MC74AC125, MC74ACT125 Quad Buffer with 3-State Outputs • Outputs Source/Sink • ′ACT125 Has TTL Compatible Inputs VCC A2 B2 O2 A3 B3 O3 14 13 12 11 10 9 8 http://onsemi.com PDIP–14 N SUFFIX CASE 646 14 1 1 2 3 4 5 6 7 A0 B0 O0 A1 B1 O1 GND SO–14 D SUFFIX CASE 751A 14 1 Figure 1. Pinout: 14–Lead Packages Conductors (Top View) 14 1 TSSOP–14 DT SUFFIX CASE 948G PIN ASSIGNMENT PIN FUNCTION An, Bn Inputs On Outputs 14 1 EIAJ–14 M SUFFIX CASE 965 ORDERING INFORMATION FUNCTION TABLE Inputs An Device Output Bn L L L H H X NOTE: H = High Voltage Level; L = Low Voltage Level; Z = High Impedance; X = Immaterial On L H Z Package Shipping MC74AC125N PDIP–14 25 Units/Rail MC74ACT125N PDIP–14 25 Units/Rail MC74AC125D SOIC–14 55 Units/Rail MC74AC125DR2 SOIC–14 2500 Tape & Reel MC74ACT125D SOIC–14 55 Units/Rail MC74ACT125DR2 SOIC–14 2500 Tape & Reel MC74AC125DT TSSOP–14 96 Units/Rail MC74AC125DTR2 TSSOP–14 2500 Tape & Reel MC74ACT125DT TSSOP–14 96 Units/Rail MC74ACT125DTR2 TSSOP–14 2500 Tape & Reel MC74AC125M EIAJ–14 50 Units/Rail MC74AC125MEL EIAJ–14 2000 Tape & Reel MC74ACT125M EIAJ–14 50 Units/Rail MC74ACT125MEL EIAJ–14 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2001 May, 2001 – Rev. 5 1 Publication Order Number: MC74AC125/D MC74AC125, MC74ACT125 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V Vin DC Input Voltage (Referenced to GND) –0.5 to VCC + 0.5 V Vout DC Output Voltage (Referenced to GND) –0.5 to VCC + 0.5 V Iin DC Input Current, per Pin ± 20 mA Iout DC Output Sink/Source Current, per Pin ± 50 mA ICC DC VCC or GND Current per Output Pin ± 50 mA Tstg Storage Temperature –65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 – VCC VCC @ 3.0 V – 150 – VCC @ 4.5 V – 40 – VCC @ 5.5 V – 25 – – – 140 Unit V V ns/V °C TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range –40 25 85 °C IOH Output Current – HIGH – – –24 mA IOL Output Current – LOW – – 24 mA 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC125, MC74ACT125 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = –40°C to +85°C Typ VIH VIL VOH VOL Unit Conditions Guaranteed Limits Minimum High g Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC – 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC – 0.1 V Minimum High g Level Output Voltage 3.0 4.5 5.5 2.99 4.46 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 – – – 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 – – – 0.36 0.36 0.36 0.44 0.44 0.44 Minimum Low Level Output Voltage IOUT = – 50 µA V *VIN = VIL or VIH –12 mA IOH – 24 mA – 24 mA IOUT = 50 µA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum Input Leakage Current 5.5 – ±0.1 ±1.0 µA VI = VCC, GND IOZ VI ((OE)) = VIL, VIH VI = VCC, GND VO = VCC , GND 5.5 – ±0.5 ±5.0 µA µ VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 µA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic O t t Current Output C t Maximum Q Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one input loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V. http://onsemi.com 3 MC74AC125, MC74ACT125 AC CHARACTERISTICS Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Max Min Max Unit tPLH Propagation g Delayy Data to Output 3.3 5.0 1.0 1.0 9.0 7.0 1.0 1.0 10 7.5 ns tPHL Propagation g Delayy Data to Output 3.3 5.0 1.0 1.0 9.0 7.0 1.0 1.0 10 7.5 ns tPZH Output Enable Time 3.3 5.0 1.0 1.0 10.5 7.0 1.0 1.0 11 8.0 ns tPZL Output Enable Time 3.3 5.0 1.0 1.0 10 8.0 1.0 1.0 11 8.5 ns tPHZ Output Disable Time 3.3 5.0 1.0 1.0 10 9.0 1.0 1.0 10.5 9.5 ns tPLZ Output Disable Time 3.3 5.0 1.0 1.0 10.5 9.0 1.0 1.0 11.5 9.5 ns *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = –40°C to +85°C Unit Conditions Typ Guaranteed Limits VIH Minimum High g Level Input Voltage 4.5 5.5 1.5 1.5 2.2 2.0 2.0 2.0 V VOUT = 0.1 V or VCC – 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC – 0.1 V VOH Minimum High g Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 – – 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 – – 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH IOH – 24 mA – 24 mA VOL Minimum Low Level Output Voltage V V IOUT = – 50 µA *VIN = VIL or VIH – 24 mA IOH – 24 mA IOUT = – 50 µA IIN Maximum Input Leakage Current 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND IOZ VI ((OE)) = VIL, VIH VI = VCC, GND VO = VCC , GND 5.5 – ±0.5 ±5.0 µA µ VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND ∆ICCT Additional Max. ICC/Input 5.5 0.6 – 1.5 mA VI = VCC – 2.1 V IOLD †Minimum Dynamic O t t Current Output C t 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min Maximum Quiescent Supply Current 5.5 – 8.0 80 µA VIN = VCC or GND IOHD ICC *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one input loaded at a time. http://onsemi.com 4 MC74AC125, MC74ACT125 AC CHARACTERISTICS Symbol 74ACT 74ACT TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Max Min Max VCC* (V) Parameter Unit tPLH Pro agation Delay Propagation Data to Output 50 5.0 10 1.0 90 9.0 10 1.0 10 ns tPHL Pro agation Delay Propagation Data to Output 50 5.0 10 1.0 90 9.0 10 1.0 10 ns tPZH Out ut Enable Output Time 50 5.0 10 1.0 85 8.5 10 1.0 95 9.5 ns tPZL Out ut Enable Output Time 50 5.0 10 1.0 95 9.5 10 1.0 10 5 10.5 ns tPHZ Out ut Disable Output Time 50 5.0 10 1.0 95 9.5 10 1.0 10 5 10.5 ns tPLZ Out ut Disable Output Time 50 5.0 10 1.0 10 10 1.0 10 5 10.5 ns *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V MARKING DIAGRAMS PDIP–14 SO–14 TSSOP–14 EIAJ–14 MC74AC125N AWLYYWW AC125 AWLYWW AC 125 ALYW 74AC125 ALYW MC74ACT125N AWLYYWW ACT125 AWLYWW ACT 125 ALYW 74ACT125 ALYW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 5 MC74AC125, MC74ACT125 PACKAGE DIMENSIONS PDIP–14 N SUFFIX 14 PIN PLASTIC DIP PACKAGE CASE 646–06 ISSUE M 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. 8 B 1 7 A F DIM A B C D F G H J K L M N L N C –T– SEATING PLANE J K H D 14 PL G 0.13 (0.005) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 8 –B– 1 P 7 PL 0.25 (0.010) 7 G M B M F R X 45 C –T– SEATING PLANE D 14 PL 0.25 (0.010) M T B J M K S A MILLIMETERS MIN MAX 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --10 0.38 1.01 M SO–14 D SUFFIX 14 PIN PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F 14 INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --10 0.015 0.039 S http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 MC74AC125, MC74ACT125 PACKAGE DIMENSIONS TSSOP–14 DT SUFFIX 14 PIN PLASTIC TSSOP PACKAGE CASE 948G–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B –U– L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A –V– ÇÇÇ ÉÉ ÇÇÇ ÉÉ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N–N –W– C 0.10 (0.004) –T– SEATING PLANE H G D DETAIL E EIAJ–14 M SUFFIX 14 PIN PLASTIC EIAJ PACKAGE CASE 965–01 ISSUE O 14 LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c b 0.13 (0.005) A1 M 0.10 (0.004) http://onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 0 10 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 0 10 0.028 0.035 --0.056 MC74AC125, MC74ACT125 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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