MX27L256 256K-BIT [32Kx8] LOW VOLTAGE OPERATION CMOS EPROM FEATURES • • • • • • • • • 32K x 8 organization Wide Voltage range, 2.7V to 3.6V DC +12.5V programming voltage Fast access time: 120/150/200/250 ns Totally static operation GENERAL DESCRIPTION Completely TTL compatible Operating current: 10mA @ 3.6V, 5MHz Standby current: 10uA Package type: - 28 pin plastic DIP - 32 pin PLCC - 28 pin 8 x 13.4mm TSOP(I) The MX27L256 is a 256K-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 32K by 8 bits, operates from a single + 3volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming from outside the system, existing EPROM programmers may be used. The MX27L256 supports intelligent fast programming algorithm which can result in programming time of less than ten seconds. PIN CONFIGURATIONS BLOCK DIAGRAM 32 30 29 A9 A4 A11 A2 25 MX27L256 OE A1 A10 A0 CE 21 20 Q4 Q3 NC GND 17 22 23 24 25 26 27 28 1 2 3 4 5 6 7 MX27L256 Q0~Q7 INPUTS . . . . . . Y-DECODER X-DECODER . . Y-SELECT . . . . 256K BIT . . CELL MAXTRIX Q6 VCC GND VPP Q5 13 14 PIN DESCRIPTION 8 x 13.4mm 28 -TSOP(I) OE A11 A9 A8 A13 A14 VCC VPP A12 A7 A6 A5 A4 A3 A0~A14 ADDRESS Q7 NC Q0 . . NC 9 OUTPUT BUFFERS A8 A5 A3 CONTROL LOGIC CE OE A13 1 A14 VCC 4 NC 5 VPP A7 A6 Q2 28 27 26 25 24 23 22 21 20 19 18 17 16 15 Q1 MX27L256 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VCC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 A12 PLCC PDIP VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND This EPROM is packaged in industry standard 28 pin dual-in-line packages, 32 lead PLCC, and 28 lead TSOP(I) packages. 21 20 19 18 17 16 15 14 13 12 11 10 9 8 A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 P/N: PM0248 SYMBOL PIN NAME A0~A14 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin GND Ground Pin REV. 3.3, SEP. 19, 2001 1 MX27L256 FUNCTIONAL DESCRIPTION AUTO IDENTIFY MODE THE PROGRAMMING OF THE MX27L256 The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27L256. When the MX27L256 is delivered, or it is erased, the chip has all 256K bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27L256 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. When programming an MXIC EPROM, a 0.1uF capacitor is required across VPP and ground to suppress spurious voltage transients which may damage the device. To activate this mode, the programming equipment must force 12.0 ± 0.5 (VH) on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. FAST PROGRAMMING Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27L256, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and OE = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. READ MODE The MX27L256 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE. PROGRAM INHIBIT MODE Programming of multiple MX27L256s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27L256 may be common. A TTL low-level program pulse applied to an MX27L256 CE input with VPP = 12.5 ± 0.5 V and OE HIGH will program that MX27L256. A high-level CE input inhibits the other MX27L256s from being programmed. STANDBY MODE The MX27L256 has a CMOS standby mode which reduces the maximum Vcc current to 10 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27L 256 also has a TTL-standby mode which reduces the maximum VCC current to 0.25 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with CE and OE at VIL, and VPP at its programming voltage. P/N:PM0248 2 REV.3.3, SEP. 19, 2001 MX27L256 TWO-LINE OUTPUT CONTROL FUNCTION SYSTEM CONSIDERATIONS To accommodate multiple memory connections, a twoline control function is provided to allow for: During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between Vcc and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. MODE SELECT TABLE PINS MODE CE OE A0 A9 VPP OUTPUTS Read VIL VIL X X VCC DOUT Output Disable VIL VIH X X VCC High Z Standby (TTL) VIH X X X VCC High Z Standby (CMOS) VCC±0.3V X X X VCC High Z Program VIL VIH X X VPP DIN Program Verify VIH VIL X X VPP DOUT Program Inhibit VIH VIH X X VPP High Z Manufacturer Code(3) VIL VIL VIL VH VCC C2H Device Code(3) VIL VIL VIH VH VCC 10H NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL 3. A1 - A8 = A10 - A14 = VIL(For auto select) P/N:PM0248 4. See DC Programming characteristics for VPP voltage during programming. 3 REV.3.3, SEP. 19, 2001 MX27L256 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N:PM0248 4 REV.3.3, SEP. 19, 2001 MX27L256 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 2.4V/0.4V for both commercial grade and industrial grade. Input pulse rise and fall times are < 20ns. P/N:PM0248 5 REV.3.3, SEP. 19, 2001 MX27L256 NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27L256 Operating Temperature Commercial Industrial Vcc Power Supply -12 -15 -20 -25 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V DC CHARACTERISTICS SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS VOH Output High Voltage VCC -0.3 V IOH = -100uA, VCC =3.0V VOL Output Low Voltage 0.3 V IOL = 2.1mA, VCC =3.0V VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.3 0.6 V ILI Input Leakage Current -10 10 uA VIN = 0 to 3.6V ILO Output Leakage Current -10 10 uA VOUT = 0 to 3.6V ICC3 VCC Power-Down Current 10 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 0.25 mA CE = VIH ICC1 VCC Active Current 10 mA CE = VIL, f=5MHz, Iout = 0mA, VCC = 3.6V IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = VCC CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V VPP VPP Capacitance 18 25 pF VPP = 0V P/N:PM0248 6 REV.3.3, SEP. 19, 2001 MX27L256 AC CHARACTERISTICS 27L256-12 27L256-15 27L256-20 27L256-25 MIN. MIN. MIN. MIN. SYMBOL PARAMETER tACC Address to Output Delay 120 150 200 250 ns CE = OE = VIL tCE Chip Enable to Output Delay 120 150 200 250 ns OE = VIL tOE Output Enable to Output Delay 60 70 100 120 ns CE = VIL tDF OE High to Output Float, 70 ns 0 MAX. 40 0 MAX. 50 0 MAX. 60 0 MAX. UNIT CONDITIONS or CE High to Output Float tOH Output Hold from Address, 0 0 0 0 ns CE or OE which ever occurred first DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current(Program & Verify) 40 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V MAX. UNIT VIN = 0 to 3.6V CE = VIL, OE = VIH AC PROGRAMMING CHARACTERISTICS TA = 25°C ± 5°C SYMBOL PARAMETER MIN. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 us tVCS VCC Setup Time 2.0 us tOE Data Valid from OE tPW PGM Program Pulse Width P/N:PM0248 95 7 130 CONDITIONS ns 150 ns 105 us REV.3.3, SEP. 19, 2001 MX27L256 WVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGROITHM WAVEFORM PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tOES tPW OE P/N:PM0248 tOE Max VIH VIL 8 REV.3.3, SEP. 19, 2001 MX27L256 ORDERING INFORMATION PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE PACKAGE MX27L256PC-12 120 10 10 0°C to 70°C 28 Pin DIP MX27L256QC-12 120 10 10 0°C to 70°C 32 Pin PLCC MX27L256TC-12 120 10 10 0°C to 70°C 28 Pin TSOP(I) MX27L256PC-15 150 10 10 0°C to 70°C 28 Pin DIP MX27L256QC-15 150 10 10 0°C to 70°C 32 Pin PLCC MX27L256TC-15 150 10 10 0°C to 70°C 28 Pin TSOP(I) MX27L256PC-20 200 10 10 0°C to 70°C 28 Pin DIP MX27L256QC-20 200 10 10 0°C to 70°C 32 PinPLCC MX27L256TC-20 200 10 10 0°C to 70°C 28 Pin TSOP(I) MX27L256PC-25 250 10 10 0°C to 70°C 28 Pin DIP MX27L256QC-25 250 10 10 0°C to 70°C 32 Pin PLCC MX27L256TC-25 250 10 10 0°C to 70°C 28 Pin TSOP(I) MX27L256PI-12 120 10 10 -40°C to 85°C 28 Pin DIP MX27L256QI-12 120 10 10 -40°C to 85°C 32 Pin PLCC MX27L256TI-12 120 10 10 -40°C to 85°C 28 Pin TSOP(I) MX27L256PI-15 150 10 10 -40°C to 85°C 28 Pin DIP MX27L256QI-15 150 10 10 -40°C to 85°C 32 Pin PLCC MX27L256TI-15 150 10 10 -40°C to 85°C 28 Pin TSOP(I) MX27L256PI-20 200 10 10 -40°C to 85°C 28 Pin DIP MX27L256QI-20 200 10 10 -40°C to 85°C 32 PinPLCC MX27L256TI-20 200 10 10 -40°C to 85°C 28 Pin TSOP(I) MX27L256PI-25 250 10 10 -40°C to 85°C 28 Pin DIP MX27L256QI-25 250 10 10 -40°C to 85°C 32 Pin PLCC MX27L256TI-25 250 10 10 -40°C to 85°C 28 Pin TSOP(I) P/N:PM0248 9 REV.3.3, SEP. 19, 2001 MX27L256 PACKAGE INFORMATION 28-PIN PLASTIC DIP (600 mil) P/N:PM0248 10 REV.3.3, SEP. 19, 2001 MX27L256 32-PIN PLASTIC LEADED CHIP CARRIER (PLCC) P/N:PM0248 11 REV.3.3, SEP. 19, 2001 MX27L256 8 x 13.4mm 28-PIN PLASTIC TSOP P/N:PM0248 12 REV.3.3, SEP. 19, 2001 MX27L256 REVISION HISTORY Revision No. Description 3.0 1) Eliminate Interactive Programming Mode. 2) Add 28-TSOP(I) package offering 3) AC driving levels are changed from 2.4V/0.3V to 2.4V/0.4V. 3.1 IPP1 100uA-->10uA 3.2 Cancel Ceramic DIP Package Type 3.3 Remove 28-pin SOP Package Package Information format changed P/N:PM0248 13 Page P1,2,9,11 P1,9 P10~12 Date 6/17/1997 7/17/1997 FEB/29/2000 SEP/19/2001 REV.3.3, SEP. 19, 2001 MX27L256 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 14