INDEX MX27C1000/1001 1M-BIT [128K x 8] CMOS EPROM FEATURES • • • • • • • Operating current: 30mA • Standby current: 100uA • Package type: 128K x 8 organization Single +5V power supply +12.5V programming voltage Fast access time: 45/55/70/90/100/120/150 ns Totally static operation Completely TTL compatible - 32 pin ceramic DIP, plastic DIP 32 pin SOP 32 pin PLCC 32 pin TSOP GENERAL DESCRIPTION EPROM programmers may be used. The MX27C1000/ 1001 supports an intelligent fast programming algorithm which can result in programming time of less than thirty seconds. The MX27C1000/1001 is a 5V only, 1M-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 128K words by 8 bits per word, operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead PLCC , 32 lead SOP , and 32 lead TSOP packages. PIN CONFIGURATIONS CDIP/PDIP/SOP VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 MX27C1000 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VPP OE A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM NC A14 A13 A8 A9 A11 A16 A10 CE Q7 Q6 Q5 Q4 Q3 TSOP(MX27C1000) A7 32 NC 1 PGM VCC A16 4 VPP 5 A15 A12 PLCC 30 29 A13 A5 A8 A3 A9 9 MX27C1000 25 A11 A2 OE A1 A10 CE A0 21 20 Q5 Q4 Q3 Q2 GND 17 Q7 Q6 13 14 Q1 Q0 A11 A9 A8 A13 A14 NC PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 A14 A6 A4 P/N: PM0234 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27C1001 CDIP/PDIP/SOP(MX27C1001) VCC PGM NC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MX27C1000 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 BLOCK DIAGRAM CE PGM CONTROL LOGIC OE . . A0~A16 ADDRESS INPUTS Y-DECODER . . . . OUTPUT BUFFERS . Q0~Q17 X-DECODER . . . . SYMBOL PIN NAME A0~A16 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Programmable Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin Y-SELECT . . . . VCC GND PIN DESCRIPTION 1M BIT CELL MAXTRIX . VPP For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. FUNCTIONAL DESCRIPTION THE ERASURE OF THE MX27C1000/1001 Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 01.uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. The MX27C1000/1001 is erased by exposing the chip to an ultraviolet light source. A dosage of 15 W seconds/ cm2 is required to completely erase a MX27C1000/1001 This dosage can be obtained by exposure to an ultraviolet lamp - wavelength of 2537 Angstroms (A) - with intensity of 12,000 uW/cm2 for 15 to 20 minutes. The MX27C1000/ 1001 should be directly under and about one inch from the source and all filters should be removed from the UV light source prior to erasure. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. It is important to note that the MX27C1000/1001, and similar devices, will be cleared for all bits of their programmed states with light sources having wavelengths shorter than 4000 A Although erasure times will be much longer than that with UV sources at 2537A nevertheless the exposure to fluorescent light and sunlight will eventually erase the MX27C1000/1001 and exposure to them should be prevented to realize maximum system reliability. If used in such an environment, the package window should be covered by an opaque label or substance. THE PROGRAMMING OF THE MX27C1000/1001 When the MX27C1000/1001 is delivered, or it is erased, the chip has all 1M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C1000 through the procedure of programming. P/N: PM0234 2 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PROGRAM INHIBIT MODE data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE. Programming of multiple MX27C1000/1001s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C1000/1001 may be common. A TTL low-level program pulse applied to an MX27C1000/1001 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27C1000/1001. A highlevel CE input inhibits the other MX27C1000/1001s from being programmed. STANDBY MODE The MX27C1000/1001 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C1000/1001 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE at VIL, PGM at VIH, and VPP at its programming voltage. TWO-LINE OUTPUT CONTROL FUNCTION AUTO IDENTIFY MODE To accommodate multiple memory connections, a twoline control function is provided to allow for: The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C1000/ 1001. 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C1000/1001, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (DQ7) defined as the parity bit. READ MODE The MX27C1000/1001 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate P/N: PM0234 3 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 MODE SELECT TABLE PINS MODE CE OE PGM A0 A9 VPP OUTPUTS Read VIL VIL X X X VCC DOUT Output Disable VIL VIH X X X VCC High Z Standby (TTL) VIH X X X X VCC High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC C2H Device Code(27C1000)(3) VIL VIL X VIH VH VCC 0EH Device Code(27C1001)(3) VIL VIL X VIH VH VCC 0FH NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL P/N: PM0234 3. A1 - A8 = A10 - A16 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. 4 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0234 5 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance(30pF for 45/44/70 ns parts) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade. Input pulse rise and fall times are < 10ns. 1.5V AC driving levels 1.5V TEST POINTS OUTPUT INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70. P/N: PM0234 6 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27C1000/1001 -45* Operating Commercial 0°C to 70°C Temperature Industrial Vcc Power Supply -55 -70 -90 -10 -12 -15 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 5V ± 5% 5V ± 10% 5V ± 10% 5V ±10% 5V ± 10% 5V ± 10% 5V ± 10% *Note:45ns for MX27C1000 only DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = VIL, VPP = 5.5V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V Vpp VPP Capacitance 18 25 pF VPP = 0V P/N: PM0234 7 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 AC CHARACTERISTICS 27C1000 27C1000/1001 27C1000/1001 -45 -55 -70 SYMBOL PARAMETER MIN. MAX. tACC Address to Output Delay 45 tCE Chip Enable to Output Delay 45 tOE tDF Output Enable to Output Delay OE High to Output Float, tOH or CE High to Output Float Output Hold from Address, 0 CE or OE which ever occurred first 25 17 0 MIN. MAX. MAX. UNIT CONDITIONS 55 70 ns CE = OE = VIL 55 70 ns OE = VIL 35 20 ns ns CE = VIL 30 20 0 0 -90 ns 27C1000/1001 27C1000/1001 -10 MAX. PARAMETER tACC Address to Output Delay 90 100 tCE Chip Enable to Output Delay 90 100 tOE tDF Output Enable to Output Delay OE High to Output Float, tOH or CE High to Output Float Output Hold from Address, 0 CE or OE which ever occurred first 40 25 MIN. -12 SYMBOL 0 0 0 27C1000/1001 27C1000/1001 MIN. MIN. MAX. 45 30 0 0 MIN. MAX. MAX. UNIT CONDITIONS 120 150 ns CE = OE = VIL 120 150 ns OE = VIL 65 50 ns ns CE = VIL 50 35 0 -15 0 MIN. 0 0 ns DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VIN = 0 to 5.5V CE = PGM = VIL, OE = VIH VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V P/N: PM0234 8 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. MAX. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW PGM Program Pulse Width 95 tVCS VCC Setup Time 2.0 us tCES CE Setup Time 2.0 us tOE Data valid from OE 130 UNIT CONDITIONS ns us 105 150 us ns WAVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE P/N: PM0234 tOH 9 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 FAST PROGRAMMING ALGORITHM WAVEFORMS PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tPW tOES tOE Max VIH OE P/N: PM0234 VIL 10 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 ORDERING INFORMATION CERAMIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE PACKAGE MX27C1000DC-45 45 30 100 0°C t0 70°C 32 Pin DIP MX27C1000DC-55 55 30 100 0°C t0 70°C 32 Pin DIP MX27C1001DC-55 55 30 100 0°C t0 70°C 32 Pin DIP MX27C1001DC-70 70 30 100 0°C t0 70°C 32 Pin DIP MX27C1001DC-90 90 30 100 0°C t0 70°C 32 Pin DIP MX27C1001DC-10 100 30 100 0°C t0 70°C 32 Pin DIP MX27C1001DC-12 120 30 100 0°C t0 70°C 32 Pin DIP MX27C1001DC-15 150 30 100 -40°C to 85°C 32 PIn DIP P/N: PM0234 11 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE PACKAGE MX27C1000PC-45 45 30 100 0°C t0 70°C 32 PIN DIP MX27C1000MC-45 45 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-45 45 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-45 45 30 100 0°C t0 70°C 32 Pin TSOP MX27C1000PC-55 55 30 100 0°C t0 70°C 32 Pin DIP MX27C1000MC-55 55 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-55 55 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-55 55 30 100 0°C t0 70°C 32 Pin TSOP MX27C1001MC-55 55 30 100 0°C t0 70°C 32 Pin SOP MX27C1001PC-55 55 30 100 0°C t0 70°C 32 Pin DIP MX27C1000PC-70 70 30 100 0°C t0 70°C 32 Pin DIP MX27C1000MC-70 70 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-70 70 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-70 70 30 100 0°C t0 70°C 32 Pin TSOP MX27C1001MC-70 70 30 100 0°C t0 70°C 32 Pin SOP MX27C1001PC-70 70 30 100 0°C t0 70°C 32 Pin DIP MX27C1000PC-90 90 30 100 0°C t0 70°C 32 Pin DIP MX27C1000MC-90 90 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-90 90 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-90 90 30 100 0°C t0 70°C 32 Pin TSOP MX27C1001MC-90 90 30 100 0°C t0 70°C 32 Pin SOP MX27C1001PC-90 90 30 100 0°C t0 70°C 32 Pin DIP MX27C1000PC-10 100 30 100 0°C t0 70°C 32 Pin DIP MX27C1000MC-10 100 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-10 100 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-10 100 30 100 0°C t0 70°C 32 Pin TSOP MX27C1001MC-10 100 30 100 0°C t0 70°C 32 Pin SOP MX27C1001PC-10 100 30 100 0°C t0 70°C 32 Pin DIP MX27C1000PC-12 120 30 100 0°C t0 70°C 32 Pin DIP MX27C1000MC-12 120 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-12 120 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-12 120 30 100 0°C t0 70°C 32 Pin TSOP MX27C1001MC-12 120 30 100 0°C t0 70°C 32 Pin SOP MX27C1001PC-12 120 30 100 0°C t0 70°C 32 Pin DIP MX27C1000PC-15 150 30 100 0°C t0 70°C 32 Pin DIP MX27C1000MC-15 150 30 100 0°C t0 70°C 32 Pin SOP MX27C1000QC-15 150 30 100 0°C t0 70°C 32 Pin PLCC MX27C1000TC-15 150 30 100 0°C t0 70°C 32 Pin TSOP MX27C1001MC-15 150 30 100 0°C t0 70°C 32 Pin SOP MX27C1001PC-15 150 30 100 0°C t0 70°C 32 Pin DIP P/N: PM0234 12 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 ORDER INFORMATION(CONTINUED) PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE PACKAG MX27C1000PI-70 70 30 100 -40°C t0 85°C 32 Pin DIP MX27C1000MI-70 70 30 100 -40°C t0 85°C 32 Pin SOP MX27C1000QI-70 70 30 100 -40°C t0 85°C 32 Pin PLCC MX27C1000TI-70 70 30 100 -40°C t0 85°C 32 Pin TSOP MX27C1000PI-90 90 30 100 -40°C t0 85°C 32 Pin DIP MX27C1000MI-90 90 30 100 -40°C t0 85°C 32 Pin SOP MX27C1000QI-90 90 30 100 -40°C t0 85°C 32 Pin PLCC MX27C1000TI-90 90 30 100 -40°C t0 85°C 32 Pin TSOP MX27C1000PI-12 120 30 100 -40°C t0 85°C 32 Pin DIP MX27C1000MI-12 120 30 100 -40°C t0 85°C 32 Pin SOP MX27C1000QI-12 120 30 100 -40°C t0 85°C 32 Pin PLCC MX27C1000TI-12 120 30 100 -40°C t0 85°C 32 Pin TSOP MX27C1000PI-15 150 30 100 -40°C t0 85°C 32 Pin SOP MX27C1000MI-12 120 30 100 -40°C t0 85°C 32 Pin SOP MX27C1000QI-15 150 30 100 -40°C t0 85°C 32 Pin PLCC MX27C1000TI-15 150 30 100 -40°C t0 85°C 32 Pin TSOP P/N: PM0234 13 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PACKAGE INFORMATION 32-PIN CERDIP(MSI) WITH WINDOW (600mil) ITEM MILLIMETERS INCHES A 42.26 max. 1.665 max. B 1.90 ± .38 .075 ± .015 C 2.54 [TP] .100 [TP] D .46 [REF] .018 [REF] E 38.07 1.500 F 1.42 [REF] .056 [REF] G 3.43 ± .38 .135 ± .015 H .96 ± .43 .038 ± .017 I 4.06 .160 J 5.00 .203 K 15.58 ± .13 .614 ± .005 L 13.20 ± .38 .520 ± .015 M .25 [REF] .010 [REF] N ø8.12 ø.320 NOTE: 32 17 N 1 16 K L A I J H G F D C B M 0.15¡ E Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32-PIN PLASTIC DIP(600 mil) ITEM MILLIMETERS INCHES A 42.13 max. 1.660 max. B 1.90 [REF] .075 [REF] C 2.54 [TP] .100 [TP] D .46 [Typ.] .018 [Typ.] E 38.07 1.500 F 1.27 [Typ.] .050 [Typ.] G 3.30 ± .25 .130 ± .010 H .51 [REF] .020 [REF] I 3.94 ± .25 .155 ± .010 J 5.33 max. .210 max. K 15.22 ± .25 .600 ± .010 L 13.97 ± .25 .550 ± .010 .25 [Typ.] .010 [Typ.] M NOTE: P/N: PM0234 32 17 1 16 A F D Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. K L C B I J H G M 0~15¡ E 14 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PACKAGE INFORMATION(Continued) 32-PIN PLASTIC SOP (450 mil) ITEM MILLIMETERS INCHES A 20.95 max. .825 max. B 1.00 [REF] .039 [REF] C 1.27 [TP] .050 [TP] D .40 [Typ.] .016 [Typ.] E .05 min. .002 min. F 3.05 max. .120 max. G 2.69 ± .13 .106 ± .005 H 14.12 ± .25 .556 ± .010 I 11.30 ± .13 .445 ± .005 J 1.42 .056 K .20 [Typ.] .008 [Typ.] L .79 .031 NOTE: Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32 17 1 16 H A I G J F K E D C L B 32-PIN PLASTIC LEADED CHIP CARRIER (PLCC) A ITEM A MILLIMETERS 12.44 ± .13 4 .490 ± .005 B 11.50 ± .13 .453 ± .005 C 14.04 ± .13 .553 ± .005 D 14.98 ± .13 .590 ± .005 E 1.93 .076 F 3.30 ± .25 .130 ± .010 G 2.03 ± .13 .080 ± .005 H .51 ± .13 .020 ± .005 I 1.27 [Typ.] .050 [Typ.] J .71[REF] .028[REF] K L .46 [REF] 10.40/12.94 (W) (L) .018 [REF] .410/.510 (W) (L) M .89 R .035 R N .25 (TYP.) .010 (TYP.) NOTE: B 1 INCHES Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32 30 5 29 9 25 13 C D 21 14 20 17 E F G N H M I J K L P/N: PM0234 15 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PACKAGE INFORMATION 32-PIN PLASTIC TSOP ITEM MILLIMETERS A 20.0 ± .20 INCHES .078 ± .006 A B 18.40 ± .10 .724 ± .004 B C 8.20 max. .323 max. D 0.15 [Typ.] .006 [Typ.] E .80 [Typ.] .031 [Typ.] F .20 ± .10 .008 ± .004 G .30 ± .10 .012 ± .004 H .50 [Typ.] .020 [Typ.] I .45 max. .018 max. J 0 ~ .20 0 ~ .008 K 1.00 ± .10 .039 ± .004 L 1.27 max. .050 max. M .50 .020 N 19.00 .748 O 0~5 .500 NOTE: P/N: PM0234 C O N M K L D E F G H I J Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at a maximum material condition. 16 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 Revision History Revision No. 5.0 5.1 5.2 5.3 P/N: PM0234 Description 1) Reduce operating current change from 40mA to 30mA. 2) Eliminate Interactive Programming Mode. 3) Add 27C1001 pin configuration. IPP 100uA --> 10uA Change TSOP Orientation 27C1000CDIP 70/90/100/120/150ns speed grades deleted from ordering information. 17 Date 5/28/1997 8/08/1997 4/09/1998 5/07/1998 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-8888 FAX:+886-3-578-8887 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-747-2309 FAX:+65-748-4090 TAIPEI OFFICE: TEL:+886-3-509-3300 FAX:+886-3-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice. 18