DA9275.007 19 February 2004 MAS9275 IC FOR 10.00 – 36.00 MHz VCXO • • • • • • Square Wave (CMOS) Output Very Low Phase Noise Low Power Wide Supply Voltage Range Very High Level of Integration Low Cost DESCRIPTION MAS9275 is a VCXO IC to be used in making VCXO modules for telecommunication and other applications. To build a complete VCXO only one additional component, a crystal, is needed. FEATURES APPLICATIONS • • • • • • • • Very small size Minimal current consumption Wide operating temperature range Phase noise <-130 dBc/Hz at 1 kHz offset Square wave (CMOS) output VCXO for telecommunications systems VCXO for set-top boxes VCXO for MPEG BLOCK DIAGRAM PD VC OUT MAS9275 VDD VSS X1 X2 X'Tal 1 (10) DA9275.007 19 February 2004 PIN DESCRIPTION Pin Description Crystal/Varactor Oscillator Input Voltage Control Input Power Supply Ground Buffer Output Power Supply Voltage Tri State Crystal Oscillator Output Symbol x-coordinate y-coordinate X1 VC VSS OUT VDD PD X2 209 425 600 1029 841 379 197 161 165 175 1030 1016 1028 1030 Note Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Pin Voltage Power Dissipation Storage Temperature ESD Rating Symbol Conditions VDD VSS PMAX TST Min Max Unit -0.3 6.0 V VSS -0.3 VDD + 0.3 100 120 2 V mW o C kV -55 HBM Note RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Supply Current Operating Temperature Voltage Control Line Impedance Crystal Pulling Sensitivity Crystal Load Capacitance Symbol VDD IDD TOP VcIMP S CL Conditions Min Typ Max Unit Note 2.5 2.8 2.3 5.5 V mA o C MΩ 1) VDD = 2.8 V -40 MAS9275A, MAS9275B +85 1 30 VC = 1.65 V MAS9275A1 MAS9275B2 MAS9275B3 MAS9275C2 MAS9275C3 MAS9275C4 ppm/pF pF 8 10 10.5 10 10.5 10.5 2) 2) 2) Note 1: It is recommend to connect a 1 nF capacitor to the VDD pin (either in a module or in an end application). Note 2: Crystal Load Capacitance is typically 8.2 pF, when VC = 2.5 V. 2 (10) DA9275.007 19 February 2004 ELECTRICAL CHARACTERISTICS (recommended operation conditions) Parameter Symbol Min Frequency Range fo Voltage Control Range VC Voltage Control Sensitivity Typ Max Unit Note 10.00 36.00 MHz 1) 0 VDD V VCSENS 100 ppm/V Output Voltage (10 pF, VDD 2.7 V) Vout 2.3 Vpp Output Voltage (10 pF, VDD 5.0 V) Vout 4.5 Vpp Rise and Fall Time (10 - 50 pF) 10 Output Symmetry Startup Time TSTART Tri State Output Buffer ON State OFF State Tri State Output Buffer ON State OFF State ns 40-60 % 2 ms PD 0 1.6 0.55 VDD 1.6 0 VDD 0.55 PD 2) V 3) V 4) Note 1: An RS < 20 Ω crystal provides 36 MHz maximum frequency. With an RS = 70 Ω crystal the maximum frequency is typically 20 MHz. Note 2: VC sensitivity value depends on the crystal used. With a 30 ppm/pF crystal typical values are: A1 > 100 ppm/V, B2 > 75 ppm/V, B3 > 60 ppm/V, C2 > 75 ppm/V, C3 > 60 ppm/V, C4 > 55 ppm/V. Note 3: MAS9275A, MAS9275B Note 4: MAS9275C Note 5: If the Tri State Output Buffer is floating (i.e., PD pin not connected), the oscillator is ON in all models (MAS9275A, -B and -C) 1290 µm IC OUTLINES X2 PD X1 VC VDD OUT VSS MAS9275 Die map reference 1220 µm Note 1: MAS9275 pads are round with 80 µm diameter at opening. Note 2: Die map reference is the actual left bottom corner of the sawn chip. 3 (10) DA9275.007 19 February 2004 EXTERNAL COMPONENT SELECTION MAS9275 requires a minimum number of external components for proper operation. Quartz Crystal The MAS9275 VCXO function consists of the external crystal and the integrated VCXO oscillator circuit. To assure the best system performance (frequency pull range) and reliability, a crystal device with the recommended parameters (shown below) must be used, and the layout guidelines in the following section must be followed. The frequency of oscillation of a quartz crystal is determined by its “cut” and by the load capacitors connected to it. MAS9275 incorporates on-chip variable load capacitors that “pull” (change) the frequency of the crystal. The crystal specified for use with the MAS9275B2 is designed to have zero frequency error when the total of on-chip + stray capacitance is 10 pF (See Note 1 on page 2 for other capacitance options). Recommended Crystal Parameters: Initial Accuracy at 25°C ±20 ppm Temperature Stability ±30 ppm Crystal Load Capacitance 10 pf (See Note1 below) Crystal Shunt Capacitance, C0 2 pF Typical C0/C1 Ratio Typical ≤ 300 Equivalent Series Resistance 20 Ω max. Crystals with higher ESR can be used if frequency is < 36 MHz. See Note 2 under Electrical Characteristics on Page 3. The external crystal must be connected as close to the chip as possible and should be on the same side of the PCB as the MAS9275. There should be no vias between the crystal pins and the X1 and X2 device pins. There should be no signal traces underneath or close to the crystal. Note 1. If the crystal with a load other than the nominal Crystal Load Capacitance as defined in Recommended Operation Conditions on page 2 is used with MAS9275, the crystal has to have frequency offset in order to have the nominal frequency at VC = 1.65 V or at VC = 2.5 V. Please see table below for offset frequencies vs. crystal load. (Values are for a typical crystal with S = 30 ppm/pF.) 19.68 8 Crystal frequency Crystal Load A1 B2, C2 B3, C3, C4 B3, C3, C4 VC voltage 1.65 V 1.65 V 1.65 V 2.5 V +0 +60 +85 +30 19.68 27.00 40.00 10 12.5 16 Offset in crystal frequency -60 -150 -240 0 -75 -180 +25 -50 -155 -30 -105 -210 MHz pF ppm ppm ppm ppm Note: 19.68 MHz crystal with 10 pF load capacitance used with MAS9275B2 or C2 may not require frequency offset because of small deviation For example: For application using MAS9275B2 or C2 with nominal frequency of 27.00 MHz a crystal with 12.5 pF load has to have a frequency of 27.00 MHz + ((27.00 MHz/106) x (- 90)) = 26.99757 MHz. 4 (10) DA9275.007 19 February 2004 MODULATION RESPONSE Figure 2. Modulation response (gain). MAS9275B3/C3 Modulation Response 2.00 2 0.00 0 -2.00 -2 Gain (dB) Gain (dB) MAS9275B2/C2 Modulation Response -4.00 -4 -6.00 -6 -8.00 -8 -10.00 -10 0.1 1 10 100 0.1 Frequency (kHz) 1 10 100 Frequency (kHz) TYPICAL APPLICATION MAS9275B2/B3/C2/C3 Vdd 1n C1 X2 1 20 2 19 X1 3 Vcontrol R1 Modulation In C2 GND 6 17 MAS9275 YYWW XXXXX.X VC 5 47n 18 PD 4 50k 16 VDD 15 7 14 8 13 9 12 10 Top marking: YYWW = Year, Week XXXXX.X = Lot number 11 OUT C6 10n 5 (10) DA9275.007 19 February 2004 SAMPLES IN SB20 DIL PACKAGE X2 1 20 2 19 X1 3 18 PD 4 VSS 6 MAS9275 YYWW XXXXX.X VC 5 17 16 VDD Top marking: YYWW = Year, Week XXXXX.X = Lot number 15 7 14 8 13 9 12 11 OUT 10 DEVICE OUTLINE CONFIGURATION MSOP 8 pin 1 X1 9275 BX VSS YWW VC X2 PD Top View VDD OUT B = product version X = MAS internal code Y = year WW= week 6 (10) DA9275.007 19 February 2004 PACKAGE (MSOP-8) OUTLINE Gage plane F E1 E Land Pattern Recommendation P R A Q L A R1 N e D G A2 A1 c M c1 b1 (b) A Section A - A b Symbol Min A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) M N P Q R R1 0 0.75 0.22 0.22 0.08 0.08 0.40 Nom 0.85 0.30 3.00 BSC 4.90 BSC 3.00 BSC 0.65 BSC 4.8 0.65 0.60 Max Unit 1.10 0.15 0.95 0.38 0.33 0.23 0.18 mm mm mm mm mm mm mm mm mm mm mm mm mm mm 0.80 0.41 1.02 0° mm mm 8° 0.25 BSC 0.07 0.07 mm mm mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. All measurement according to JEDEC standard MO-187. 7 (10) DA9275.007 19 February 2004 SOLDERING INFORMATION Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile According to RSH test IEC 68-2-58/20 2*220°C 240°C 2 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% Seating Plane Co-planarity Lead Finish EMBOSSED TAPE SPECIFICATIONS P1 T DO PO P2 E W F BO A AO KO D1 Section A-A User Direction of Feed Pin 1 Designator Dimension Min/Max Unit Ao Bo Do D1 E F Ko Po P1 P2 T W 5.00 ±0.10 3.20 ±0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 ±0.05 1.45 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 +0.30/-0.10 mm mm mm mm mm mm mm mm mm mm mm mm 8 (10) DA9275.007 19 February 2004 REEL SPECIFICATIONS W2 A D C Tape Slot for Tape Start N B W1 5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W1 (measured at hub) W2 (measured at hub) Trailer Leader Weight Leader Components Min 1.5 12.80 20.2 50 12.4 Max Unit 330 mm mm mm mm mm mm mm mm mm 13.50 14.4 18.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 g 9 (10) DA9275.007 19 February 2004 ORDERING INFORMATION Product Code Product Typical Vc-Sensitivity (with 30 ppm/pF crystal) Package MAS9275A1TG00 IC FOR 2.8 V VCXO Negative PD logic IC FOR 2.8 V VCXO Negative PD logic IC FOR 3.3 V VCXO Negative PD logic IC FOR 3.3 V VCXO Negative PD logic IC FOR 5.0 V VCXO Negative PD logic IC FOR 5.0 V VCXO Negative PD logic IC FOR 3.3 V VCXO Positive PD logic IC FOR 3.3 V VCXO Positive PD logic IC FOR 5.0 V VCXO Positive PD logic IC FOR 5.0 V VCXO Positive PD logic IC FOR 5.0 V VCXO Positive PD logic IC FOR 5.0 V VCXO Positive PD logic > 100 ppm/V EWS tested wafers 215 µm > 100 ppm/V MSOP-8, T&R/5000 pcs/r. > 75 ppm/V EWS tested wafers 215 µm > 75 ppm/V MSOP-8, T&R/5000 pcs/r. > 60 ppm/V EWS tested wafers 215 µm > 60 ppm/V MSOP-8, T&R/5000 pcs/r. > 75 ppm/V EWS tested wafers 215 µm > 75 ppm/V MSOP-8, T&R/5000 pcs/r. > 60 ppm/V EWS tested wafers 215 µm > 60 ppm/V MSOP-8, T&R/5000 pcs/r. > 55 ppm/V EWS tested wafers 215 µm > 55 ppm/V MSOP-8, T&R/5000 pcs/r. MAS9275A1SM06 MAS9275B2TG00 MAS9275B2SM06 MAS9275B3TG00 MAS9275B3SM06 MAS9275C2TG00 MAS9275C2SM06 MAS9275C3TG00 MAS9275C3SM06 MAS9275C4TG00 MAS9275C4SM06 Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 10 (10)