ISO-9001 CERTIFIED BY DSCC M.S.KENNEDY CORP. POWER OPERATIONAL AMPLIFIER 4707 Dey Road Liverpool, N.Y. 13088 115 (315) 701-6751 MIL-PRF-38534 QUALIFIED FEATURES: High Output Current - 15A peak Ultra Low Thermal Resistance - 0.43°C/W Excellent Linearity - Class A/B Output Wide Supply Range - ±10V to ±50V High Power Dissipation - 175W at TC=125°C Output Short Circuit Protected User Programmable Current Limit Isolated Case Allows Direct Heat Sinking Low Quiescent Current -±22mA. Typ MSK 115 DESCRIPTION: The MSK 115 is a High Power Operational Amplifier. Due to the extremely low thermal resistance from the transistor junctions to the case, the MSK 115 can dissipate extreme amounts of power at a case temperature of 125°C. The amplifier is packaged in a hermetic plug in power package with bolt down tabs. EQUIVALENT SCHEMATIC EQUIVALENT SCHEMATIC TYPICAL APPLICATIONS TYPICAL APPLICATIONS PIN-OUT INFORMATION 1 2 3 4 5 6 Magnetic Deflection Circuit Driver Programmable Power Supplies Motor, Valve and Actuator Control Audio Amplifier 1 +VCC Balance Inverting Input Non-Inverting Input Balance -VCC 12 11 10 9 8 7 +VC +Current Limit Output Output -Current Limit -VC Rev. A 6/02 ABSOLUTE MAXIMUM RATINGS ±VCC IOUT VIN TC Supply Voltage ±50V Output Current 15A Differential Input Voltage ±37V Case Operating Temperature Range (MSK 115B/E) -55°C to+125°C (MSK 115) -40°C to +85°C ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TST Storage Temperature Range TLD Lead Temperature Range (10 Seconds) PD Power Dissipation TJ Junction Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ -65°C to +150°C 300°C ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ See S0A Curve 175°C ○ ○ ○ ○ ○ ○ ELECTRICAL SPECIFICATIONS ±Vcc=40VDC Unless Otherwise Specified Group A Test Conditions Parameter ○ ○ MSK 115B/E Subgroup Min. MSK 115 Typ. Max. Min. Typ. Max. Units STATIC 2 Supply Voltage Range - ±10 - ±50 ±10 - ±50 V VIN=0V 1 - ±22 ±35 - ±22 ±40 mA A V=-10V/V 2,3 - ±28 ±45 - - - mA Junction to Case - - 0.43 0.55 - 0.43 0.6 °C/W 1 - ±2 ±6 - ±2 ±10 mV Bal.Pins=NC 2,3 - ±3 ±12 - - - mV RPOT=10KΩ To -VCC AV=-10V/V 1 Adjust to zero Adjust to zero mV 2,3 Adjust to zero Quiescent Current Thermal Resistance 2 INPUT VIN=0V Input Offset Voltage Input Offset Adjust Input Bias Current Input Offset Current Input Impedance - - mV 1 - ±10 ±30 - ±10 ±50 nA Either Input 2,3 - ±15 ±60 - - - nA VCM=0V 1 - ±5 ±30 - ±5 ±50 nA 2,3 - ±10 ±50 - - - nA - 50 250 - 35 250 - MΩ - - ±35 - - ±35 - V VCM=±5V - 80 100 - 74 100 - dB RL=500Ω AV=-10V/V 4 ±35 ±37 - ±33 ±37 - V RL=10Ω RSC ≤ 0.02Ω 4 ±35 ±37 - ±33 ±37 - V 4 15 - - 10 - - A 0.1% 10V step - - 2 - - 5 - µS V/µS 2 Common Mode Rejection Ratio 2 - VCM=0V F=DC 2 Common Mode Range AV=10V/V F=100Hz OUTPUT Output Voltage Swing AV=-10V/V Output Current, Peak Settling Time 1 2 TJ<175°C TRANSFER CHARACTERISTICS VOUT=±10V RL=500Ω AV=-10V/V 4 2.5 5 - 1 2.5 - Open Loop Voltage Gain 2 RL=500Ω F=10Hz 4 95 105 - 85 105 - dB Gain Bandwidth Product 2 RL=10Ω F=1 MHz - - 4 - - 3 - MHz Slew Rate NOTES: 1 2 3 4 5 6 AV= -1, measured in false summing junction circuit. Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only. Industrial grade and "E" suffix devices shall be tested to subgroups 1 and 4 unless otherwise specified. Military grade devices ("B" suffix) shall be 100% tested to subgroups 1,2,3 and 4. Subgroups 5 and 6 testing available upon request. TA=TC=+25°C Subgroup 1,4 TA=TC=+125°C Subgroup 2,5 TA=TC=-55°C Subgroup 3,6 2 Rev. A 6/02 APPLICATION NOTES HEAT SINKING CURRENT LIMIT To determine if a heat sink is necessary for your application and if so, what type, refer to the thermal model and governing equation below. The MSK 115 has an on-board current limit scheme designed to shut off the output drivers anytime output current exceeds a predetermined limit. The following formula may be used to determine the value of current limit resistance necessary to establish the desired current limit. Thermal Model: RCL=(OHMs)=(0.65 volts/current limit in amps) - 0.01OHM The 0.01 ohm term takes into account any wire bond and lead resistance. Since the 0.65 volt term is obtained from the base emitter voltage drop of a bipolar transistor: the equation only holds true for operation at +25°C case temperature. The curve below illustrates the effect of case temperature on current limit. Governing Equation: TJ=PD x (RθJC + RθCS + RθSA) + TA Where TJ=Junction Temperature PD=Total Power Dissipation RθJC=Junction to Case Thermal Resistance RθCS=Case to Heat Sink Thermal Resistance RθSA=Heat Sink to Ambient Thermal Resistance TC=Case Temperature TA=Ambient Temperature TS=Sink Temperature Example: In our example the amplifier application requires the output to drive a 20 volt peak sine wave across a 20 ohm load for 1 amp of output current. For a worst case analysis we will treat the 1 amp peak output current as a D.C. output current. The power supplies are ±40 VDC. 1.) Find Power Dissipation PD =[(quiescent current) x (VS-(VS))]+[(+VS-VO) x IOUT] =(25mA) x (80V)+(20V) x (1A) =2W+20W =22W 2.) For conservative design, set TJ=+125°C 3.) For this example, worst case TA=+50°C 4.) RθJC=0.55°C/W from MSK 115B Data Sheet 5.) RθCS=0.15°C/W for most thermal greases 6.) Rearrange governing equation to solve for RθSA RθSA=((TJ-TA)/PD) - (RθJC) - (RθCS) =((125°C -50°C)/22W) - (0.55°C/W) - (0.15°C/W) =2.71°C/W POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An effective decoupling scheme consists of a 0.1 microfarad ceramic capacitor in parallel with a 4.7 microfarad tantalum capacitor from each power supply pin to ground. It is also a good practice with very high power op-amps, such as the MSK 115, to place a 30-50 microfarad non-electrolytic capacitor with a low effective series resistance in parallel with the other two power supply decoupling capacitors. This capacitor will eliminate any peak output voltage clipping which may occur due to poor power supply load regulation. All power supply decoupling capacitors should be placed as close to the package power supply pins as possible (pins 7 and 12). The heat sink in this example must have a thermal resistance of no more than 2.71°C/W to maintain a junction temperature of no more than +125°C. 3 Rev. A 6/02 TYPICAL PERFORMANCE CURVES 4 Rev. A 6/02 MECHANICAL SPECIFICATIONS MSK 115 ESD TRIANGLE INCICATES PIN 1. NOTE: ALL DIMENSIONS ARE ±0.010 INCHES UNLESS OTHERWISE LABELED. ORDERING INFORMATION Part Number MSK115 MSK 115E MSK115B Screening Level Industrial Extended Reliability Mil-PRF-38534 Class H M.S. Kennedy Corp. 4707 Dey Road, Liverpool, New York 13088 Phone (315) 701-6751 FAX (315) 701-6752 www.mskennedy.com The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make changes to its products or specifications without notice, however, and assumes no liability for the use of its products. Please visit our website for the most recent revision of this datasheet. 5 Rev. A 6/02