PL IA NT Features CO M ■ *R oH S ■ ■ ■ ■ ■ ■ Applications Very low profile Very fast tripping time High voltage RoHS compliant* Symmetrical 2018 footprint Agency recognition: Power Over Ethernet (IEEE 802.3 af) port protection Automotive electronic control module protection Telecom equipment low voltage protection ■ ■ ■ T V Rheinland MF-SMDF Series - PTC Resettable Fuses Electrical Characteristics Ihold V max. Volts Model I max. Amps Itrip Max. Time To Trip Resistance Amperes at 23 °C Hold Trip Ohms at 23 °C RMin. R1Max. Tripped Power Dissipation Amperes at 23 °C Seconds at 23 °C Watts at 23 °C Typ. MF-SMDF050 60 10 0.55 1.20 0.200 1.0 2.5 3.0 0.9 MF-SMDF100* 15 40 1.1 2.20 0.06 0.36 8.0 0.4 1.0 MF-SMDF150* 15 40 1.5 3.00 0.05 0.17 8.0 0.8 1.1 MF-SMDF200 10 40 2.0 4.00 0.03 0.100 8.0 2.40 1.1 *Agency approval pending. Environmental Characteristics Operating Temperature ......................................-40 °C to +85 °C Maximum Device Surface Temperature in Tripped State ................................................125 °C Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-SMDF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number ..............................CA110338 http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000 TÜV Certificate Number ....................R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 Thermal Derating Chart - Ihold / Itrip (Amps) Ambient Operating Temperature Model -40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C MF-SMDF050 0.87 / 1.90 0.77 / 1.68 0.67 / 1.46 0.55 / 1.20 0.46 / 1.00 0.41 / 0.89 0.36 / 0.79 0.31 / 0.68 0.23 / 0.50 MF-SMDF100 1.71 / 3.42 1.52 / 3.04 1.32 / 2.64 1.10 / 2.20 0.94 / 1.88 0.84 / 1.68 0.74 / 1.48 0.64 / 1.28 0.50 / 1.00 MF-SMDF150 2.38 / 4.76 2.10 / 4.20 1.82 / 3.64 1.50 / 3.00 1.27 / 2.54 1.13 / 2.26 0.99 / 1.98 0.85 / 1.70 0.64 / 1.28 MF-SMDF200 2.95 / 5.90 2.65 / 5.30 2.35 / 4.70 2.00 / 4.00 1.74 / 3.48 1.59 / 3.18 1.44 / 2.88 1.29 / 2.58 1.06 / 2.12 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series - PTC Resettable Fuses Product Dimensions A Model B Min. 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF200 Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) C Min. 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) Max. 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) Min. 0.79 (0.031) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) Packaging: 3000 pcs. per reel. Top and Bottom View A D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Max. 1.09 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) UNIT = Side View Recommended Pad Layout C 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 4.6 ± 0.1 (.181 ± .004) B MM (INCHES) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. 3.4 ± 0.1 (.134 ± .004) D Typical Time to Trip at 23 ˚C 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-SMDF050 Time to Trip (Seconds) 10 1 MF-SMDF200 0.1 MF-SMDF100 0.01 MF-SMDF150 0.001 0.1 1 10 Fault Current (Amps) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 100 MF-SMDF Series - PTC Resettable Fuses Solder Reflow Recommendations Preheating Soldering MF - SMDF 050 - 2 Cooling Multifuse® Product Designator Series SMDF = 2018 Surface Mount Component Temperature (°C) 250 200 Hold Current, Ihold 050, 100, 150, 200 (0.50 - 2.00 Amps) 150 Packaging Packaged per EIA 481-1 -2 = Tape and Reel 100 50 Typical Part Marking Represents total content. Layout may vary. 0 160–220 10–20 BI-WEEKLY DATE CODE: WEEKS 49-50 = Y 120 Time (seconds) Notes: • MF-SMDF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. 505Y 300 How to Order YEAR CODE: 5 = 2005 PART IDENTIFICATION: 50 = MF-SMDF050 10 = MF-SMDF100 15 = MF-SMDF150 20 = MF-SMDF200 MF-SMDF SERIES, REV. J, 05/06 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series Tape and Reel Specifications MF-SMDF Series per EIA 481-2 Tape Dimensions W 16.0 ± 0.3 (0.630 ± 0.012) P0 4.0 ± 0.1 (0.157 ± 0.004) P1 P2 8.0 ± 0.1 (0.315 ± 0.004) 2.0 ± 0.1 (0.079 ± 0.004) A0 5.1 ± 0.15 (0.201 ± 0.006) B0 5.6 ± 0.23 (0.220 ± 0.009) 12.1 (0.476) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 7.5 ± 0.10 (0.295 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) B1 max. D0 F E1 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) E2 min. T max. T1 max. 1.0 ± 0.15 (0.039 ± 0.015) K0 390 (15.35) 160 (6.30) Leader min. Trailer min. Reel Dimensions 331 (13.03) 50 (1.97) A max. N min. 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) W1 W2 max. UNIT = P0 T D0 P2 MM (INCHES) E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 W1(MEASURED AT HUB) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.