NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* *Preferred Devices Amplifier Transistors Voltage and Current are Negative for PNP Transistors http://onsemi.com Features COLLECTOR 3 COLLECTOR 3 MAXIMUM RATINGS Rating Symbol Collector −Emitter Voltage MPSA05, MPSA55 MPSA06, MPSA56 VCEO Collector −Base Voltage MPSA05, MPSA55 MPSA06, MPSA56 VCBO Emitter −Base Voltage VEBO 4.0 Vdc Collector Current − Continuous IC 500 mAdc Total Device Dissipation @ TA = 25°C Derate above 25°C PD 625 5.0 W mW/°C Total Device Dissipation @ TC = 25°C Derate above 25°C PD 1.5 12 W mW/°C TJ, Tstg −55 to +150 °C Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 200 °C/W Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W Operating and Storage Junction Temperature Range PNP NPN • Pb−Free Packages are Available* Value Unit Vdc 60 80 2 BASE 2 BASE 1 EMITTER 1 EMITTER Vdc 60 80 TO−92 CASE 29 STYLE 1 1 12 3 STRAIGHT LEAD BULK PACK 2 3 BENT LEAD TAPE & REEL AMMO PACK THERMAL CHARACTERISTICS Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. RqJA is measured with the device soldered into a typical printed circuit board. MARKING DIAGRAM MPS Axx AYWW G G xx = 05, 06, 55, or 56 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007 April, 2007 − Rev. 3 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MPSA05/D NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit 60 80 − − V(BR)EBO 4.0 − Vdc ICES − 0.1 mAdc − − 0.1 0.1 100 100 − − OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (Note 2) (IC = 1.0 mAdc, IB = 0) V(BR)CEO Vdc MPSA05, MPSA55 MPSA06, MPSA56 Emitter −Base Breakdown Voltage (IE = 100 mAdc, IC = 0) Collector Cutoff Current (VCE = 60 Vdc, IB = 0) Collector Cutoff Current (VCB = 60 Vdc, IE = 0) (VCB = 80 Vdc, IE = 0) mAdc ICBO MPSA05, MPSA55 MPSA06, MPSA56 ON CHARACTERISTICS DC Current Gain (IC = 10 mAdc, VCE = 1.0 Vdc) (IC = 100 mAdc, VCE = 1.0 Vdc) hFE Collector −Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc) VCE(sat) − 0.25 Vdc Base−Emitter On Voltage (IC = 100 mAdc, VCE = 1.0 Vdc) VBE(on) − 1.2 Vdc 100 − 50 − − SMALL−SIGNAL CHARACTERISTICS Current −Gain − Bandwidth Product (Note 3) (IC = 10 mA, VCE = 2.0 V, f = 100 MHz) fT MHz MPSA05 MPSA06 MPSA55 MPSA56 (IC = 100 mAdc, VCE = 1.0 Vdc, f = 100 MHz) 2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 3. fT is defined as the frequency at which |hfe| extrapolates to unity. TURN−ON TIME −1.0 V 5.0 ms 100 VCC +VBB +40 V +40 V RL 100 RL OUTPUT +10 V tr = 3.0 ns OUTPUT RB Vin 0 TURN−OFF TIME VCC * CS t 6.0 pF 5.0 mF RB Vin * CS t 6.0 pF 5.0 mF 100 100 5.0 ms tr = 3.0 ns *Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage Polarities Figure 1. Switching Time Test Circuits http://onsemi.com 2 NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* PNP f T , CURRENT−GAIN − BANDWIDTH PRODUCT (MHz) f T , CURRENT−GAIN − BANDWIDTH PRODUCT (MHz) NPN 300 200 VCE = 2.0 V TJ = 25°C 200 100 100 70 50 30 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 −5.0 −7.0 −10 −20 −30 −50 −70 −100 −200 100 TJ = 25°C TJ = 25°C 70 C, CAPACITANCE (pF) 50 Cibo 10 8.0 Cobo 6.0 4.0 0.1 0.2 0.5 1.0 2.0 5.0 10 Cibo 30 20 Cobo 10 7.0 50 20 5.0 −0.1 −0.2 100 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 4. MPSA05/06 Capacitance Figure 5. MPSA55/56 Capacitance 1.0 k 700 500 1.0 k 700 500 ts 300 200 100 70 50 tf VCC = 40 V IC/IB = 10 IB1 = IB2 TJ = 25°C 5.0 7.0 10 50 70 100 100 70 50 20 td @ VBE(off) = 0.5 V 30 200 30 tr 20 ts 300 t, TIME (ns) C, CAPACITANCE (pF) 20 −2.0 −3.0 Figure 3. MPSA55/56 Current−Gain — Bandwidth Product 20 10 30 Figure 2. MPSA05/06 Current−Gain — Bandwidth Product 40 20 50 IC, COLLECTOR CURRENT (mA) 60 30 70 IC, COLLECTOR CURRENT (mA) 80 t, TIME (ns) VCE = −2.0 V TJ = 25°C 200 300 tf VCC = −40 V IC/IB = 10 IB1 = IB2 TJ = 25°C 10 −5.0 −7.0 −10 500 td @ VBE(off) = −0.5 V −20 −30 −50 −70 −100 tr −200 −300 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 6. MPSA05/06 Switching Time Figure 7. MPSA55/56 Switching Time http://onsemi.com 3 −500 NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* NPN PNP −1.0 k −700 −500 100 ms 1.0 ms 300 20 10 1.0 MPSA05 2.0 3.0 5.0 7.0 10 TC = 25°C TA = 25°C −100 −70 −50 CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT 30 1.0 ms 1.0 s −200 TA = 25°C 100 70 50 100 ms −300 1.0 s TC = 25°C 200 I C , COLLECTOR CURRENT (mA) I C , COLLECTOR CURRENT (mA) 1.0 k 700 500 MPSA06 20 50 30 −30 −20 −10 70 100 CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT MPSA55 −1.0 −2.0 −3.0 −5.0 −7.0 −10 MPSA56 −20 −30 VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS) Figure 8. MPSA05/06 Active−Region Safe Operating Area Figure 9. MPSA55/56 Active−Region Safe Operating Area 400 400 TJ = 125°C TJ = 125°C VCE = −1.0 V 25°C −55°C 100 80 60 1.0 1.0 2.0 3.0 5.0 10 20 30 50 100 200 25°C −55°C 100 80 60 40 −0.5 −1.0 −2.0 200 300 500 −20 −50 −100 −200 IC, COLLECTOR CURRENT (mA) Figure 10. MPSA05/06 DC Current Gain Figure 11. MPSA55/56 DC Current Gain −1.0 TJ = 25°C VBE(on) @ VCE = 1.0 V 0.4 0.2 −500 TJ = 25°C −0.8 VBE(sat) @ IC/IB = 10 0.6 VBE(sat) @ IC/IB = 10 −0.6 VBE(on) @ VCE = −1.0 V −0.4 −0.2 VCE(sat) @ IC/IB = 10 0 0.5 −5.0 −10 IC, COLLECTOR CURRENT (mA) 0.8 V, VOLTAGE (VOLTS) h FE, DC CURRENT GAIN 200 V, VOLTAGE (VOLTS) h FE , DC CURRENT GAIN VCE = 1.0 V 40 0.5 −50 −70 −100 VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS) 1.0 2.0 5.0 VCE(sat) @ IC/IB = 10 10 20 50 100 200 0 −0.5 500 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 12. MPSA05/06 “ON” Voltages Figure 13. MPSA55/56 “ON” Voltages http://onsemi.com 4 −500 NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* PNP VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS) VCE , COLLECTOR−EMITTER VOLTAGE (VOLTS) NPN 1.0 TJ = 25°C 0.8 IC = 250 mA IC = 100 mA IC = 50 mA IC = 500 mA 0.6 0.4 IC = 10 mA 0.2 0 0.05 0.2 0.1 0.5 2.0 1.0 5.0 10 20 IC = −250 mA IC = −100 mA IC = −50 mA IC = −500 mA −0.6 −0.4 IC = −10 mA −0.2 0 −0.05 −0.1 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 IB, BASE CURRENT (mA) Figure 14. MPSA05/06 Collector Saturation Region Figure 15. MPSA55/56 Collector Saturation Region R qVB , TEMPERATURE COEFFICIENT (mV/°C) R qVB , TEMPERATURE COEFFICIENT (mV/ °C) −1.6 RqVB for VBE −2.0 −2.4 −2.8 0.5 r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE −0.8 IB, BASE CURRENT (mA) −1.2 1.0 2.0 5.0 10 20 50 100 200 500 −50 −0.8 −1.2 −1.6 RqVB for VBE −2.0 −2.4 −2.8 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 16. MPSA05/06 Base−Emitter Temperature Coefficient Figure 17. MPSA55/56 Base−Emitter Temperature Coefficient −500 D = 0.5 0.3 0.2 0.2 0.1 0.05 0.1 0.07 0.05 TJ = 25°C 50 −0.8 1.0 0.7 0.5 −1.0 0.02 SINGLE PULSE ZqJC(t) = r(t) • RqJC TJ(pk) − TC = P(pk) ZqJC(t) ZqJA(t) = r(t) • RqJA TJ(pk) − TA = P(pk) ZqJA(t) D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 (SEE AN469) P(pk) 0.01 t1 SINGLE PULSE 0.03 t2 0.02 DUTY CYCLE, D = t1/t2 0.01 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k t, TIME (ms) Figure 18. MPSA05, MPSA06, MPSA55 and MPSA56 Thermal Response http://onsemi.com 5 20 k 50 k 100 k NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* ORDERING INFORMATION Package Shipping† TO−92 5000 Units / Bulk TO−92 (Pb−Free) 5000 Units / Bulk TO−92 2000 / Tape & Reel TO−92 (Pb−Free) 2000 / Tape & Reel TO−92 2000 / Ammo Pack TO−92 (Pb−Free) 2000 / Ammo Pack TO−92 5000 Units / Bulk MPSA06G TO−92 (Pb−Free) 5000 Units / Bulk MPSA06RL1G TO−92 (Pb−Free) 2000 / Tape & Reel MPSA06RLG TO−92 (Pb−Free) 2000 / Tape & Reel TO−92 2000 / Tape & Reel TO−92 (Pb−Free) 2000 / Tape & Reel TO−92 2000 / Ammo Pack TO−92 (Pb−Free) 2000 / Ammo Pack TO−92 2000 / Ammo Pack MPSA06RLRPG TO−92 (Pb−Free) 2000 / Ammo Pack MPSA55G TO−92 (Pb−Free) 5000 Units / Bulk TO−92 2000 / Tape & Reel TO−92 (Pb−Free) 2000 / Tape & Reel TO−92 5000 Units / Bulk TO−92 (Pb−Free) 5000 Units / Bulk TO−92 2000 / Tape & Reel TO−92 (Pb−Free) 2000 / Tape & Reel TO−92 2000 / Ammo Pack TO−92 (Pb−Free) 2000 / Ammo Pack TO−92 2000 / Ammo Pack TO−92 (Pb−Free) 2000 / Ammo Pack TO−92 2000 / Ammo Pack TO−92 (Pb−Free) 2000 / Ammo Pack Device MPSA05 MPSA05G MPSA05RLRA MPSA05RLRAG MPSA05RLRM MPSA05RLRMG MPSA06 MPSA06RLRA MPSA06RLRAG MPSA06RLRM MPSA06RLRMG MPSA06RLRP MPSA55RLRA MPSA55RLRAG MPSA56 MPSA56G MPSA56RLRA MPSA56RLRAG MPSA56RLRM MPSA56RLRMG MPSA56RLRP MPSA56RLRPG MPSA56ZL1 MPSA56ZL1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 6 NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* PACKAGE DIMENSIONS TO−92 (TO−226) CASE 29−11 ISSUE AM A B STRAIGHT LEAD BULK PACK R P L SEATING PLANE K D X X G J H V C SECTION X−X 1 N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 −−− 0.250 −−− 0.080 0.105 −−− 0.100 0.115 −−− 0.135 −−− MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 −−− 6.35 −−− 2.04 2.66 −−− 2.54 2.93 −−− 3.43 −−− N A R BENT LEAD TAPE & REEL AMMO PACK B P NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. T SEATING PLANE K D X X G J V 1 C SECTION X−X DIM A B C D G J K N P R V MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 −−− 2.04 2.66 1.50 4.00 2.93 −−− 3.43 −−− N STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MPSA05/D