MC74AC174, MC74ACT174 Hex D Flip−Flop with Master Reset The MC74AC174/74ACT174 is a high−speed hex D flip−flop. The device is used primarily as a 6−bit edge−triggered storage register. The information on the D inputs is transferred to storage during the LOW−to−HIGH clock transition. The device has a Master Reset to simultaneously clear all flip−flops. • Outputs Source/Sink 24 mA • ′ACT174 Has TTL Compatible Inputs http://onsemi.com DIP−16 N SUFFIX CASE 648 16 VCC Q5 D5 D4 Q4 D3 Q3 CP 16 15 14 13 12 11 10 9 1 16 1 2 3 4 5 6 7 MR Q0 D0 D1 Q1 D2 Q2 8 GND 1 16 1 Figure 1. Pinout: 16−Lead Packages Conductors (Top View) 16 PIN ASSIGNMENT PIN FUNCTION D0−D5 Data Inputs CP Clock Pulse Input MR Master Reset Input Q0−Q5 Outputs Output MR CP D Q L H H H X X H L X L H L Q L TSSOP−16 DT SUFFIX CASE 948F EIAJ−16 M SUFFIX CASE 966 ORDERING INFORMATION Device TRUTH TABLE Inputs 1 SO−16 D SUFFIX CASE 751B H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial = LOW−to−HIGH Transition of Clock Package Shipping MC74AC174N PDIP−16 25 Units/Rail MC74ACT174N PDIP−16 25 Units/Rail MC74AC174D SOIC−16 48 Units/Rail MC74ACT174D SOIC−16 48 Units/Rail MC74AC174DR2 SOIC−16 2500 Tape & Reel MC74ACT174DR2 SOIC−16 2500 Tape & Reel MC74AC174DT TSSOP−16 96 Units/Rail MC74ACT174DT TSSOP−16 96 Units/Rail MC74AC174DTR2 TSSOP−16 2500 Tape & Reel MC74AC174M EIAJ−16 50 Units/Rail MC74ACT174M EIAJ−16 50 Units/Rail MC74AC174MEL EIAJ−16 2000 Tape & Reel MC74ACT174MEL EIAJ−16 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2006 June, 2006 − Rev. 7 1 Publication Order Number: MC74AC174/D MC74AC174, MC74ACT174 CP D0 D1 D2 D3 D4 D5 MR Q0 Q1 Q2 Q3 Q4 Q5 Figure 2. Logic Symbol FUNCTIONAL DESCRIPTION LOW−to−HIGH Clock (CP) transition. A LOW input to the Master Reset (MR) will force all outputs LOW independent of Clock or Data inputs. The MC74AC174/ 74ACT174 is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements. The MC74AC174/74ACT174 consists of six edge−triggered D flip−flops with individual D inputs and Q outputs. The Clock (CP) and Master Reset (MR) are common to all flip−flops. Each D input’s state is transferred to the corresponding flip−flop’s output following the MR CP D5 D4 D Q D3 Q D CP CD D CP CD Q5 D2 Q D CP CD Q Q3 D0 Q D CP CD Q4 NOTE: D1 D CP CD Q2 Q CP CD Q1 Q0 This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram MAXIMUM RATINGS* Symbol Parameter Value Unit −0.5 to +7.0 V DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C VCC DC Supply Voltage (Referenced to GND) VIN *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. http://onsemi.com 2 MC74AC174, MC74ACT174 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 5.5 − 5.5 5.5 VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current IOHD ICC Maximum Quiescent Supply Current V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND − 75 mA VOLD = 1.65 V Max − − −75 mA VOHD = 3.85 V Min − 8.0 80 mA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 V IOUT = −50 mA MC74AC174, MC74ACT174 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. fmax Maximum Clock Frequency 3.3 5.0 90 100 100 125 − − 70 100 − − MHz 3−3 tPLH Propagation Delay CP to Qn 3.3 5.0 2.0 1.5 9.0 6.0 11.5 8.5 1.5 1.0 12.5 9.5 ns 3−6 tPHL Propagation Delay CP to Qn 3.3 5.0 2.0 1.5 8.5 6.0 11.0 8.0 1.5 1.0 12.0 9.0 ns 3−6 tPHL Propagation Delay MR to Qn 3.3 5.0 2.5 1.5 9.0 7.0 11.5 9.0 2.0 1.5 12.5 10.5 ns 3−6 Unit Fig. No. *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. AC OPERATING REQUIREMENTS Symbol VCC* (V) Parameter Typ 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Guaranteed Minimum ts Setup Time, HIGH or LOW Dn to CP 3.3 5.0 2.5 2.0 6.5 5.0 7.0 5.5 ns 3−9 th Hold Time, HIGH or LOW Dn to CP 3.3 5.0 1.0 0.5 3.0 3.0 3.0 3.0 ns 3−9 tw MR Pulse Width, LOW 3.3 5.0 1.0 1.0 5.5 5.0 7.0 5.0 ns 3−6 tw CP Pulse Width 3.3 5.0 1.0 1.0 5.5 5.0 7.0 5.0 ns 3−6 trec Recovery TIme MR to CP 3.3 5.0 0 0 2.5 2.0 2.5 2.0 ns 3−6 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 4 MC74AC174, MC74ACT174 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage IOUT = −50 mA *VIN = VIL or VIH −24 mA IOH −24 mA V IOUT = 50 mA V IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. fmax Maximum Clock Frequency 5.0 165 − − 140 − MHz 3−3 tPLH Propagation Delay CP to Qn 5.0 1.5 − 10.5 1.5 11.5 ns 3−6 tPHL Propagation Delay CP to Qn 5.0 1.5 − 10.5 1.5 11.5 ns 3−6 tPHL Propagation Delay MR to Qn 5.0 1.5 − 9.5 1.5 11.0 ns 3−6 *Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 5 MC74AC174, MC74ACT174 AC OPERATING REQUIREMENTS Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Typ Unit Fig. No. Guaranteed Minimum ts Setup Time, HIGH or LOW Dn to CP 5.0 − 1.5 1.5 ns 3−9 th Hold Time, HIGH or LOW Dn to CP 5.0 − 2.0 2.0 ns 3−9 tw MR Pulse Width, LOW 5.0 − 3.0 3.5 ns 3−6 tw CP Pulse Width HIGH or LOW 5.0 − 3.0 3.5 ns 3−6 5.0 − 0.5 0.5 ns 3−6 Recovery Time MR to CP *Voltage Range 5.0 V is 5.0 V ±0.5 V. trec CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 85 pF VCC = 5.0 V MARKING DIAGRAMS DIP−16 SO−16 MC74AC174N AWLYYWW AC174 AWLYWW MC74ACT174N AWLYYWW ACT174 AWLYWW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 6 TSSOP−16 EIAJ−16 AC 174 ALYW 74AC174 ALYW ACT 174 ALYW 74ACT174 ALYW MC74AC174, MC74ACT174 PACKAGE DIMENSIONS PDIP−16 N SUFFIX 16 PIN PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SO−16 D SUFFIX 16 PIN PLASTIC SOIC PACKAGE CASE 751B−05 ISSUE J −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 7 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74AC174, MC74ACT174 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX 16 PIN PLASTIC TSSOP PACKAGE CASE948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D DETAIL E H G EIAJ−16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE966−01 ISSUE O 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 8 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 MC74AC174, MC74ACT174 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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