RoHS MLB03 Multilayer Ferrite Beads Dimensions: 0.039±0.004 Inches (mm) (1.0±0.10) 0.020±0.004 (0.50±0.10) 0.020±0.004 (0.50±0.10) 0.010±0.004 0.016 (0.40) (0.25±0.10) 0.016 (0.40) Allied Part Number Impedance (Ω) @ 100 MHz +/- 25% MLB03-060-RC MLB03-100-RC MLB03-300-RC MLB03-330-RC MLB03-400-RC MLB03-470-RC MLB03-600-RC MLB03-700-RC MLB03-750-RC MLB03-800-RC MLB03-900-RC MLB03-101-RC MLB03-121-RC MLB03-151-RC MLB03-221-RC MLB03-241-RC 6 10 30 33 40 47 60 70 75 80 90 100 120 150 220 240 0.05 0.05 0.30 0.30 0.30 0.40 0.40 0.40 0.40 0.40 0.50 0.50 0.50 0.50 0.50 0.50 500 500 300 300 300 300 300 300 300 300 300 300 300 300 300 300 MLB03-301-RC MLB03-331-RC MLB03-481-RC 300 330 480 0.80 0.80 0.80 300 300 300 DC Resistance (Ω) Max. 1.00 600 MLB03-601-RC 1.50 1000 MLB03-102-RC 2.00 1500 MLB03-152-RC *Temperature rise ∆T=30ºC at rated current. All specifications subject to change without notice. *Rated Current (mA) 300 100 60 0.018 (0.46) Features • • • • Surface mount EMI suppression components Nickel barrier termination for excellent resistance to solder heat Multi layer technology Flow and reflow soldering Electrical Impedance Range: 6Ω to 1500Ω Tolerance: 25% over entire range Operating Range: -55ºC ~ +125ºC Storage Temp: Under 25ºC at 40~60% Humidity Rated Current: Based on temp rise not to exceed 30ºC Resistance to Solder Heat Pre-Heat 150ºC, 1 minute Solder Composition: Sn/Ag3.0/Cu0.5 Solder Temp: 260±5ºC for 10sec ±1 sec. Minimum of 75% of Electrode covered with new solder. Impedance within 30% of initial value. Test Equipment (Z): HP4291A RF Impedance/Material Analyzer (RDC): Chen Hwa 502BC Physical Packaging: 10000 per 7 inch reel. Marking: None 714-665-1140 ALLIED COMPONENTS INTERNATIONAL REVISED 6/18/09 www.alliedcomponents.com