MCP9501/2/3/4 Temperature Switch with Selectable Hysteresis Features Description • Factory Set Temperature Switch • Available Temperature Switch Thresholds: - TSET = -35°C,-25°C, -15°C, -5°C, 5°C, 15°C, 25°C, 35°C, 45°C, 55°C, 65°C, 75°C, 85°C, 95°C, 105°C, 115°C, 125°C • Wide Operating Voltage Range: 2.7V to 5.5V • Low Supply Current: 25 µA (typical) • Temperature Switch Accuracy: - ±1°C (typical) - ±4°C (maximum) -15°C to +75°C - ±6°C (maximum) -40°C to +125°C • Switch Threshold Options (Hot/Cold): - Rising Temp.: MCP9501/2 (Hot Option) - Falling Temp.: MCP9503/4 (Cold Option) • Output Configuration Options: - Active Low, Open-Drain Output: MCP9501/3 Microchip Technology’s MCP9501/2/3/4 family of devices are temperature switches with ±1°C (typical) accurate factory set output thresholds. These devices are ideal for high power supply systems where an overtemperature protection circuit is needed. These devices do not require external components, consume 25 µA (typical), and the factory set thresholds provide simplicity. – Uses External Pull-up Resistor - Active-High, Push-Pull Output: MCP9502/4 • User Selectable Hysteresis: 2°C or 10°C (typical) • 5-lead SOT-23 package Applications • • • • • • In addition, this family of devices provide user selectable 2°C and 10°C (typical) switch hysteresis, and various output configurations. The MCP9501/2 outputs switch for rising temperatures while the MCP9503/4 switch for falling temperature, with the relative hysteresis at the set thresholds. This family of devices is also available with Active-High Push-Pull and Active-Low Open-Drain outputs, the MCP9502/4 and the MCP9501/3, respectively. The Push-Pull output is ideal for a microcontroller interface while the Open-Drain output can be used for level shifting, wiredOR configuration, or as a heater on/off switch. The MCP9501/2/3/4 operate from 2.7V to 5.5V supply. This family is available with space saving 5-lead SOT-23 package. Package Types Power Supply Critical Temperature Shutdown Temperature Alarm Thermostat Control Fan Control Base-Stations Automotive MCP9501/2/3/4 SOT-23-5 GND 1 5 Output GND 2 Hyst 3 Typical Performance 4 VDD 50% TA = -35°C to 125°C VDD = 4.1V 32 Units Occurrences 40% 30% 20% 10% 4.0 2.0 0.0 -2.0 -4.0 0% Temperature Accuracy (°C) © 2011 Microchip Technology Inc. DS22268A-page 1 MCP9501/2/3/4 OUTPUT FUNCTIONAL DESCRIPTION MCP9501, Hot-Option (Open-Drain, Active-Low) Hysteresis V Output Note: Available temperature thresholds for Option P or for rising temperature only: +5°C, +15°C, +25°C, +35°C, +45°C, +55°C, +65°C, +75°C, +85°C, +95°C, +105°C, +115°C, +125°. Temperature COLD THYST TSET HOT MCP9502, Hot-Option (Push-Pull, Active-High) Hysteresis V Output Note: Available temperature thresholds for Option P or for rising temperature only: +5°C, +15°C, +25°C, +35°C, +45°C, +55°C, +65°C, +75°C, +85°C, +95°C, +105°C, +115°C, +125°. Temperature COLD THYST TSET HOT MCP9503, Cold-Option (Open-Drain, Active-Low) Hysteresis V Output COLD TSET THYST Note: Available temperature thresholds for Option P or for rising temperature only: +5°C, +15°C, +25°C. Note: Available temperature thresholds for Option N or for falling temperature only: -35°C, -25°C, -15°C, -5°C. Temperature HOT MCP9504, Cold-Option (Push-Pull, Active-High) Hysteresis V Output Note: Available temperature thresholds for Option P or for rising temperature only: +5°C, +15°C, +25°C. Note: Available temperature thresholds for Option N or for falling temperature only: -35°C, -25°C, -15°C, -5°C. Note: Contact Microchip for all other threshold options. Temperature COLD DS22268A-page 2 TSET THYST HOT © 2011 Microchip Technology Inc. MCP9501/2/3/4 1.0 ELECTRICAL CHARACTERISTICS Junction Temperature (TJ) .......................................... +150°C ESD protection on all pins (HBM:MM) ................. (4 kV/400V) Latch-Up Current at each pin (25°C) ....................... ±200 mA Absolute Maximum Ratings † †Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VDD.................................................................................. 6.0V Voltage at all Input/Output pins ............... GND – 0.3V to 6.0V Input/Output Current .....................................................20 mA Storage temperature .....................................-65°C to +150°C Ambient temp. with power applied ................-40°C to +125°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and GND = Ground. Parameters Sym Min Typ Max Unit -15°C ≤ TA ≤ +75°C -4 ±1 +4 °C -40°C ≤ TA ≤ +125°C -6 ±2 6 °C Conditions Sensor Accuracy Note 1 Power Supply Operating Voltage VDD 2.7 — 5.5 V Operating Current IDD — 25 40 µA Δ°C/ΔV — 0.2 — THYST — 2 — °C HYST = GND — 10 — °C HYST = VDD Line-Regulation °C/V VDD = 2.7V to 5.5V Hysteresis Trip Point Hysteresis Hysteresis Select Input VIH 0.8VDD — — V VIL — — 0.2VDD V ILeak — 0.1 — µA Open-Drain Output Leakage ILeak — 0.1 10 µA MCP9501/3 Output Voltage High VOH 0.8VDD — — V IOUT = 5 mA (MCP9502/4) Output Voltage Low VOL — — 0.2VDD V IOUT = 5 mA Turn On Time TON — 1 — ms SOT23-5 tRES — 1.7 — s Note 1: Time to 63% (89°C). +25°C (Air) to +125°C (oil bath) This specification is tested at mid supply of 4.1V for optimum operation across the supply voltage range of 2.7V to 5.5V. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and GND = Ground. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C θJA — 220.7 — °C/Ω Conditions Temperature Ranges (Note 1) Thermal Package Resistances Thermal Resistance, 5L-SOT23 Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). © 2011 Microchip Technology Inc. DS22268A-page 3 MCP9501/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, GND = Ground, RPULL-UP = 10 kΩ (MCP9501/3 only) and 0.1 µF bypass capacitor. 0.10 4.0 + St. Dev. Average - St. Dev. Spec. Limits 2.0 0.08 Leakage (µA) 0.0 -2.0 HYST Input Pin 0.04 Open-Drain Output (MCP9501/03 only) 0.02 VDD = 4.1V 32 units -4.0 0.06 -6.0 0.00 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 TA (°C) FIGURE 2-1: 40 60 80 100 FIGURE 2-4: Temperature Accuracy. Leakage vs. Temperature. 13.0 3.0 12.0 HYST = VSS 11.0 2.0 10.0 1.5 9.0 1.0 8.0 HYST = VDD 0.5 7.0 0.0 15% VOL (% of VDD) 3.5 10% 0 20 40 60 V OL, VDD = 5.5V V OL, VDD = 4.1V V OL, VDD = 2.7V 90% 85% 0% 80% -40 -20 0 20 40 80 100 120 TA (°C) FIGURE 2-2: 95% VOH, VDD = 5.5V VOH, VDD = 4.1V VOH, VDD = 2.7V 5% 6.0 -40 -20 100% FIGURE 2-5: 60 80 100 120 TA (°C) VOL,VOH vs. Temperature. Hysteresis vs. Temperature. 3.0 2.5 35 ) 2.0 V ( R O1.5 P V 1.0 95 85 VPOR (V) IDD (µA) 25 105 VPOR VDD = 5.5V VDD = 4.1V VDD = 2.7V 20 75 65 Hysteresis 0.5 15 55 0.0 -40 -20 0 20 40 60 80 100 TA (°C) FIGURE 2-3: Temperature. DS22268A-page 4 Supply Current vs. P O R H y s te re s is (m V ) 45 -40 -20 10 V VPOR Hysteresis (mV) 40 30 VOH (% of VDD) 14.0 HYST = VDD, Hysteresis (°C) HYST = VSS, Hysteresis (°C) 20% 4.0 2.5 120 T A (°C) VPOR Hysteresis (mV) Temperature Accuracy (°C) 6.0 0 120 FIGURE 2-6: vs. Temperature. 20 40 60 TA (°C) 80 100 120 Power On Reset Threshold © 2011 Microchip Technology Inc. MCP9501/2/3/4 Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, GND = Ground, RPULL-UP = 10 kΩ (MCP9501 only) and 0.1 µF bypass capacitor. 60% 60% TA = -15\°C VDD = 4.1V 492 Units 50% TA = 105\°C VDD = 4.1V 480 Units 50% s 40% e c n e rr 30% u c c 20% O Occurrences Occurrences Occurrences s 40% e c n e rr 30% u c c 20% O 10% 10% 0% FIGURE 2-7: Temperature Accuracy Distribution at -15°C. 4.0 2.0 0 0 0 . . . 0 2 -2 Temperature Accuracy (°C) (°C) (°C) TTTAAA(°C) 0 . 4 FIGURE 2-10: Temperature Accuracy Distribution at 105°C. 60% 60% TA = 5\°C VDD = 4.1V 480 Units 50% 0.0 0 . -4 -2.0 0 . 4 4.0 2.0 0.0 -2.0 -4.0 0 0 0 . . . 0 2 -2 Temperature Accuracy (°C) TA (°C) -4.0 0% 0 . 4 - TA = 115\°C VDD = 4.1V 480 Units 50% s 40% e c n e rr 30% u c c 20% O Occurrences Occurrences s 40% e c n e rr 30% u c c 20% O 10% 10% 4.0 2.0 0 0 0 . . . 0 2 -2 T (°C) TemperatureAAccuracy (°C) 0 . 4 FIGURE 2-11: Temperature Accuracy Distribution at 115°C. 60% TA = 65\°C VDD = 4.1V 480 Units 50% 0.0 0 . -4 0 . 4 FIGURE 2-8: Temperature Accuracy Distribution at 5°C. 60% -4.0 0 0 0 . . . 0 2 -2 T (°C) Temperature Accuracy (°C) A 4.0 2.0 0.0 -2.0 -4.0 0 . 4 - -2.0 0% 0% TA = 125\°C VDD = 4.1V 480 Units 50% Occurrences s 40% e c n e rr 30% u c c 20% O Occurrences s 40% e c n e rr 30% u c c 20% O 10% 10% FIGURE 2-9: Temperature Accuracy Distribution at 65°C. © 2011 Microchip Technology Inc. 0 0 0 . . . 0 2 -2 Temperature (°C) TA Accuracy (°C) 4.0 2.0 0 . -4 0.0 0% -2.0 .0 4 -4.0 .0 .0 .0 2 0 2 TA (°C)Accuracy (°C) Temperature 4.0 2.0 0.0 .0 -4 -2.0 -4.0 0% 0 . 4 FIGURE 2-12: Temperature Accuracy Distribution at 125°C. DS22268A-page 5 MCP9501/2/3/4 3.0 PIN DESCRIPTIONS TABLE 3-1: PIN FUNCTION TABLE MCP9501/2/3/4 Symbol Description SOT-23-5 1 GND Ground 2 GND Ground (must be connected to ground) 3 HYST Hysteresis Selection Input: HYST = GND → Hysteresis is 2°C (typical) HYST = VDD → Hysteresis is 10°C (typical) 4 VDD 5 Output Power pin Output Options: MCP9501 → Open-Drain, Active-Low Output (Hot-Option) MCP9502 → Push-Pull, Active-High Output (Hot-Option) MCP9503 → Open-Drain, Active-Low Output (Cold-Option) MCP9504 → Push-Pull, Active-High Output (Cold-Option) 3.1 Ground (GND) 3.3 Power Pin (VDD) The GND pin is the system ground pin. Pin 2 must be connected to system ground. Pin 1 can also be connected to system ground which would provide better thermal conduction to the die. The operating voltage range, as specified in the DC electrical specification table, is applied on this pin. 3.2 This output is triggered when temperature rises or falls beyond the programmed trip temperature threshold. MCP9501/3 require an external pull-up resistor. Hysteresis Input (HYS) This is an input pin which can be connected to VDD or GND to select output hysteresis. Either 2°C (HYST = GND) or 10°C (HYST = VDD) of typical hysteresis can be selected. DS22268A-page 6 3.4 Switch Output (Output) © 2011 Microchip Technology Inc. MCP9501/2/3/4 NOTES: © 2011 Microchip Technology Inc. DS22268A-page 7 MCP9501/2/3/4 FUNCTIONAL DESCRIPTION The MCP9501/2/3/4 temperature switch family integrates a thermal diode, a comparator, and a factory selectable resistive network used to set the temperature thresholds. The available output thresholds range from -35°C to 125°C at 10°C increments. There is no additional configuration required to operate this device. The selectable output hysteresis is controlled using a single input pin. When this pin is connected to ground, the output hysteresis is 2°C (typical) and when connected to VDD the output hysteresis is 10°C (typical). Figure 4-1 shows the functional block diagram. Hot-Option (Active-Low) 10°C Typical Hysteresis V 2°C Typical Hysteresis Output 4.0 TSET THYST ISET Rx + Cold OUT/ OUT Cold-Option (Active-High) - Hot Temperature 10°C Typical Hysteresis V 2°C Typical Hysteresis Thermal Diode Output Threshold Select Hysteresis Select Pin FIGURE 4-1: Functional Block Diagram. There are two output configurations for this family, a push-pull and an open-drain output with active-high and active-low assertions. These assertion options are referred to as Cold and Hot options, primarily due to the direction of selected hysteresis. For the Cold option, temperature has to fall below the threshold for the output to assert High, and de-assert Low when the temperature rises above the threshold plus the hysteresis. For example, a 65°C threshold and 2°C (typical) hysteresis, when temperature falls below 65°C the output asserts High, and the de-asserts Low when temperature rises above 67°C. For the Hot option, the opposite is true. When temperature rises above 65°C, the output asserts Low, and de-asserts High when the temperature falls below 63°C. Figure 4-2 shows a graphical description for the Hot and Cold options. DS22268A-page 8 TSET Cold THYST Hot Temperature FIGURE 4-2: Output Hysteresis. The Push-Pull output is ideal for a microcontroller interface using an input/output pin or an interrupt input pin. The open-drain option can be used with multiple sensors in a wired-OR configuration or as a level shifter. © 2011 Microchip Technology Inc. MCP9501/2/3/4 4.1 4.1.1 Application Information The MCP9501/2/3/4 temperature switch family integrates a temperature sensor and a comparator circuit which outputs an alert signal when the factory set temperature threshold is exceeded. No additional component is required for device operation, which provides simplicity to the system designer. The device output options provide design flexibility for various applications such as overtemperature protection circuit or a closed loop temperature control unit. This device can be interfaced to a closed loop fan controller network without the need for a microcontroller. 12V M 5VDD LAYOUT CONSIDERATION AND THERMAL CONSIDERATION This family of sensors measures temperature by monitoring the voltage level of a thermal diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors PCB temperature. For efficient performance, it is recommended to layout the device as close to the heat source as possible. When connecting an external resistor to the MCP9501/ 3, the current through the pull-up resistor must be considered to prevent self-heat due to power. This can be determined using Equation 4-1. EQUATION 4-1: EFFECT OF SELF-HEATING T J – T A = θ JA ( VDD × I DD + V OL × IOUT ) Where: HYST MCP9502 FIGURE 4-3: MCP9502. Output Fan Controller Using The MCP9501/2/3/4 provide Open-Drain output where multiple sensors from multiple PCB hot-spots can be connected to a single processor I/O input with a wiredOR configuration. The MCP9501 requires an external pull-up resistor which can be used to level-shift the alert signal. For example, if the sensors are powered with 5VDD and the controller or processor is powered with 3VDD, the external resistor can be level-shifted by connecting 3VDD to the pull-up resistor as shown in Figure 4-4. TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (220.7 °C/W) VOL = Sensor Output Low Voltage IOUT = Output Current For example, at room temperature, when the output asserts Active-Low and maximum IDD = 50 µA, VDD = 5.5V, VOL = 0.3V and IOUT = 5 mA (see the specification table), the self heating due to power dissipation (TJ - TA) is ~0.4°C. 5VDD 5VDD RPULL_UP 3VDD MCP9501 OUT HYST 85°C Microcontroller I/O HYST MCP9503 OUT 35°C FIGURE 4-4: MCP9501 Wired-OR Output Configuration with Level-shift. © 2011 Microchip Technology Inc. DS22268A-page 9 MCP9501/2/3/4 4.1.2 POWER SUPPLY REJECTION The MCP9501/2/3/4 family does not require any additional components. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the power pins in order to provide effective noise protection. The MCP9501/2/3/4 family of sensors is designed to prevent false output trigger due to high frequency power supply or system noise. Figure 4-6 shows the device performance with a high frequency signal added on VDD. The output is not triggered due to the signal added on VDD. With some applications, it is recommended to add a bypass capacitor of 0.1 µF to 1 µF. 6 MCP9501/2/3/4 TSET = 25\°C Power Supply Rejection 200Ω VDD Switching Regulator 0.1 µF bypass MCP9501/2/3/4 Switching Regulator 200Ω Linear Regulator 0.1 µF bypass FIGURE 4-5: Single Resistor. ) 5 V ( e4 g ta l o3 V t u p t 2 u O 1 Output Voltage (V) MCP9501/2/3/4 0 VDD No False Trigger TSET = 25\°C TA = 23\C ° VDD = 5V + 400mVAC VDD = 5V + 400mVSQR 10 0 1 100 FIGURE 4-6: 0 0 1 1000 k k 0 (Hz) 1Frequency 1 Frequency (Hz) 10000 100000 k 0 0 1 1000000 M 1 10000000 M 0 1 Power Supply Rejection. Power-supply Filter using a For applications where a switching regulator is used to power the sensor, it is recommended to add a 200Ω resistor in series to VDD to filter out the switcher noise. It is also recommended to add the series resistor in applications where a linear regulator is used to step-down a switching regulator voltage to power the sensor, as shown in Figure 4-5. For example, if a linearly regulated 3.3V from a 5V switching regulator is used to power the sensor, add a 200Ω series resistor. DS22268A-page 10 © 2011 Microchip Technology Inc. MCP9501/2/3/4 NOTES: © 2011 Microchip Technology Inc. DS22268A-page 11 MCP9501/2/3/4 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Example: 5-Lead SOT-23 4 5 XL25 XXNN 1 4 5 2 3 1 Device Code MCP9501PT-005E/OT WVNN MCP9501PT-015E/OT MCP9501PT-025E/OT MCP9501PT-035E/OT MCP9501PT-045E/OT 2 Device Code MCP9502PT-005E/OT XLNN WWNN MCP9502PT-015E/OT XMNN WXNN MCP9502PT-025E/OT XPNN WYNN MCP9502PT-035E/OT XQNN WZNN MCP9502PT-045E/OT XRNN MCP9501PT-055E/OT X1NN MCP9502PT-055E/OT XSNN MCP9501PT-065E/OT X2NN MCP9502PT-065E/OT XTNN 3 Hot Options MCP9501PT-075E/OT X3NN MCP9502PT-075E/OT XUNN MCP9501PT-085E/OT X4NN MCP9502PT-085E/OT XVNN MCP9501PT-095E/OT X5NN MCP9502PT-095E/OT XWNN MCP9501PT-105E/OT X6NN MCP9502PT-105E/OT XXNN MCP9501PT-115E/OT X7NN MCP9502PT-115E/OT XYNN MCP9501PT-125E/OT X8NN MCP9502PT-125E/OT XZNN MCP9503PT-005E/OT XHNN MCP9501PT-005E/OT Y9NN MCP9503PT-015E/OT XJNN MCP9501PT-015E/OT YANN MCP9503PT-125E/OT XKNN MCP9501PT-025E/OT YBNN Cold Options MCP9503NT-005E/OT XBNN MCP9501NT-005E/OT Y3NN MCP9503NT-015E/OT XCNN MCP9501NT-015E/OT Y4NN MCP9503NT-025E/OT XDNN MCP9501NT-025E/OT Y5NN MCP9503NT-035E/OT XENN MCP9501NT-035E/OT Y6NN Note: Legend: XX...X Y YY WW NNN e3 * Note: DS22268A-page 12 Contact Microchip for all other threshold options. Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2011 Microchip Technology Inc. MCP9501/2/3/4 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± %6& )RRW/HQJWK / ± )RRWSULQW / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% © 2011 Microchip Technology Inc. DS22268A-page 13 MCP9501/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22268A-page 14 © 2011 Microchip Technology Inc. MCP9501/2/3/4 APPENDIX A: REVISION HISTORY Revision A (January 2011) • Original Release of this Document. © 2011 Microchip Technology Inc. DS22268A-page 15 MCP9501/2/3/4 NOTES: DS22268A-page 16 © 2011 Microchip Technology Inc. MCP9501/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device -XXXX X Temperature Temperature Switch Threshold Range Device: /XX Package MCP9501P: Resistor Programmable Temperature Switch, Hot Option MCP9502P Resistor Programmable Temperature Switch, Hot Option MCP9503N: Resistor Programmable Temperature Switch, Cold Option MCP9504N Resistor Programmable Temperature Switch, Cold Option Temperature Switch Threshold: 005, 015, 025, 035, 045, 055, 065, 075, 085, 095, 105, 115, 125 Temperature Range: E Package: OT = Plastic Small Outline Transistor (SOT-23), 5-lead Examples: a) b) c) = -40°C to +125°C d) e) f) g) h) © 2011 Microchip Technology Inc. MCP9501PT-025E/OT: Active-Low, Open-Drain Output, 25°C Switch Threshold, Hot Option, Extended Temp., 5LD SOT-23 pkg. MCP9502PT-025E/OT: Active-High, Push-Pull Output, 25°C Switch Threshold, Hot Option, Extended Temp., 5LD SOT-23 pkg. MCP9503NT-025E/OT: Active-Low, Open-Drain Output, -25°C Switch Threshold, Cold Option, Extended Temp., 5LD SOT-23 pkg. MCP9504NT-025E/OT: Active-High, Push-Pull Output, -25°C Switch Threshold, Cold Option, Extended Temp., 5LD SOT-23 pkg. MCP9501PT-105E/OT: Active-Low, Open-Drain Output, 105°C Switch Threshold, Hot Option, Extended Temp., 5LD SOT-23 pkg. MCP9502PT-105E/OT: Active-High, Push-Pull Output, 105°C Switch Threshold, Hot Option, Extended Temp., 5LD SOT-23 pkg. MCP9503NT-035E/OT: Active-Low, Open-Drain Output, -35°C Switch Threshold, Cold Option, Extended Temp., 5LD SOT-23 pkg. MCP9504NT-035E/OT: Active-High, Push-Pull Output, -35°C Switch Threshold, Cold Option, Extended Temp., 5LD SOT-23 pkg. DS22268A-page 17 MCP9501/2/3/4 NOTES: DS22268A-page 18 © 2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-861-0 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2011 Microchip Technology Inc. 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