ONSEMI MC74HC244ANG

MC74HC244A
Octal 3-State Noninverting
Buffer/Line Driver/
Line Receiver
High−Performance Silicon−Gate CMOS
The MC74HC244A is identical in pinout to the LS244. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This octal noninverting buffer/line driver/line receiver is designed
to be used with 3−state memory address drivers, clock drivers, and
other bus−oriented systems. The device has noninverting outputs and
two active−low output enables.
The HC244A is similar in function to the HC240A.
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MARKING
DIAGRAMS
20
PDIP−20
N SUFFIX
CASE 738
1
Features
•
•
•
•
•
•
•
•
•
20
MC74HC244AN
AWLYYWWG
1
20
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7 A
Chip Complexity: 136 FETs or 34 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SOIC−20
DW SUFFIX
CASE 751D
20
1
HC244A
AWLYYWWG
1
20
HC
244A
ALYWG
G
TSSOP−20
DT SUFFIX
CASE 948E
20
1
1
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 14
1
Publication Order Number:
MC74HC244A/D
MC74HC244A
PIN ASSIGNMENT
ENABLE A
1
20
VCC
A1
2
19
ENABLE B
YB4
3
18
YA1
A2
4
17
B4
YB3
5
16
YA2
A3
6
15
B3
YB2
7
14
YA3
A4
8
13
B2
YB1
9
12
YA4
GND
10
11
B1
LOGIC DIAGRAM
A1
A2
A3
A4
DATA
INPUTS
B1
B2
B3
FUNCTION TABLE
Inputs
Enable A,
Enable B
A, B
B4
2
18
4
16
6
14
8
12
11
9
13
7
15
5
17
3
YA1
YA2
YA3
YA4
YB1
NONINVERTING
OUTPUTS
YB2
YB3
YB4
Outputs
YA, YB
L
L
L
H
H
X
Z = high impedance
L
H
Z
OUTPUT
ENABLES
1
ENABLE A
19
ENABLE B
PIN 20 = VCC
PIN 10 = GND
ORDERING INFORMATION
Package
Shipping†
PDIP−20
(Pb−Free)
18 Units / Rail
MC74HC244ADWG
SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
MC74HC244ADWR2G
SOIC−20 WIDE
(Pb−Free)
1000 / Tape & Reel
MC74HC244ADTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74HC244ADTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
NLV74HC244ADWR2G*
SOIC−20 WIDE
(Pb−Free)
1000 / Tape & Reel
NLV74HC244ADTR2G*
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
Device
MC74HC244ANG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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2
MC74HC244A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
– 0.5 to + 7.0
V
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
VCC
DC Supply Voltage (Referenced to GND)
Vin
Vout
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 35
mA
ICC
DC Supply Current, VCC and GND Pins
± 75
mA
IIK
Input Clamp Current (VI < 0 or VI > VCC)
± 20
mA
IOK
Output Clamp Current (VO < 0 or VO > VCC)
± 20
mA
PD
Power Dissipation in Still Air, Plastic DIP†
SOIC Package†
TSSOP Package†
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC, SSOP or TSSOP
Package)
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
_C
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 1)
VCC = 4.5 V
VCC = 6.0 V
0
0
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Test Conditions
VCC
V
– 55 to
25_C
Symbol
Parameter
v 85_C
v 125_C
Unit
VIH
Minimum High−Level Input Voltage
Vout = VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low−Level Input Voltage
Vout = 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
VOH
Minimum High−Level Output
Voltage
Vin = VIH
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH |Iout| v 2.4 mA
|Iout| v 6.0 mA
|Iout| v 7.8 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.2
3.7
5.2
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3
MC74HC244A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
VOL
VCC
V
– 55 to
25_C
v 85_C
v 125_C
Unit
Vin = VIL
|Iout| v 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIL |Iout| v 2.4 mA
|Iout| v 6.0 mA
|Iout| v 7.8 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.4
0.4
0.4
Parameter
Test Conditions
Maximum Low−Level Output
Voltage
Iin
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
mA
IOZ
Maximum Three−State Leakage
Current
Output in High−Impedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
± 0.5
± 5.0
± 10
mA
ICC
Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND
Iout = 0 mA
6.0
4.0
40
160
mA
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25_C
v85_C
v125_C
Unit
tPLH,
tPHL
Maximum Propagation Delay, A to YA or B to YB
(Figures 1 and 3)
2.0
3.0
4.5
6.0
96
50
18
15
115
60
23
20
135
70
27
23
ns
tPLZ,
tPHZ
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
2.0
3.0
4.5
6.0
110
60
22
19
140
70
28
24
165
80
33
28
ns
tPZL,
tPZH
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
2.0
3.0
4.5
6.0
110
60
22
19
140
70
28
24
165
80
33
28
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
23
12
10
75
27
15
13
90
32
18
15
ns
Cin
Maximum Input Capacitance
−
10
10
10
pF
Cout
Maximum Three−State Output Capacitance
(Output in High−Impedance State)
−
15
15
15
pF
Typical @ 25°C, VCC = 5.0 V
CPD
34
Power Dissipation Capacitance (Per Buffer)*
* Used to determine the no−load dynamic power consumption: P D = CPD VCC 2 f + ICC VCC .
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4
pF
MC74HC244A
SWITCHING WAVEFORMS
tr
tf
DATA INPUT
A OR B
VCC
VCC
90%
50%
10%
ENABLE
A OR B
GND
tPLH
50%
GND
tPHL
90%
50%
10%
OUTPUT
YA OR YB
tPLZ
tPZL
OUTPUT Y
tPZH
tTLH
tTHL
HIGH
IMPEDANCE
50%
OUTPUT Y
tPHZ
10%
VOL
90%
VOH
50%
Figure 1.
HIGH
IMPEDANCE
Figure 2.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
1 kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 3. Test Circuit
Figure 4. Test Circuit
PIN DESCRIPTIONS
INPUTS
function as noninverting buffers. When a high level is
applied, the outputs assume the high impedance state.
A1, A2, A3, A4, B1, B2, B3, B4
(Pins 2, 4, 6, 8, 11, 13, 15, 17)
OUTPUTS
Data input pins. Data on these pins appear in noninverted
form on the corresponding Y outputs, when the outputs are
enabled.
YA1, YA2, YA3, YA4, YB1, YB2, YB3, YB4
(Pins 18, 16, 14, 12, 9, 7, 5, 3)
Device outputs. Depending upon the state of the
output−enable pins, these outputs are either noninverting
outputs or high−impedance outputs.
CONTROLS
Enable A, Enable B (Pins 1, 19)
Output enables (active−low). When a low level is applied
to these pins, the outputs are enabled and the devices
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5
MC74HC244A
LOGIC DETAIL
TO THREE OTHER
A OR B INVERTERS
ONE OF 8
INVERTERS
VCC
DATA
INPUT
A OR B
YA
OR
YB
ENABLE A OR
ENABLE B
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6
MC74HC244A
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
−A−
20
11
1
10
B
L
C
−T−
K
SEATING
PLANE
M
N
E
G
F
J
D
20 PL
20 PL
0.25 (0.010)
0.25 (0.010)
M
T A
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
M
SOIC−20
DW SUFFIX
CASE 751D−05
ISSUE G
A
20
11
X 45 _
E
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
10X
0.25
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
B
M
D
18X
e
A1
SEATING
PLANE
C
T
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7
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74HC244A
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
L
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
S
J J1
11
B
−U−
PIN 1
IDENT
1
SECTION N−N
0.25 (0.010)
N
10
M
0.15 (0.006) T U
S
N
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
F
DETAIL E
−W−
C
G
D
0.100 (0.004)
−T− SEATING
H
DETAIL E
SOLDERING FOOTPRINT
PLANE
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC74HC244A
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74HC244A/D