
eight-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24XX64F discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To
perform this type of read operation, the word address
must first be set. This is accomplished by sending
the word address to the 24XX64F as part of a write
operation (R/W bit set to ‘0’). Once the word address
is sent, the master generates a Start condition
following the acknowledge.
FIGURE 8-1:
This terminates the write operation, but not before
the internal Address Pointer is set. The master then
issues the control byte again, but with the R/W bit set
to a one. The 24XX64F will then issue an acknowledge and transmit the 8-bit data word. The master
will not acknowledge the transfer, but does generate
a Stop condition, which causes the 24XX64F to
discontinue transmission (Figure 8-2). After a
random Read command, the internal address counter will point to the address location following the one
that was just read.
8.3
Sequential Read
Sequential reads are initiated in the same way as
random reads, except that once the 24XX64F transmits
the first data byte, the master issues an acknowledge as
opposed to the Stop condition used in a random read.
This acknowledge directs the 24XX64F to transmit the
next sequentially-addressed 8-bit word (Figure 8-3).
Following the final byte being transmitted to the master,
the master will NOT generate an acknowledge, but will
generate a Stop condition. To provide sequential reads,
the 24XX64F contains an internal Address Pointer
which is incremented by one at the completion of each
operation. This Address Pointer allows the entire
memory contents to be serially read during one operation. The internal Address Pointer will automatically roll
over from address 1FFF to address 0000 if the master
acknowledges the byte received from the array address
1FFF.
CURRENT ADDRESS READ
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Bus Activity
Control
Byte
S
T
O
P
Data (n)
P
A
C
K
N
O
A
C
K
2009-2012 Microchip Technology Inc.
DS22154B-page 11
24AA64F/24LC64F/24FC64F
FIGURE 8-2:
Bus Activity
Master
SDA Line
RANDOM READ
S
T
A
R
T
Control
Byte
Address
High Byte
S1 01 0AAA0
2 1 0
Control
Byte
S
T
O
P
Data
Byte
S 1 0 1 0 A AA1
2 10
xxx
A
C
K
A
C
K
Bus Activity
S
T
A
R
T
Address
Low Byte
A
C
K
P
N
O
A
C
K
A
C
K
x = “don’t care” bit
FIGURE 8-3:
Bus Activity
Master
SEQUENTIAL READ
Control
Byte
Data n
Data n + 1
Data n + 2
S
T
O
P
Data n + x
P
SDA Line
Bus Activity
DS22154B-page 12
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (3.90 mm)
Example:
24LC64F
I/P e3 13F
0527
Example:
XXXXXXXT
XXXXYYWW
NNN
24LC64FI
SN e3 0527
13F
8-Lead TSSOP
Example:
XXXX
4LBF
TYWW
I527
NNN
13F
8-Lead MSOP
Example:
XXXXXT
4L64FI
YWWNNN
52713F
8-Lead 2x3 TDFN
XXX
YWW
NN
2009-2012 Microchip Technology Inc.
Example:
AT4
527
I3
DS22154B-page 13
24AA64F/24LC64F/24FC64F
5-Lead SOT-23
Example:
XXNN
7MNN
1st Line Marking Codes
Part Number
24AA64F
TSSOP
MSOP
4ABF
4A64FT
TDFN
SOT-23
I Temp.
E Temp.
I Temp.
E Temp.
AT1
—
7MNN
—
24LC64F
4LBF
4L64FT
AT4
AT5
7QNN
7RNN
24FC64F
4FBF
4F64FT
A7D
—
7UNN
—
Note:
T = Temperature grade (I, E)
Legend: XX...X
T
Y
YY
WW
NNN
e3
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS22154B-page 14
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
3
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2009-2012 Microchip Technology Inc.
DS22154B-page 15
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22154B-page 16
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2012 Microchip Technology Inc.
DS22154B-page 17
24AA64F/24LC64F/24FC64F
!
""#$%& !'
3
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DS22154B-page 18
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
(
!
)""!) !)*
3
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N
E
E1
3
2
1
e
e1
D
A2
A
c
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L
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9'&!
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7
7:
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7
9#&
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=
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=
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: 9&
=
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3
&9&
9
=
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3
&&
9
-
=
<
3
&
R
=
-R
9#4!!
<
=
?
9#>#&
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=
'!
!#.#
&"#'
#%!
&"!
!
#%!
&"!
!!
&$#''!#
'!
#&
.0
1,2 1!'!
&$& "!
**&
"&&
!
* ,1
2009-2012 Microchip Technology Inc.
DS22154B-page 19
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22154B-page 20
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
)+ +", !
)-%-)
!
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
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D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
6&!
'!
9'&!
7"')
%!
99..
7
7
7:
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: 8&
=
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=
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.
##4>#&
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##49&
-
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9
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3
&&
9
.3
3
&
R
=
<R
9#4!!
=
9#>#&
)
=
-
!"#$%&"' ()"&'"!&)
&#*&&&#
'!
!#.#
&"#'
#%!
&"!
!
#%!
&"!
!!
&$#''!#
- '!
#&
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1,2 1!'!
&$& "!
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"&&
!
.32 %'!
("!"*&
"&&
(%
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'&
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* ,<?1
2009-2012 Microchip Technology Inc.
DS22154B-page 21
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22154B-page 22
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2012 Microchip Technology Inc.
DS22154B-page 23
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22154B-page 24
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2012 Microchip Technology Inc.
DS22154B-page 25
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22154B-page 26
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2012 Microchip Technology Inc.
DS22154B-page 27
24AA64F/24LC64F/24FC64F
.
$,/0*11%2().
3
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!&"&4#*!(!!&
4%&
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'54
DS22154B-page 28
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
APPENDIX A:
REVISION HISTORY
Revision A (05/2009)
Initial Release.
Revision B (04/2012)
Added 24FC64F part.
2009-2012 Microchip Technology Inc.
DS22154B-page 29
24AA64F/24LC64F/24FC64F
NOTES:
DS22154B-page 30
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2009-2012 Microchip Technology Inc.
DS22154B-page 31
24AA64F/24LC64F/24FC64F
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 24AA64F/24LC64F/24FC64F
Literature Number: DS22154B
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS22154B-page 32
2009-2012 Microchip Technology Inc.
24AA64F/24LC64F/24FC64F
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
24AA64F:
24AA64FT:
24LC64F:
24LC64FT:
24FC64F:
24FC64FT:
Temperature
Range:
I
E
Package:
P
=
SN =
ST =
MS =
MNY(1)=
OT
=
=
1.7V, 64 Kbit I2C™ Serial EEPROM
1.7V, 64 Kbit I2C Serial EEPROM
(Tape and Reel)
2.5V, 64 Kbit I2C Serial EEPROM
2.5V, 64 Kbit I2C Serial EEPROM
(Tape and Reel)
1.7V, 64 Kbit I2C Serial EEPROM
1.7V, 64 Kbit I2C Serial EEPROM
(Tape and Reel)
Examples:
a)
24AA64F-I/P: Industrial
1.7V, PDIP package
b)
24AA64F-I/SN: Industrial Temperature,
1.7V, SOIC package
c)
24AA64FT-I/ST: Industrial Temperature,
1.7V, TSSOP package, tape and reel
d)
24LC64F-I/P: Industrial Temperature,
2.5V, PDIP package
e)
24LC64F-E/SN: Extended Temperature,
2.5V, SOIC package
24LC64F-I/ST: Industrial Temperature,
2.5V, TSSOP package
f)
Temperature,
-40°C to +85°C
-40°C to +125°C
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic MSOP (Micro Small Outline), 8-lead
Plastic TDFN (2x3x0.75 mm body), 8-lead
(Tape and Reel only)
= Plastic SOT-23, 5-lead (Tape and Reel only)
Note 1: "Y" indicates a Nickel Palladium Gold (NiPdAu) finish.
2009-2012 Microchip Technology Inc.
DS22154B-page 33
24AA64F/24LC64F/24FC64F
NOTES:
DS22154B-page 34
2009-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620762561
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2009-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22154B-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
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Fax: 81-66-152-9310
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Tel: 49-89-627-144-0
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Tel: 678-957-9614
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Fax: 630-285-0075
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Fax: 972-818-2924
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Fax: 317-773-5453
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Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS22154B-page 36
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/29/11
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