MC33269, NCV33269 800 mA, Adjustable Output, Low Dropout Voltage Regulator The MC33269/NCV33269 series are low dropout, medium current, fixed and adjustable, positive voltage regulators specifically designed for use in low input voltage applications. These devices offer the circuit designer an economical solution for precision voltage regulation, while keeping power losses to a minimum. The regulator consists of a 1.0 V dropout composite PNP−NPN pass transistor, current limiting, and thermal shutdown. • 3.3 V, 5.0 V, 12 V and Adjustable Versions. 2.85 V version available as MC34268. • Space Saving DPAK, SOP−8 and SOT−223 Power Packages • 1.0 V Dropout • Output Current in Excess of 800 mA • Thermal Protection • Short Circuit Protection • Output Trimmed to 1.0% Tolerance • Pb−Free Package is Available http://onsemi.com 1 Gnd/Adj 1 8 2 7 3 6 4 5 Vout Vin DPAK DT SUFFIX CASE 369A 1 1. GND/Adj 2. Vout 3. Vin DEVICE TYPE/NOMINAL OUTPUT VOLTAGE Adj Adj Adj Adj 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V MC33269D−5.0 MC33269DT−5.0 5.0 V 5.0 V MC33269T−5.0 MC33269D−12 MC33269DT−12 NCV33269DTRK−12* MC33269T−12 5.0 V 12 V 12 V 12 V 12 V NC Vout NC (Top View) 3 MC33269D MC33269DT NCV33269DTRK* MC33269T MC33269D−3.3 MC33269DT−3.3 NCV33269DTRK−3.3* MC33269T−3.3 MC33269ST−3.3 SO−8 D SUFFIX CASE 751 8 1 3 SOT−223 ST SUFFIX CASE 318E 1 2 3 (Top View) 1 2 3 (Top View) Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. TO−220AB T SUFFIX CASE 221A *NCV prefix is for automotive and other applications requiring site and change control. 1 2 3 1. GND/Adj 2. Vout 3. Vin 12 3 (Top View) Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 9 of this data sheet. Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. 16 1 Publication Order Number: MC33269/D MC33269, NCV33269 MAXIMUM RATINGS Rating Symbol Value Unit Vin 20 V PD JA JC Internally Limited 92 6.0 W °C/W °C/W PD JA JC Internally Limited 160 25 W °C/W °C/W PD JA JC Internally Limited 65 5.0 W °C/W °C/W PD JA JC Internally Limited 156 15 W °C/W °C/W TJ −40 to +150 °C TA −40 to +125 −40 to +125 °C Storage Temperature Tstg −55 to +150 °C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) ESD Power Supply Input Voltage Power Dissipation Case 369A (DPAK) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 751 (SOP−8) TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 221A TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 318E TA = 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Operating Die Junction Temperature Range Operating Ambient Temperature Range MC3326 NCV33269 V 4000 400 http://onsemi.com 2 MC33269, NCV33269 ELECTRICAL CHARACTERISTICS (CO = 10 F, TA = 25°C, for min/max values TA = −40°C to +125°C, unless otherwise noted.) Characteristic Symbol Output Voltage (Iout = 10 mA, TA = 25°C) 3.3 Suffix (VCC = 5.3 V) 5.0 Suffix (VCC = 7.0 V) 12 Suffix (VCC = 14 V) VO Output Voltage (Line, Load and Temperature) (Note 1) (1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA) (1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA) 3.3 Suffix 5.0 Suffix 12 Suffix VO Reference Voltage (Iout = 10 mA, Vin − Vout = 2.0 V, TA = 25°C) for Adjustable Voltage Reference Voltage (Line, Load and Temperature) (Note 1) (1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA) (1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA) for Adjustable Voltage Min Typ Max 3.27 4.95 11.88 3.3 5.0 12 3.33 5.05 12.12 Unit V V 3.23 4.9 11.76 3.3 5.0 12 3.37 5.1 12.24 Vref 1.235 1.25 1.265 V Vref 1.225 1.25 1.275 V Line Regulation (Iout = 10 mA, Vin = [Vout + 1.5 V] to Vin = 20 V, TA = 25°C) Regline − − 0.3 % Load Regulation (Vin = Vout + 3.0 V, Iout = 10 mA to 800 mA, TA = 25°C) Regload − − 0.5 % 1.0 1.1 1.25 1.35 V Dropout Voltage (Iout = 500 mA) (Iout = 800 mA) Vin − Vout − − Ripple Rejection (10 Vpp, 120 Hz Sinewave; Iout = 500 mA) RR 55 − − dB Current Limit (Vin − Vout = 10 V) ILimit 800 − − mA − − 5.5 − 8.0 20 − 8.0 − − 0 − − − 120 Quiescent Current (Fixed Output) (1.5 V ≤ Vout ≤ 3.3 V) (5 V ≤ Vout ≤ 12 V) IQ Minimum Required Load Current Fixed Output Voltage Adjustable Voltage ILoad Adjustment Pin Current IAdj mA mA 1. The MC33269−12, Vin − Vout is limited to 8.0 V maximum, because of the 20 V maximum rating applied to Vin. http://onsemi.com 3 A MC33269, NCV33269 Vin Vout Trim Links VAdj Gnd This device contains 38 active transistors. Figure 1. Internal Schematic http://onsemi.com 4 MC33269, NCV33269 ∆ VO , OUTPUT VOLTAGE DEVIATION 1.3 TA = −40°C TA = 25°C 1.1 TA = 125°C 0.9 0.7 0.5 100 mV/Div Cin = 10 F CO = 10 F Tantalum Vin = VO + 3.0 V Preload = 0.1 A I O , OUTPUT CURRENT Vin −Vout , DROPOUT VOLTAGE (V) 1.5 0 200 400 600 800 0.5 A 0A 1000 20 ms/DIV IO, OUTPUT LOAD CURRENT (mA) V FB(OV), OVERVOLTAGE INPUT THRESHOLD (%VFB ) Figure 2. Dropout Voltage versus Output Load Current Figure 3. Transient Load Regulation 1.6 1100 IO = 800 mA 1.4 OUTPUT CURRENT (A) 1060 1020 980 1.0 TA = 25°C MC33269D−XX L = 25 mm Copper 0.8 0.6 0.4 940 0.2 900 −55 −25 0 25 50 75 100 0 125 6.0 8.0 10 12 14 16 Figure 5. MC33269−XX Output DC Current versus Input−Output Differential Voltage 70 RR, RIPPLE REJECTION RATIO (dB) VO = 12 V Vin = VO + 3.0 V IL = 800 mA TA = 25°C 30 20 0.1 4.0 Figure 4. Dropout Voltage versus Temperature 50 40 2.0 INPUT−OUTPUT VOLTAGE DIFFERENTIAL (V) VO = 3.3 V or 5.0 V 60 0 TA, AMBIENT TEMPERATURE (°C) 70 RR, RIPPLE REJECTION RATIO (dB) 1.2 1.0 10 f, FREQUENCY (kHz) 60 50 40 30 20 0.1 100 Vin = 8.0 V Vout = 5.0 V IL = 800 mA CAdj = 22 F TA = 25°C Figure 6. MC33269 Ripple Rejection versus Frequency 1.0 10 f, FREQUENCY (kHz) Figure 7. MC33269−ADJ Ripple Rejection versus Frequency http://onsemi.com 5 100 3.2 2.8 PD(max) for TA = 50°C 130 110 ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ Graph represents symmetrical layout 90 L 70 2.0 oz. Copper L 50 3.0 mm RJA 30 0 10 20 30 2.4 2.0 1.6 1.2 0.8 0.4 50 40 L, LENGTH OF COPPER (mm) 100 JUNCTION-TO-AIR (° C/W) Minimum Size Pad 70 60 50 40 0 5.0 10 15 2.50 1.25 ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ Minimum Size Pad 2.0 oz. Copper L 0.83 L 0.63 0.50 80 0.42 RJA 0 5.0 10 1.2 0.8 0.4 20 25 30 0 L, LENGTH OF COPPER (mm) 120 40 1.6 RJA 200 160 L PD(max) for TA = 50°C Free Air Mounted Vertically 240 ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ 2.0 oz. Copper L 80 2.0 Figure 9. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length Figure 8. SOP−8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length 280 90 2.4 PD(max) for TA = 50°C Free Air Mounted Vertically 15 20 25 30 0.35 L, LENGTH OF COPPER (mm) Figure 10. SOT−223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 6 PD, MAXIMUM POWER DISSIPATION (W) 150 R θ JA, THERMAL RESISTANCE, JUNCTION−TO−AIR (° C/W) 170 R θ JA, THERMAL RESISTANCE R θ JA, THERMAL RESISTANCE, JUNCTION−TO−AIR (° C/W) MC33269, NCV33269 MC33269, NCV33269 APPLICATIONS INFORMATION supply input filter with long wire lengths. This will reduce the circuit’s sensitivity to the input line impedance at high frequencies. A 0.33 F or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. Applications should be tested over all operating conditions to insure stability. Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 170°C, the output is disabled. There is no hysteresis built into the thermal limiting circuit. As a result, if the device is overheating, the output will appear to be oscillating. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heat−sinking. Figures 11 through 15 are typical application circuits. The output current capability of the regulator is in excess of 800 mA, with a typical dropout voltage of less than 1.0 V. Internal protective features include current and thermal limiting. * The MC33269 requires an external output capacitor for stability. The capacitor should be at least 10 F with an equivalent series resistance (ESR) of less than 10 but greater than 0.2 over the anticipated operating temperature range. With economical electrolytic capacitors, cold temperature operation can pose a problem. As temperature decreases, the capacitance also decreases and the ESR increases, which could cause the circuit to oscillate. Also capacitance and ESR of a solid tantalum capacitor is more stable over temperature. The use of a low ESR ceramic capacitor placed within close proximity to the output of the device could cause instability. ** An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the Vin MC33269−XX ** Cin Vout Vin Co * 10 F ** Cin Vout MC33269 R1 GND R2 An input capacitor is not necessary for stability, however it will improve the overall performance. CAdj*** Figure 11. Typical Fixed Output Application Vin MC33269 RS Adj ***CAdj is optional, however it will improve the ripple rejection. The MC34269 develops a 1.25 V reference voltage between the output and the adjust terminal. Resistor R1, operates with constant current to flow through it and resistor R2. This current should be set such that the Adjust Pin current causes negligible drop across resistor R2. The total current with minimum load should be greater than 8.0 mA. Iout I out 1.25 R S Figure 13. Current Regulator MC33269−XX V out 1.25 1 R2 I R2 Adj R1 Co * 10 F ** Cin Vin Co * 10 F Adj Figure 12. Typical Adjustable Output Application Vout ** Cin Vin GND ** Cin Vout MC33269 R1 Adj R2 MC33269−XX Co* 10 F Co * 10 F ** Cin GND The Schottky diode in series with the ground leg of the upper regulator shifts its output voltage higher by the forward voltage drop of the diode. This will cause the lower device to remain off until the input voltage is removed. R2 sets the maximum output voltage. Each transistor reduces the output voltage when turned on. Figure 14. Battery Backed−Up Power Supply Figure 15. Digitally Controlled Voltage Regulator http://onsemi.com 7 MC33269, NCV33269 ORDERING INFORMATION Device Shipping Information† Package MC33269D SO−8 98 Units / Rail MC33269DR2 SO−8 2500 Units / Tape & Reel SO−8 (Pb−Free) 2500 Units / Tape & Reel DPAK 75 Units / Rail MC33269DR2G MC33269DT MC33269DTG MC33269DTRK MC33269DTRKG MC33269T DPAK (Pb−Free) 75 Units / Rail DPAK 2500 Units / Tape & Reel DPAK (Pb−Free) 2500 Units / Tape & Reel TO−220 50 Units / Rail MC33269D−3.3 SO−8 98 Units / Rail MC33269DR2−3.3 SO−8 2500 Units / Tape & Reel SO−8 (Pb−Free) 2500 Units / Tape & Reel DPAK 75 Units / Rail MC33269DR2−3.3G MC33269DT−3.3 MC33269DT−3.3G MC33269DTRK−3.3 MC33269DTRK−3.3G MC33269ST−3.3T3 DPAK (Pb−Free) 75 Units / Rail DPAK 2500 Units / Tape & Reel DPAK (Pb−Free) 2500 Units / Tape & Reel SOT−223 4000 Units / Tape & Reel SOT−223 (Pb−Free) 4000 Units / Tape & Reel MC33269T−3.3 TO−220 50 Units / Rail MC33269D−5.0 SO−8 98 Units / Rail MC33269DR2−5.0 SO−8 2500 Units / Tape & Reel MC33269DT−5.0 DPAK 75 Units / Rail MC33269DTRK−5.0 DPAK 2500 Units / Tape & Reel MC33269ST−3.3T3G MC33269DTRK−5.0G DPAK (Pb−Free) 2500 Units / Tape & Reel MC33269T−5.0 TO−220 50 Units / Rail MC33269D−12 SO−8 98 Units / Rail MC33269DR2−12 SO−8 2500 Units / Tape & Reel MC33269DT−12 DPAK 75 Units / Rail MC33269DTRK−12 DPAK 2500 Units / Tape & Reel DPAK (Pb−Free) 2500 Units / Tape & Reel MC33269DTRK−12G MC33269T−12 TO−220 50 Units / Rail NCV33269DTRK* DPAK 2500 Units / Tape & Reel NCV33269DTRK−3.3* DPAK 2500 Units / Tape & Reel NCV33269DTRK−12* DPAK 250 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV prefix is for automotive and other applications requiring site and control changes. http://onsemi.com 8 MC33269, NCV33269 MARKING DIAGRAMS SO−8 D SUFFIX CASE 751 8 8 269AJ ALYW 8 69−12 ALYW 1 8 269−3 ALYW 1 269−5 ALYW 1 1 SOT−223 ST SUFFIX CASE 318E DPAK DT SUFFIX CASE 369A 269AJ ALYWW 69−12 ALYWW 2 1 269−3 ALYWW 2 3 1 269−5 ALYWW 2 3 1 ALYW 2693 2 3 1 1 3 TO−220AB T SUFFIX CASE 221A MC 33269T AWLYWW 1 2 3 MC 33269T−12 AWLYWW 1 2 MC 33269T−3.3 AWLYWW 3 A WL, L Y WW, W 1 2 = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 9 3 MC 33269T−5.0 AWLYWW 1 2 3 2 3 MC33269, NCV33269 PACKAGE DIMENSIONS SO−8 D SUFFIX CASE 751−07 ISSUE AA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 1 0.25 (0.010) M Y M 4 K −Y− G C N X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches Figure 16. SO−8 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 MC33269, NCV33269 DPAK DT SUFFIX CASE 369A−13 ISSUE AB −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M T SOLDERING FOOTPRINT* 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm inches Figure 17. DPAK *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 −−− 0.030 0.050 0.138 −−− MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 −−− 0.77 1.27 3.51 −−− MC33269, NCV33269 PACKAGE DIMENSIONS SOT−223 ST SUFFIX CASE 318E−04 ISSUE K A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 S INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0 10 S 0.264 0.287 B 1 2 3 D L G J C 0.08 (0003) M H K SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm inches Figure 18. SOT−223 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0 10 6.70 7.30 MC33269, NCV33269 TO−220AB T SUFFIX CASE 221A−09 ISSUE AA −T− B SEATING PLANE C F T S 4 DIM A B C D F G H J K L N Q R S T U V Z A Q 1 2 3 U H K Z L R V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. J G D N http://onsemi.com 13 INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 −−− −−− 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 −−− −−− 2.04 MC33269, NCV33269 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 14 For additional information, please contact your local Sales Representative. MC33269/D