MITSUBISHI (OPTICAL DEVICES) Mitsubishi Electric Corp. Series Datasheet 100Mbps-2.7Gbps, Multi-Rate DWDM MF-27WXE SFP TRANSCEIVER MODULE 2.7Gbps Multi-Rate DWDM SFP Transceiver with Digital Diagnostic Monitoring Interface MF-27WXE Series 1. Description This transceiver is compliant with Small Form-factor Pluggable (SFP) MSA, and optimized for 100Mbps to 2.7Gbps Dense Wavelength Division Multiplexing (DWDM) applications. The optical subassembly consists of two parts, the transmitter with a cooled DFB laser in a hermetic sealed module, and the receiver with an APD preamp in a hermetic sealed coaxial module and integrated circuits for reshaping received optical signals. The built-in serial ID recognition is incorporated, which allows users to interface with two wire serial interface that displays information on manufacturer, part number, link, distance, and other parameters. The Digital Diagnostic Monitoring interface is incorporated, which monitors transceiver parameters including Temperature, Supply voltage, Laser bias current, Laser power and Received optical power. 2. Features • • • • • • • • • • • • • • Small Form-factor Pluggable (SFP) MSA compliant transceiver with SONET/SDH system Quality All 100GHz C-band wavelengths line-up for DWDM ITU-T grid 100Mbps to 2.7Gbps Multi-Rate operation capability Transmission target distance up to 80km (1600ps/nm) / 120km (2400ps/nm) / 160km (3200ps/nm) LC duplex receptacle Single +3.3V power supply Differential data inputs and outputs Operating case temperature range -5°C to +70°C Comply with SFF-8472 MSA Incorporating Digital Diagnostic Monitoring Interface with Internal calibration Serial ID Functionality APD receiver Bail latch type RoHS Compliant UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 1 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 3. Block diagram APD BIAS CIRCUIT (DC/DC Converter) Rx Received Po Monitor Circuit Signal Detect RX_LOS Circuit RD- APD OPT_IN Limiting Amp &Low pass Fil. RD+ TIA MOD_DEF[2] Memory MOD_DEF[1] Control Circuits (DDM) ROSA Temperature Monitor Circuit Supply Voltage Monitor Circuit TX_FAULT LD Bias & Pout Monitor Circuit Fault Detector TDDriver LD TD+ OPT_OUT L Bias TX_DISABLE Monitor PD circuit A.T.C Cooler/ Sensor TOSA 4. Absolute Maximum Ratings Stress below listed absolute maximum rating may cause permanent damage to the module. This is a stress only and functional operation of the module at these or any other conditions in excess of those given in the operational sections of this data sheet. Exposure to Absolute Maximum Rating for extended periods may affect module reliability. Parameters Supply voltage Storage temperature Operating case temperature Relative humidity (non condensation) UQ9-06-010 Ed:1.4 Symbol Vcc Tstg Tc - Ratings 0 to +4.0 -40 to +85 -5 to +70 5 to 85 Unit V °C °C % Date:02.Nov.2006 Page 2 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 5. Electrical characteristics All parameters are specified over the operating case temperature. Measurement conditions are at 2.666057Gbps +/-20ppm, NRZ PN223-1 and 50%duty cycle data signal. The DATA input/output signal interface is AC-coupled internally. TX_DISABLE input signal level is LVTTL compatible. (With internally pull-up 4.7k to 10kΩ) TX_FAULT and LOS (Loss Of Signal) output are Open-Collector/drain, and the levels indicated assuming 4.7k to 10k ohm pull up resistor to Host_Vcc is present. Parameters Supply voltage Power consumption TX_DISABLE Input voltage TX_FAULT Output voltage RX_LOS Output voltage MOD_DEF[2] Output voltage MOD_DEF[1], [2] Input voltage Input Amplitude, Differential Input Impedance, Differential Output Amplitude, Differential Output Impedance, Differential Data Output Rise/Fall Time (20% to 80%) Electrical Input Data Return Loss 100MHz < f < 1.2GHz(Differential) Electrical Input Data Return Loss 1.2GHz < f < 2.7GHz(Differential) UQ9-06-010 Ed:1.4 Symbol Vcc Pc VIH VIL VOH VOL VOH VOL VOH VOL VIH VIL VT RT VO RO Min. 3.13 2.0 0 2.0 0 2.0 0 Vcc × 0.8 Vcc × 0.7 0 500 370 - Typ. 3.3 1.0 100 100 Max. 3.47 1.4 Vcc 0.8 Vcc 0.5 Vcc 0.5 Vcc 0.4 Vcc Vcc × 0.3 1800 1600 - Unit V W V V V V V V V V V V mVP-P Ω mVP-P Ω Tr/Tf - - 150 ps Rld1 12 - - dB Rld2 8 - - dB Date:02.Nov.2006 Page 3 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 6. Optical characteristics All parameters are specified over the operating case temperature. Measurement conditions are at 2.666057Gbps +/-20ppm, NRZ PN223-1 and 50%duty cycle data signal. Transmitter Parameter Wavelength (note 1) Optical source Optical power BOL (3.3V, 25degC) Optical power EOL Optical power when disable Spectral width (-20dB) Wavelength deviation BOL Wavelength deviation EOL SMSR Extinction ratio Optical waveform Return Loss at S Chromatic Dispersion (-M31) Chromatic Dispersion (-M11) Chromatic Dispersion (-M21) Path penalty (-M31) Path penalty (-M11, M21) Jitter Generation (note 2) -Bandwidth 12KHz to 20MHz Jitter Generation (note 2) -Bandwidth 12KHz to 20MHz note1: Wavelength table Code Wavelength 630 1527.22 620 1527.99 610 1528.77 600 1529.55 590 1530.33 580 1531.12 570 1531.90 560 1532.68 550 1533.47 540 1534.25 530 1535.04 520 1535.82 UQ9-06-010 Ed:1.4 Code 510 500 490 480 470 460 450 440 430 420 410 400 Min. 1527.22 Max. 1563.86 SLM +1 +4 0 +4 -40 0.4 -50 +50 -100 +100 30 8.2 SONET/SDH Mask compliant 24 1600 2400 3200 2 3 Wavelength 1536.61 1537.40 1538.19 1538.98 1539.77 1540.56 1541.35 1542.14 1542.94 1543.73 1544.53 1545.32 Unit nm dBm dBm dBm nm pm pm dB dB dB ps/nm ps/nm ps/nm dB dB - 0.007 UIrms - 0.07 UIpp Code 390 380 370 360 350 340 330 320 310 300 290 280 Wavelength 1546.12 1546.92 1547.72 1548.51 1549.32 1550.12 1550.92 1551.72 1552.52 1553.33 1554.13 1554.94 Code 270 260 250 240 230 220 210 200 190 180 170 Wavelength 1555.75 1556.55 1557.36 1558.17 1558.98 1559.79 1560.61 1561.42 1562.23 1563.05 1563.86 Date:02.Nov.2006 Page 4 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE note2: Jitter Generation (ITU-T G.783 compliant) Jitter Electrical Output of Jitter Analyzer Data out+ Analyzer SFP Rx Data out- SFP Tx Opt. ATT TxDTxD+ Receiver Parameter Wavelength Sensitivity BOL (3.3V, 25degC, BER=1E-10) Sensitivity EOL (BER=1E-10) Overload BOL (3.3V, 25degC) Overload EOL RX_LOS Assert Level RX_LOS De-assert Level RX_LOS Hysteresis Jitter Tolerance, Transfer Maximum reflectance of receiver at R UQ9-06-010 Ed:1.4 Min. 1525 Max. 1565 Unit nm - -29 dBm -28 -7 -8 -39 -29 0.3 4.0 ITU-T G.783 Compliant (with reference CDR) -27 dBm dBm dBm dBm dBm dB dB Date:02.Nov.2006 Page 5 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 7. Digital Diagnostic Monitoring Accuracy The diagnostic monitoring features internal calibration, and is calibrated over operating temperature and voltage range. The monitor parameters are represented as defined in SFF-8472. These parameters of the monitoring accuracy are guaranteed, as long as operating conditions of this SFP transceiver do not exceed ranges defined below. Digital Diagnostic Monitoring Accuracy Parameter Min. Max. Unit Range for Accurate Monitoring * Transceiver Temperature -3 +3 °C -5 to 70°C Supply Voltage -3 +3 % 3 to 3.6 V TX Bias Current -10 +10 % TX Optical Power -3 +3 dB 0 to 4 dBm RX Optical Power -3 +3 dB -29 to -7dBm *Transceiver Temperature is defined as an internal temperature. 8. Transceiver pin allocation No. Symbol Description No. Symbol Description 1 TX GND Transmitter Ground 11 RX GND Receiver Ground 2 TX_FAULT Transmitter Fault Indication 12 RD- Receiver Data Output-Bar 3 TX_DISABLE Transmitter Disable 13 RD+ Receiver Data Output 4 MOD_DEF[2] Module Definition 2 14 RX GND Receiver Ground 5 MOD_DEF[1] Module Definition 1 15 RX Vcc Receiver Power Supply 6 MOD_DEF[0] Module Definition 0 16 TX Vcc Transmitter Power Supply 7 NUC No user connection 17 TX GND Transmitter Ground 8 RX_LOS Loss of Signal 18 TD+ Transmitter Data in 9 RX GND Receiver Ground 19 TD- Transmitter Data in-Bar 10 RX GND Receiver Ground 20 TX GND Transmitter Ground UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 6 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 9. Pin Descriptions Pin No. 1,17,20 Function TX GND 9,10, 11,14 16 RX GND I TX Vcc * I 15 RX Vcc * I 18,19 TD+ / TD- I 3 TX_DISABLE I 12,13 RD+ / RD- O 8 RX_LOS O 2 TX_FAULT O 6,5,4 MOD_DEF [0:2] - 7 NUC - UQ9-06-010 Ed:1.4 I/O I Pin description These pins are the Transmitter ground connections. They should be connected to a low impedance ground plane (0V). These pins are the Receiver ground connections. They should be connected to a low impedance ground plane (0V). This is the power supply pin for the Transceiver part. It should be connected to +3.3V. Recommended power supply decoupling. (See Figure 8) This is the power supply pin for the Receiver part. It should be connected to +3.3V. Recommended power supply decoupling. (See Figure 8) * Both TX Vcc and RX Vcc have been internally connected due to supply of control circuit Vcc. This data input pin modulates the laser diode. When the TD+ input is asserted, the laser diode is turned on. They are internally AC-coupled into an equivalent load of RI differential, as shown in Figure 8. Active high TTL input, with internal 7.4k ohm pull-up resistor to Vcc. Asserting the transmitter disable will deactivate the laser within the assert time. Table 1 indicates the timing of TX_DISABLE. Received Data Out and Inverted Received Data Out are differential serial output from the receiver. These are AC-coupled 100 ohm differential lines which should be terminated with a 100 ohm (differential) at the user SERDES, as shown in Figure 8. AC coupling is done inside the module and is thus not required on the host board. Active high open collector/drain output that indicates a loss-of-signal condition (LOS). When the average optical power received by the module is below the Assert Level, RX_LOS is indicated. Table 1 indicates the timing of RX_LOS. RX_LOS requires a 4.7k to 10k ohm pull-up resistor external to the module, i.e., in the host system Host_Vcc, as shown in Figure 8. The pull-up voltage is between 2.0 V and VccR (VccT) + 0.3 V. Active high open collector/drain output that indicates a fault in the module. This can be failure of the laser diode. Under this condition, TX_FAULT will activate and be latched. And then the laser will be deactivated within the assert time. TX_FAULT also requires a 4.7k to 10k ohm pull-up resistor externally, i.e. in the host system Host_Vcc, as shown in Figure 8. The pull-up voltage is between 2.0 V and VccT (VccR) +0.3V. Toggling TX_DISABLE high for at least t_reset can reset it. See Figure 8 and Figure 5. This module has a serial ID function, which provides information about the transceiver’s capabilities, standard interfaces, manufacturer and other information. This function is provided via a two wire serial EEPROM interface. MOD_DEF[0] is connected to ground inside the module.(LOW) MOD_DEF[1] is the serial clock signal input.(SCL) MOD_DEF[2] is the data output/input.(SDA) They should be pulled up with 4.7Kohm -10Kohm resistor on the host board. The pull-up voltage shall be VccT or VccR. The serial ID definitions are as given in the “SFP-MSA” standard. These pins are No User Connection and should be left open. Date:02.Nov.2006 Page 7 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE Table 1 Timing of control and status I/O The timing of the control and status line are listed in below and Figure 1 to 7. Parameter TX_DISABLE Assert Time TX_DISABLE Negate Time Time to Initialize, Including Reset of TX_FAULT TX_FAULT Assert Time TX_DISABLE to Reset RX_LOS Assert Time RX_LOS Negate Time Serial ID Clock Rate Symbol Min Max Unit Condition Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal From power on or negation of TX_FAULT using TX_DISABLE t_off - 10 μs t_on - 1 ms t_init - 300 ms T_fault - 100 μs Time from fault to TX_FAULT on T_reset 10 - μs t_losson - 100 μs t_lossoff - 100 μs f_clock - 100 kHz Time TX_DISABLE must be held high to reset TX_FAULT Time from LOS state to RX_LOS Assert Time from non-LOS state to RX_LOS de-assert - Figure 1 Power on initialization of SFP transceiver, TX_DISABLE negated Figure 2 Power on initialization of SFP transceiver, TX_DISABLE asserted Figure 3 SFP TX_DISABLE timing during normal operation UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 8 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE Figure 4 Detection of transmitter fault condition Figure 5 Successful recovery from transient fault condition Figure 6 Unsuccessful recovery from fault condition Figure 7 Timing of RX_LOS detection UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 9 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE Figure 8 Example of SFP Host Board Schematic SFP Module Host Board Protocol Vcc TD+ LASER DRIVER 100 ohm TD- 4.7k to 10k ohm TX_FAULT TX_DISABLE 7.4k ohm TX GND TX Vcc 0.1 uF 1 uH 10 uF +3.3V 1 uH RX Vcc PROTOCOL IC 0.1 uF 10 uF RX GND SERDES IC 0.1 uF 10 uF RD+ PREAMP & POSTAMP 100 ohm RDRX_LOS 4.7k to 10k ohm Rate Select 0 Rate Select 1 33k ohm 33k ohm +3.3V 4.7k to 10k ohm 4.7k to 10k ohm MOD_DEF[0] SERIAL ID MOD_DEF[1] PLD/PAL MOD_DEF[2] 4.7k to 10k ohm UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 10 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 10. Type Number MF - 27WXE – M 1 1 Z A 630 Center Wavelength (See Table 1) M1: 120km (2400ps/nm) version M2: 160km (3200ps/nm) version M3: 80km (1600ps/nm) version Table 1 Code 630 620 610 600 590 580 570 560 550 540 530 520 Wavelength 1527.22 1527.99 1528.77 1529.55 1530.33 1531.12 1531.90 1532.68 1533.47 1534.25 1535.04 1535.82 Code 510 500 490 480 470 460 450 440 430 420 410 400 Wavelength 1536.61 1537.40 1538.19 1538.98 1539.77 1540.56 1541.35 1542.14 1542.94 1543.73 1544.53 1545.32 Code 390 380 370 360 350 340 330 320 310 300 290 280 Wavelength 1546.12 1546.92 1547.72 1548.51 1549.32 1550.12 1550.92 1551.72 1552.52 1553.33 1554.13 1554.94 Code 270 260 250 240 230 220 210 200 190 180 170 Wavelength 1555.75 1556.55 1557.36 1558.17 1558.98 1559.79 1560.61 1561.42 1562.23 1563.05 1563.86 11. Reliability reference Telcordia GR-468-CORE Radiated Emission:IEC61000-6-3 Immunity:IEC61000-4-2, IEC61000-4-3 Flammability: UL94V-0 ESD for PIN Interface: 500V by Human body model (with Rd=1500ohm and Cd=100pF) 12. Laser Safety Information Class 1 Laser Product (IEC60825 and CDRH compliant) UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 11 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 13. General Outline Drawing [unit: mm] UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 12 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE 14. Packing Ten SFPs are packed up in this packing box. Presses Plate SFP Dust Cap Packing box - Capacity: 10pcs. / box - Packing box and Presses Plate material : Cardboard with ESD protection coat. This product is sensitive to electrostatic discharge. Take precautions to prevent ESD; use wrist straps, grounded work surfaces and recognized anti-static techniques when handling SFP module. Mitsubishi reserves the right to change the circuitry and specifications without notice at any time. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 13 of 14 MITSUBISHI (OPTICAL DEVICES) MF-27WXE Series 100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE Safety Cautions for Use of Optoelectronic Devices General: Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that result in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly observed. Warning! 1. Eye safety : Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate instruments. 2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it. 3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and general garbage. Handling Cautions for Optoelectronic Devices 1. General: (1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability. (2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor. 2. Shipping Conditions: (1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems. (2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices. (3) Take strict precautions to keep the devices dry when shipping under rain or snow. 3. Storage Conditions: When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions): (1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for six months or more. (2) The atmosphere should be particularly free from toxic gases and dust. (3) Do not apply any load on the product. (4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customer’s assembling process. (5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing. Temperature in storage locations should be stable. (6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere. (7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products. 4. Design Conditions and Environment under Use: (1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may lead to serious accidents. (2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed those ratings even for a short time. 5. ESD Safety Cautions: The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this product, please observe the following countermeasures: <Countermeasures against Static Electricity and Surge> To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line: (1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage. (2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly recommended. (3) Use conductive materials for this product’s container, etc. (4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc. (5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts. ESD may damage the product. (6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading. The end of document UQ9-06-010 Ed:1.4 Date:02.Nov.2006 Page 14 of 14